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LPD-SOM-CLIP1-THPAD

Description
thermal pad with adhesive back
CategoryModule/solution   
File Size1MB,42 Pages
ManufacturerLogic PD
Websitehttps://www.logicpd.com
Environmental Compliance  
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LPD-SOM-CLIP1-THPAD Overview

thermal pad with adhesive back

OMAP-L138 SOM-M1 Hardware Specification
Hardware Documentation
Logic PD // Products
Published: August 2009
Last revised: November 2010
This document contains valuable proprietary and confidential information and the attached file contains source code, ideas, and
techniques that are owned by Logic Product Development Company (collectively “Logic PD’s Proprietary Information”). Logic PD’s
Proprietary Information may not be used by or disclosed to any third party except under written license from Logic Product
Development Company.
Logic Product Development Company makes no representation or warranties of any nature or kind regarding Logic PD’s Proprietary
Information or any products offered by Logic Product Development Company. Logic PD’s Proprietary Information is disclosed herein
pursuant and subject to the terms and conditions of a duly executed license or agreement to purchase or lease equipment. The only
warranties made by Logic Product Development Company, if any, with respect to any products described in this document are set
forth in such license or agreement. Logic Product Development Company shall have no liability of any kind, express or implied,
arising out of the use of the Information in this document, including direct, indirect, special or consequential damages.
Logic Product Development Company may have patents, patent applications, trademarks, copyrights, trade secrets, or other
intellectual property rights pertaining to Logic PD’s Proprietary Information and products described in this document (collectively
“Logic PD’s Intellectual Property”). Except as expressly provided in any written license or agreement from Logic Product
Development Company, this document and the information contained therein does not create any license to Logic PD’s Intellectual
Property.
The Information contained herein is subject to change without notice. Revisions may be issued regarding changes and/or additions.
© Copyright 2010, Logic Product Development Company. All Rights Reserved.
PN 1013755 Rev 5
Logic Product Development Company, All Rights Reserved
PRELIMINARY DOCUMENT—SUBJECT TO CHANGE
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