Approval sheet
WW10P
±
1%,
±
2%,
±
5%
Low ohm chip resistors ( Power )
Size 1210
*Contents in this sheet are subject to change without prior notice.
Page 1 of 6
ASC_WW10P_V08
Jul.2010
Approval sheet
FEATURE
1. High reliability and stability
2. Reduced size of final equipment
3. Lower assembly costs
4. Higher component and equipment reliability
5. RoHS compliant and Lead free products
APPLICATION
•
•
•
Consumer electrical equipment
Automotive application
EDP, Computer application
Telecom application
•
DESCRIPTION
The resistors are constructed in a high grade ceramic body (aluminum oxide). Internal metal electrodes are
added at each end and connected by a resistive paste that is applied to the top surface of the substrate. The
composition of the paste is adjusted to give the approximate resistance required and the value is trimmed to
nominated value within tolerance which controlled by laser trimming of this resistive layer.
The resistive layer is covered with a protective coat. Finally, the two external end terminations are added. For
ease of soldering the outer layer of these end terminations is Tin (lead free) alloy.
Fig 1. Consctruction of Chip-R
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ASC_WW10P_V08
Jul.2010
Approval sheet
QUICK REFERENCE DATA
Item
Series No.
Size code
Resistance Tolerance
Resistance Range
General Specification
WW10P
1210 ( 3226 )
±
1% ,
±
2%,
±
5%
0.1Ω ~ 0.976Ω ( E96+E24 series)
Ω
Ω
( < 0.1Ω is on special request )
Ω
TCR (ppm/°C)
-55°C ~ +155°C
Max. dissipation at T
amb
=70°C
Max. Operation Voltage (DC or RMS)
Max. overload voltage
Climatic category (IEC 60068)
Basic specification
Note :
1.
2.
≤ ±
200 ppm/°C
°
1/2 W
200V
400V
55/155/56
JIS C 5201-1 : 1998
This is the maximum voltage that may be continuously supplied to the resistor element, see “IEC publication
60115-8”
Max. Operation Voltage : So called RCWV (Rated Continuous Working Voltage) is determined by
RCWV
=
Rated Power
×
Resistance Value
or Max. RCWV listed above, whichever is lower.
3.
Resistance value will be changed by soldering condition and design of soldering pad,please design products in
consideration of this change of resistance value.
DIMENSIONS(unit : mm)
Part No
L
W
Tt
Tb
t
*1 : original 0.45
±
0.20
WW10P
3.10
±
0.10
2.60
±
0.10
0.50
±
0.20
0.50
±
0.20 *1
0.55
±
0.10
MARKING
4-digits marking for 1%, 2% & 5%
Example
RESISTANCE
4-digits marking
0.1Ω
Ω
R100
0.51Ω
Ω
R510
Page 3 of 6
ASC_WW10P_V08
Jul.2010
Approval sheet
FUNCTIONAL DESCRIPTION
Product characterization
Standard values of nominal resistance are taken
from the E96 & E24 series for resistors with a
tolerance of
±1%, ±2%, ±5%.
The values of the
E24/E96 series are in accordance with “IEC
publication 60063”.
Derating
The power that the resistor can dissipate
depends on the operating temperature; see Fig.2
MOUNTING
Due to their rectangular shapes and small
tolerances, Surface Mountable Resistors are
suitable for handling by automatic placement
systems.
Figure 2
Maximum dissipation in percentage of rated power as a
function of the ambient temperature
Chip placement can be on ceramic substrates and printed-circuit boards (PCBs).
Electrical connection to the circuit is by individual soldering condition.
The end terminations guarantee a reliable contact.
SOLDERING CONDITION
The robust construction of chip resistors allows them to
be completely immersed in a solder bath of 260°C for
10 seconds. Therefore, it is possible to mount Surface
Mount Resistors on one side of a PCB and other
discrete components on the reverse (mixed PCBs).
Surface Mount Resistors are tested for solderability at
235°C during 2 seconds. The test condition for no
leaching is 260°C for 30 seconds. Typical examples of
soldering processes that provide reliable joints without
any damage are given in Fig 3.
Fig 3. Infrared soldering profile for Chip Resistors
CATALOGUE NUMBERS
The resistors have a catalogue number starting with .
WW10
Size code
WW10: 1210
P
Type code
P
:
0.5W
R100
Resistance code – 4 digits
R100 = 0.1 OHM
R976 = 0.976 OHM
J
Tolerance
J:
±
5%
G:
±
2%
F:
±
1%
T
Packaging code
T: 7” Reeled taping
L
Termination code
L =
Sn base (lead
free)
Reeled tape packaging : 8mm width paper taping 5000pcs per 7” reel.
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ASC_WW10P_V08
Jul.2010
Approval sheet
TEST AND REQUIREMENTS (JIS C 5201-1 : 1998)
Basic specification : JIS C 5202 / IEC 60115-1
The tests are carried out in accordance with IEC publication 68, "Recommended basic climatic and mechanical
robustness testing procedure for electronic components" and under standard atmospheric conditions according
to IEC 68-1, subclause 5.3, unless otherwise specified.
Temperature: 15ºC to 35ºC.
Relative humidity: 45% to 75%.
Air pressure: 86kPa to 106 kPa (860 mbar to 1060 mbar).
TEST
Temperature Coefficient
of Resistance(T.C.R)
Clause 4.8
PROCEDURE
Natural resistance change per change in degree centigrade.
REQUIREMENT
Refer to
“QUICK REFERENCE DATA”
R
2
−
R
1
×
10
6
R
1
(
t
2
−
t
1
)
(ppm/°C) t
1
: 20°
C+5°
C-1°
C
R
1
: Resistance at reference temperature
R
2
: Resistance at test temperature
Short time overload
(S.T.O.L)
Clause 4.13
Resistance to soldering
heat(R.S.H)
Clause 4.18
Solderability
Clause 4.17
Temperature cycling
Clause 4.19
Load life (endurance)
Clause 4.25
Load life in Humidity
Clause 4.24
Bending strength
Clause 4.33
Adhesion
Clause 4.32
Insulation Resistance
Clause 4.6
Dielectric Withstand
Voltage
Clause 4.7
Un-mounted chips completely immersed for 2±0.5second in good tinning (>95% covered)
a SAC solder bath at 235℃±5℃
no visible damage
30 minutes at -55°C±3°C, 2~3 minutes at 20°
C+5°
C-1° 30
C,
minutes at +155°C±3°C, 2~3 minutes at 20°
C+5°
C-1° total
C,
5 continuous cycles
no visible damage
∆R/R
max.
±(1%+0.005Ω)
Permanent resistance change after a 5second application of
∆R/R
max.
±(2%+0.005Ω)
a voltage 2.5 times RCWV or the maximum overload voltage
specified in the above list, whichever is less.
Un-mounted chips completely immersed for 10±1second in a no visible damage
SAC solder bath at 260℃±5ºC
∆
R/R max.
±(1%+0.005Ω)
1000 +48/-0 hours, loaded with RCWV or Vmax in chamber
∆R/R
max.
±
(5%+0.005Ω)
controller 70±2ºC, 1.5 hours on and 0.5 hours off
1000 +48/-0 hours, loaded with RCWV or Vmax in humidity
∆R/R
max.
±
(5%+0.005Ω)
chamber controller at 40°
C±2° and 90~95% relative
C
humidity, 1.5hours on and 0.5 hours off
Resistors mounted on a 90mm glass epoxy resin PCB(FR4);
∆R/R
max.
±(1%+0.005Ω)
bending : 3 mm, once for 10 seconds
Pressurizing force: 5N, Test time: 10±1sec.
Apply the maximum overload voltage (DC) for 1minutes
Apply the maximum overload voltage (AC) for 1 minutes
No remarkable damage or
removal of the terminations
R≧10GΩ
No breakdown or flashover
Page 5 of 6
ASC_WW10P_V08
Jul.2010
Power technology
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