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LM3S1621-IBZ80-C3

Description
ARM Microcontrollers - MCU Stellaris MCU
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size6MB,948 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
Environmental Compliance
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LM3S1621-IBZ80-C3 Overview

ARM Microcontrollers - MCU Stellaris MCU

LM3S1621-IBZ80-C3 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerTexas Instruments
Parts packaging codeBGA
package instructionLFBGA, BGA108,12X12,32
Contacts108
Reach Compliance Codecompliant
Has ADCYES
Address bus width
bit size32
maximum clock frequency16 MHz
DAC channelNO
DMA channelYES
External data bus width
JESD-30 codeS-PBGA-B108
length10 mm
Number of I/O lines67
Number of terminals108
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
PWM channelYES
Package body materialPLASTIC/EPOXY
encapsulated codeLFBGA
Encapsulate equivalent codeBGA108,12X12,32
Package shapeSQUARE
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply1.2,3.3 V
Certification statusNot Qualified
RAM (bytes)32768
rom(word)131072
ROM programmabilityFLASH
Maximum seat height1.5 mm
speed80 MHz
Maximum supply voltage3.6 V
Minimum supply voltage3 V
Nominal supply voltage3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width10 mm
uPs/uCs/peripheral integrated circuit typeMICROCONTROLLER, RISC

LM3S1621-IBZ80-C3 Related Products

LM3S1621-IBZ80-C3 LM3S1621-IBZ80-C3T LM3S1621-IQC80-C3T LM3S1621-IQC80-C3
Description ARM Microcontrollers - MCU Stellaris MCU ARM Microcontrollers - MCU Stellaris MCU ARM Microcontrollers - MCU Stellaris MCU ARM Microcontrollers - MCU Stellaris MCU
Is it lead-free? Lead free Lead free Lead free Lead free
Is it Rohs certified? conform to conform to conform to conform to
Maker Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Parts packaging code BGA BGA QFP QFP
package instruction LFBGA, BGA108,12X12,32 LFBGA, BGA108,12X12,32 LFQFP, QFP100,.63SQ,20 LFQFP, QFP100,.63SQ,20
Contacts 108 108 100 100
Reach Compliance Code compliant compliant compliant compliant
Has ADC YES YES YES YES
bit size 32 32 32 32
maximum clock frequency 16 MHz 16 MHz 16 MHz 16 MHz
DAC channel NO NO NO NO
DMA channel YES YES YES YES
JESD-30 code S-PBGA-B108 S-PBGA-B108 S-PQFP-G100 S-PQFP-G100
length 10 mm 10 mm 14 mm 14 mm
Number of I/O lines 67 67 67 67
Number of terminals 108 108 100 100
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C
PWM channel YES YES YES YES
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LFBGA LFBGA LFQFP LFQFP
Encapsulate equivalent code BGA108,12X12,32 BGA108,12X12,32 QFP100,.63SQ,20 QFP100,.63SQ,20
Package shape SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY FLATPACK FLATPACK
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED 260 260
power supply 1.2,3.3 V 1.2,3.3 V 1.2,3.3 V 1.2,3.3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
RAM (bytes) 32768 32768 32768 32768
rom(word) 131072 131072 131072 131072
ROM programmability FLASH FLASH FLASH FLASH
Maximum seat height 1.5 mm 1.5 mm 1.6 mm 1.6 mm
speed 80 MHz 80 MHz 80 MHz 80 MHz
Maximum supply voltage 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage 3 V 3 V 3 V 3 V
Nominal supply voltage 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES YES YES
technology CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form BALL BALL GULL WING GULL WING
Terminal pitch 0.8 mm 0.8 mm 0.5 mm 0.5 mm
Terminal location BOTTOM BOTTOM QUAD QUAD
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 10 mm 10 mm 14 mm 14 mm
uPs/uCs/peripheral integrated circuit type MICROCONTROLLER, RISC MICROCONTROLLER, RISC MICROCONTROLLER, RISC MICROCONTROLLER, RISC

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