CALIFORNIA MICRO DEVICES
CSPST
Chip Scale Series Termination Array
Features
• 8 or 16 integrated high frequency series
terminations
• Ultra small footprint Chip Scale Package
• Ceramic substrate
• 0.35mm Eutectic Solder Bumps, 0.65mm pitch
Applications
• Series resistive bus termination
• Isolated resistor array
Product Description
The CSPST is a high performance Integrated Passive
Device (IPD) which provides series terminations suitable
for use in high speed bus applications. Eight (8) or
sixteen (16) series termination versions are provided.
These resistors provide excellent high frequency
performance in excess of 3GHz and are manufactured to
an absolute tolerance as low as ±1%. The Chip Scale
Package provides an ultra small footprint for this IPD
and provides minimal parasitics compared to conven-
tional packaging. Typical bump inductance is less than
25pH. The large solder bumps and ceramic substrate
allow for standard attachment to laminate printed circuit
boards without the use of underfill.
SCHEMATIC DIAGRAMS
D
R1
R1
R1
R1
D
R1
R1
R1
R1
R1
R1
R1
R1
C
C
B
R1
A
1
2
3
4
R1
R1
R1
B
R1
A
1
2
3
4
5
6
7
8
R1
R1
R1
R1
R1
R1
R1
CSPST08
CSPST16
S TA N D A R D VA L U E S
Re s i s t o r Va l u e
Ab s o l u t e To l e r a n c e R
TCR of Resi st or s
Powe r Ra t i n g / Re s i s t o r
Op e r a t i n g Te mp e r a t u r e Ra n g e
R1 = 22
Ω,
33
Ω,
39
Ω, 4 7 Ω,
51
Ω,
56
Ω,
± 1 %, ± 5 %
±100ppm
1 0 0 mW
–40°C to 85°C
© 2000 California Micro Devices Corp. All rights reserved.
11/10/2000
C1300700
215 Topaz Street, Milpitas, California 95035
Tel: (408) 263-3214
Fax: (408) 263-7846
www.calmicro.com
1
CALIFORNIA MICRO DEVICES
CSPST
Package Diagram (Bumps Up View)
2.3968mmmm
0.65
mm
0.2234mm
D
C
B
A
0.35mm
Dia.
Bumps
1
2
3
4
0.381mm
0.643mm
0.65
mm
2.3968mm
CSPST08
4.9968mm
0.2234mm
0.65
mm
D
C
B
A
0.35mm
Dia.
Bumps
1
2
3
4
5
6
7
8
0.381mm
0.643mm
0.65
mm
2.3968mm
CSPST16
P R I N T E D C I R C U I T B OA R D R E C O M M E N D AT I O N S
Pad Size on PCB
Pad Shape
Pad Definition
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening
Solder Flux Ratio
Solder Paste
Bond Trace Finish
0.300mm
Round
Non Solder Mask Defined Pads (NSMD)
0.350mm
0.152mm
0.360mm (sq.)
50/50
No Clean
OSP (Entek Cu Plus 106A)
©2000 California Micro Devices Corp. All rights reserved.
2
215 Topaz Street, Milpitas, California 95035
Tel: (408) 263-3214
Fax: (408) 263-7846
www.calmicro.com
11/10/2000
CALIFORNIA MICRO DEVICES
CSPST
Typical PCB Routing Diagram (Bumps Down View)
1
8
A
B
C
D
Typical Solder Reflow Thermal Profile (No Clean Flux)
250
EXH
225
200
PH
Z2
Z3
Z4
Z5
RF
CD
EXH
Temperature (
o
C)
175
150
125
100
75
50
25
0
48
97
145
194
Time (s)
242
290
339
387
435
© 2000 California Micro Devices Corp. All rights reserved.
11/10/2000
215 Topaz Street, Milpitas, California 95035
Tel: (408) 263-3214
Fax: (408) 263-7846
www.calmicro.com
3
CALIFORNIA MICRO DEVICES
CSPST
S TA N D A R D PA R T O R D E R I N G I N F O R M AT I O N
Package
Style
Chip Scale
Chip Scale
Chip Scale
Chip Scale
Chip Scale
Chip Scale
Chip Scale
Chip Scale
Chip Scale
Chip Scale
Chip Scale
Chip Scale
Chip Scale
Chip Scale
Chip Scale
Chip Scale
Chip Scale
Chip Scale
Chip Scale
Chip Scale
Chip Scale
Chip Scale
Chip Scale
Chip Scale
Terminations
8
8
8
8
8
8
8
8
8
8
8
8
16
16
16
16
16
16
16
16
16
16
16
16
Tape & Reel
CSPST08-220F
CSPST08-220J
CSPST08-330F
CSPST08-330J
CSPST08-390F
CSPST08-390J
CSPST08-470F
CSPST08-470J
CSPST08-510F
CSPST08-510J
CSPST08-560F
CSPST08-560J
CSPST16-220F
CSPST16-220J
CSPST16-330F
CSPST16-330J
CSPST16-390F
CSPST16-390J
CSPST16-470F
CSPST16-470J
CSPST16-510F
CSPST16-510J
CSPST16-560F
CSPST16-560J
Ordering Part Number
Part Marking
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
PA C K AG E
Part Series
Terminations
N O N - S TA N D A R D PA R T O R D E R I N G I N F O R M AT I O N
Value Code: R1 (XXX)
Tolerance
Example (CSPST)
CSPST
CSPST
(8)
8
16
(201)
First 2 digits are significant value.
Third digit represents number of
zeros to follow
PART NUMBER KEY
CSP
ST
YY
XXX
T
(J)
F = ±1%
J = ±5%
PACKAGE TYPE
CSP = Chip Scale
Package
APPLICATION
Series
Termination
Number of
Terminations
08 = 8
16 = 16
Resistor
Value Code
R1 Value
First 2 digits
are significant
value. 3rd digit
represents number
of zeros
Tolerance
F = ±1%
J = ±5%
©2000 California Micro Devices Corp. All rights reserved.
4
215 Topaz Street, Milpitas, California 95035
Tel: (408) 263-3214
Fax: (408) 263-7846
www.calmicro.com
11/10/2000
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