PolySurg ESD Suppressors
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Features & Benefits
• Ultra-low capacitance (0.05pF typ.) ideal for high
speed data applications
• Provides ESD protection with fast response time
(<1ns) allowing equipment to pass IEC 61000-4-2 level 4 test
• Single-line, bi-directional device for placement flexibility
• Low profile 0402/1005 design for board space savings
• Low leakage current (<0.1nA typ.) reduces power consumption
RoHS
2002/95/EC
0402ESDA-MLP
MLP Series ESD Suppressor
Applications
• Computers & Peripherals
• HDTV Equipment
• DVD Players
• A/V Equipment
• Satellite Radio
• Cell Phones
• PDA’s
• High Speed Data Ports
• USB 2.0
• IEEE 1394
• HDMI
• DVI
• High Speed Ethernet
• Infiniband
®
• Digital Still Cameras
• Digital Camcorders
• Set Top Boxes
• DSL Modems
• MP3 / Multimedia Players
• External Storage
Description
Ordering Information
Catalog Number
0402ESDA-MLP7
The PolySurg™ 0402ESDA-MLP ESD Suppressors
protect valuable high-speed data circuits from ESD
its ultra-low (0.05pF typical) capacitance.
damage without distorting data signals as a result of
0402ESDA-MLP8
Packaging
10,000 pieces in paper tape on
7" (178mm) reel
2,500 pieces in paper tape on
7" (178mm) reel
Product Dimensions: mm [inches]
Solder Pad Recommendation:
mm [inches]
2.20
0.70
0.40
Design Considerations
The location in the circuit for the MLP series has to be carefully determined. For better performance, the device should be placed
as close to the signal input as possible and ahead of any other component. Due to the high current associated with an ESD
event, it is recommended to use a “0-stub” pad design (pad directly on the signal/data line and second pad directly on common
ground).
BU-SB09615
PolySurg ESD Suppressors
0402ESDA-MLP
MLP Series ESD Suppressor
Electrical Characteristics
Characteristic
Rated Voltage
Clamping Voltage
Trigger Voltage
2
1
Value
30VDC maximum
35V typical
300V typical
Capacitance (@1MHz)
Attenuation Change (0-6GHz)
Leakage Current (@12VDC)
ESD Capability
IEC61000-4-2 Direct Discharge
IEC61000-4-2 Air Discharge
ESD Pulse Withstand
1
Environmental Specifications:
• Load Humidity: 12VDC per EIA/IS-772 Para. 4.4.2, +85°C, 85% RH for 1000 hours
• Thermal Shock: EIA/IS-722 Para 4.6, Air to Air -55°C to +125°C, 5 cycles
• Moisture Resistance Test: MIL-STD-202G Method 106G, 10 cycles
• Mechanical Shock: EIA/IS-722 Para. 4.9
• Vibration: EIA/IS-722 Para. 4.10
• Resistance to Solvent: EIA/IS-722 Para. 4.11
• Operating & Storage Temperature Range: -55°C to +125°C
Soldering Recommendations
• Compatible with lead and lead-free solder reflow processes
• Peak reflow temperatures and durations:
• IR Reflow = 260°C max for 10 sec. max.
• Wave Solder = 260°C max. for 10 sec. max.
• Recommended IR Reflow Profile:
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0.05pF typ., 0.15pF max.
-0.2dB typical
<0.1nA typical
8kV typical
15kV typical
>1000 typical
Notes:
1. Per IEC61000-4-2, Level 4 waveform (8kV direct, 30A)
measured 30ns after initiation of pulse.
2. Trigger measurement made using Transmission Line Pulse
(TLP) method.
3. Minor shifting in characteristics may be observed over
multiple ESD pulses at very rapid rate.
Visit us on the web at:
Tel: 1-561-998-4100
North America
www.cooperbussmann.com
Cooper Electronic
Fax: 1-561-241-6640
0402-MLP
3/07
© Cooper Electronic
Technologies 2007
Technologies
1225 Broken Sound Parkway
NW
Suite F
Boca Raton, FL 33487-
3533
Toll Free: 1-888-414-
2645
Cooper Bussmann
P.O. Box 14460
St. Louis, MO 63178-
4460
Europe
Tel: 1-636-394-2877
Cooper Electronic
Fax: 1-800-544-2570
Technologies
Cooper (UK) Limited
Burton-on-the-Wolds
Leicestershire • LE12
5TH UK
Tel: +44 (0) 1509 882
737
Fax: +44 (0) 1509 882
786
Cooper Electronic
Technologies
Avda. Santa Eulalia, 290
BU-SB09615
Microcontroller MCU
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