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CQA20103R-5%50PPM/KNS

Description
Fixed Resistor, Metal Glaze/thick Film, 0.5W, 3ohm, 300V, -5% +/-Tol, 50ppm/Cel, Surface Mount, 2010, CHIP
File Size181KB,2 Pages
ManufacturerMicrotech GmbH Electronic
Environmental Compliance
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CQA20103R-5%50PPM/KNS Overview

Fixed Resistor, Metal Glaze/thick Film, 0.5W, 3ohm, 300V, -5% +/-Tol, 50ppm/Cel, Surface Mount, 2010, CHIP

CQA20103R-5%50PPM/KNS Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Objectid998366466
package instructionCHIP
Reach Compliance Codecompliant
Country Of OriginGermany
ECCN codeEAR99
YTEOL6.6
Other featuresANTI-SULFUR
structureRectangular
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature155 °C
Minimum operating temperature-55 °C
Package height0.75 mm
Package length5.2 mm
Package formSMT
Package width2.7 mm
method of packingBULK
Rated power dissipation(P)0.5 W
Rated temperature70 °C
GuidelineTS 16949
resistance3 Ω
Resistor typeFIXED RESISTOR
size code2010
surface mountYES
technologyMETAL GLAZE/THICK FILM
Temperature Coefficient50 ppm/°C
Terminal surfaceTIN OVER NICKEL
Terminal shapeWRAPAROUND
Tolerance-5%
Operating Voltage300 V

CQA20103R-5%50PPM/KNS Preview

microtech GmbH electronic Teltow
Chip resistors - Made in Germany
Trimmable series with enhanced visual recognition
Type: CQA
Sizes: 0402, 0603, 0805, 1206, 1210, 1218, 2010, 2512
Characteristics:
Chip resistors in thick film technology
Resistance area trimmable after manufacturing, clearly seperated for detecting by visual systems
Maximum trimming factor=1,3; higher factors by reducing of U
max
or P
70
available
Resistance area coated with glass passivation
RoHS-conform
Customer specific barcodes available - also in 2D
All sizes can be manufactured with the following contact variants
Electroplated pure tin
Contact with low rest permeability -N, suitable only for reflow soldering method
(The recommended storage time should not exceed 1 year after delivery)
Epoxy bondable contact –K
Special corrosive gas resistant contact –S, Sulfur resistance verified according to ASTM B 809
Size
L
Length
Min
Max
ISO/TS 16949:2009
ISO 14001:2009
Dimensions (in mm):
W
Width
Min
Max
H
Depth
Min
Max
t
Contact
back
Min
Max
T
Contact
front
Min
Max
0402
0603
0805
1206
1210
1218
2010
2512
0,95
1,50
1,85
2,90
3,00
3,00
4,80
6,10
1,10
1,70
2,15
3,35
3,30
3,30
5,20
6,50
0,45
0,75
1,10
1,45
2,35
4,50
2,30
3,00
0,60
0,95
1,40
1,75
2,65
4,80
2,70
3,30
0,25
0,35
0,35
0,35
0,50
0,50
0,50
0,50
0,40
0,55
0,65
0,65
0,75
0,75
0,75
0,75
0,10
0,10
0,15
0,25
0,35
0,35
0,35
0,35
0,35
0,50
0,60
0,75
0,85
0,85
0,85
0,85
0,05
0,10
0,15
0,15
0,25
0,25
0,25
0,25
0,35
0,50
0,60
0,75
0,85
0,85
0,85
0,85
T
W
L
Packaging units:
Reel
Ø
180 mm
330 mm
Samples on request
5 T pcs.
10 T pcs. for size 0402
10 T pcs.
20 T pcs.
8 T pcs.
16 T pcs.
Card tape
acc. EN 60286-3
4 T pcs.
Blister tape
Ordering information:
CQA
Type
CQA
-N
Contact
Standard (without
add.)
-N (non magnetic)
-K (epoxy bondable)
-S (corrosive gas
resistant)
0805
Size
0402
.
10R
-30%
50ppm/K
±
TCR
50
100
N
Marking
P
Packaging
10
(optional)
R-
±
Tolerance
Value
1R
to
100R
Customer
specific
pcs. / Reel
(T pcs.)
Depends
on size
and
packaging
unit
to
.
N- only without P- Card tape
B- Blister tape
S- Bulk
2512
Page 36
Revision: 25-Jan-18
Catalog microtech GmbH electronic
microtech GmbH electronic Teltow
ISO/TS 16949:2009
ISO 14001:2009
Chip resistors - Made in Germany
Trimmable series with enhanced visual recognition
Type: CQA
Sizes: 0402, 0603, 0805, 1206, 1210, 1218, 2010, 2512
Technical data – depending on size:
Size
Nominal
voltage
U
max
(V)
0402
0603
0805
1206
1210
1218
2010
2512
50
75
150
200
200
200
300
500
Load
P
70
(W)
0,063
0,100
0,125
0,250
0,500
1,000
0,500
1,000
1R – 100R
1R – 100R
1R – 100R
1R – 100R
1R – 100R
1R – 100R
1R – 100R
1R – 100R
R-Range
R-Tolerance*
(± %)
-5 / -10 / -20 / -30
-5 / -10 / -20 / -30
-5 / -10 / -20 / -30
-5 / -10 / -20 / -30
-5 / -10 / -20 / -30
-5 / -10 / -20 / -30
-5 / -10 / -20 / -30
-5 / -10 / -20 / -30
TCR
(± ppm/K)
50 / 100
50 / 100
50 / 100
50 / 100
50 / 100
50 / 100
50 / 100
50 / 100
P
x
x
x
x
x
x
x
x
Packaging
B
S
x
x
x
x
x
x
x
x
*optional with tolerances of ±5%, ±10%, ±20% or ±30%
Dimensions of trimming area (in mm):
Size
Min
L
trim
(mm)
Length
Max
Min
W
trim
(mm)
Width
Max
L
trim
0402
0603
0805
1206
1210
1218
2010
2512
0,30
0,50
0,90
1,80
1,40
1,40
2,90
4,20
0,50
0,90
1,30
2,20
1,80
1,80
3,60
5,00
0,30
0,35
0,70
1,00
1,70
3,60
1,80
1,90
0,40
0,55
0,90
1,20
1,90
3,80
2,00
2,10
W
trim
Technical data - general:
Technical data
Operating temperature range
Climatic category acc. EN 60068
Solderability acc. EN 60068-2-58
Soldering heat resistance acc. EN 60068-2-58
Long time stability (before trimming)
Storage 155°C / 1000h
Endurance P
70
/ 70°C / 1000h
Damp heat, steady state (56d / 40°C / 96%)
±( 1,0% + 0,05R )
±( 0,5% + 0,05R )
±( 1,0% + 0,05R )
-55°C… +155°C
55 / 155 / 56
245°C 3s
±( 0,5% + 0,05R ) at 260°C 10s
Data, unless specified, acc. EN 140401-802.
Catalog microtech GmbH electronic
Revision: 25-Jan-18
Page 37
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