IC fpga 250 I/O 676fcbga
Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Maker | XILINX |
Parts packaging code | BGA |
package instruction | BGA, BGA676,26X26,40 |
Contacts | 676 |
Reach Compliance Code | compliant |
ECCN code | 3A991.D |
Factory Lead Time | 12 weeks |
Is Samacsys | N |
maximum clock frequency | 1818 MHz |
Combined latency of CLB-Max | 0.74 ns |
JESD-30 code | S-PBGA-B676 |
JESD-609 code | e1 |
length | 27 mm |
Humidity sensitivity level | 4 |
Configurable number of logic blocks | 12675 |
Number of entries | 400 |
Number of logical units | 162240 |
Output times | 400 |
Number of terminals | 676 |
organize | 12675 CLBS |
Package body material | PLASTIC/EPOXY |
encapsulated code | BGA |
Encapsulate equivalent code | BGA676,26X26,40 |
Package shape | SQUARE |
Package form | GRID ARRAY |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 1,1.8,3.3 V |
Programmable logic type | FIELD PROGRAMMABLE GATE ARRAY |
Certification status | Not Qualified |
Maximum seat height | 2.54 mm |
Maximum supply voltage | 1.03 V |
Minimum supply voltage | 0.97 V |
Nominal supply voltage | 1 V |
surface mount | YES |
technology | CMOS |
Terminal surface | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
Terminal form | BALL |
Terminal pitch | 1 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 27 mm |
Base Number Matches | 1 |