CC1A-T1A
AT Crystal 8 MHz – 30 MHz
DIMENSIONS
Package:
Recommended Solder Pad:
8,0
1,2
2,7
1,2
2,3
4,0
2,3
3,7
max.1,75
100% leadfree, RoHS - compliant
Small SMT ceramic package
Package height 1.75 mm
Fundamental mode frequencies
SMD-package in Tape and Reel
Ind. and Ext. temperature ranges
High stability
Low aging
High shock and vibration resistance
DESCRIPTION:
All dimensions in mm typical
This SMD ceramic package has been specially designed for small
industrial, telecom and electronic applications. All frequencies are
generated in fundamental mode.
The crystals are supplied in special trays (100 crystals per tray).
For pick-and-place equipment, the parts are available in 16 mm tapes:
7” (178 mm) reel with 1’000 crystals
10” (254 mm) reel with 2’000 crystals
13” (330 mm) reel with 4’000 crystals
ELECTRICAL CHARACTERISTICS
AT 25
o
C:
Frequency Range
Load capacitance
Frequency tolerance at 25°C
Frequency versus temperature
–40°C to +85°C
Drive level max.
Insulation resistance min.
Aging
fi
rst year max.
1)
2)
F
L
C
L
ΔF/F
ΔF/F
0
P
R
i
ΔF/F
8–30
20.0
+/-50
+/-50
500
500
+/-3
4,2
MHz
pF
ppm
ppm
μW
MΩ
ppm
Frequency Example
Series resistance typ./max.
Motional capacitance typ.
Static capacitance typ.
3)
F
L
R
S
C
1
C
0
10.000
35 / 75
5.2
2.2
16.384
20 / 50
7.2
2.8
24.000
20 / 50
11.5
3.6
MHz
Ω
fF
pF
1) Other load capacitances on request.
2) Tighter and wider frequency tolerances on request.
3) Values for other frequencies consult factory.
Version 4.1/07.2007
STANDARD FREQUENCIES:
8.0000
14.3181
10.0000
16.0000
Frequency
MHz
10.1506
16.3840
11.0592
20.0000
12.0000
24.0000
Other frequencies between
8 MHz and 30 MHz on request
ENVIRONMENTAL
CHARACTERISTICS:
Storage temp. range
Industrial operating temp. range
Extended operating temp. range
Shock resistance
Vibration resistance
ΔF/F
ΔF/F
Conditions
–55 to +125°C
–40 to +85°C
–55 to +125°C
5000 g, 0.3 ms, ½ sine
20 g / 10–2000 Hz
Max.
Dev.
+/-5 ppm
+/-5 ppm
TERMINATIONS AND
PROCESSING:
Type
CC1A-T1A
Termination
For SMD mounting
Au
fl
ashed pads
For SMD mounting
Sn/Ag/Cu plated
Processing
Reflow soldering
260°C / 20 s max.
Reflow soldering
260°C / 20 s max.
CC1A-T3A
PART NUMBER/
ORDERING INFORMATION
EXAMPLE:
Crystal package
C
= Crystal in ceramic
package
Package lid
C
= Ceramic lid
CC 1 A-T 1 A
24.000 MHz 20.0 pF +/-50 ppm
Frequency
tolerance
Load capacitance C
L
Frequency F
L
Package pad form
A
= Pads on both ends
Pad plating
1
= Au
fl
ashed pads
3
= Sn/Ag/Cu plated
Package type
T
= For SMD mounting
07.07
Package size
1
= 8.0 x 3.7 x 1.75 mm
Blank
A
= AT
All specifications subject to change without notice.
Micro Crystal
Div. of ETA SA
Mühlestrasse 14
CH-2540 Grenchen
Switzerland
Tel.
+41 32 655 82 82
Fax
+41 32 655 82 83
sales@microcrystal.ch
www.microcrystal.com
Version 4.1/07.2007
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EEWORLD
