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72V36100L7.5PF

Description
FIFO, 64KX36, 5ns, Synchronous, CMOS, PQFP128, PLASTIC, TQFP-128
Categorystorage    storage   
File Size469KB,47 Pages
ManufacturerIDT (Integrated Device Technology)
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72V36100L7.5PF Overview

FIFO, 64KX36, 5ns, Synchronous, CMOS, PQFP128, PLASTIC, TQFP-128

72V36100L7.5PF Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerIDT (Integrated Device Technology)
package instructionPLASTIC, TQFP-128
Reach Compliance Codenot_compliant
ECCN codeEAR99
Maximum access time5 ns
Other featuresRETRANSMIT; AUTO POWER DOWN; ASYNCHRONOUS MODE IS ALSO POSSIBLE
Maximum clock frequency (fCLK)133.3 MHz
JESD-30 codeR-PQFP-G128
JESD-609 codee0
memory density2359296 bit
Memory IC TypeOTHER FIFO
memory width36
Humidity sensitivity level3
Number of functions1
Number of terminals128
word count65536 words
character code64000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize64KX36
ExportableYES
Package body materialPLASTIC/EPOXY
encapsulated codeQFP
Encapsulate equivalent codeQFP128,.63X.87,20
Package shapeRECTANGULAR
Package formFLATPACK
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)240
power supply3.3 V
Certification statusNot Qualified
Maximum standby current0.015 A
Maximum slew rate0.04 mA
Maximum supply voltage (Vsup)3.45 V
Minimum supply voltage (Vsup)3.15 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn85Pb15)
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationQUAD
Maximum time at peak reflow temperature20
Base Number Matches1
3.3 VOLT HIGH-DENSITY SUPERSYNC II™
36-BIT FIFO
65,536 x 36
131,072 x 36
IDT72V36100
IDT72V36110
FEATURES:
Choose among the following memory organizations:
IDT72V36100
65,536 x 36
IDT72V36110
131,072 x 36
Higher density, 2Meg and 4Meg SuperSync II FIFOs
Up to 166 MHz Operation of the Clocks
User selectable Asynchronous read and/or write ports (PBGA Only)
User selectable input and output port bus-sizing
- x36 in to x36 out
- x36 in to x18 out
- x36 in to x9 out
- x18 in to x36 out
- x9 in to x36 out
Big-Endian/Little-Endian user selectable byte representation
5V input tolerant
Fixed, low first word latency
Zero latency retransmit
Auto power down minimizes standby power consumption
Master Reset clears entire FIFO
Partial Reset clears data, but retains programmable settings
Empty, Full and Half-Full flags signal FIFO status
Programmable Almost-Empty and Almost-Full flags, each flag can
default to one of eight preselected offsets
Selectable synchronous/asynchronous timing modes for Almost-
Empty and Almost-Full flags
Program programmable flags by either serial or parallel means
Select IDT Standard timing (using
EF
and
FF
flags) or First Word
Fall Through timing (using
OR
and
IR
flags)
Output enable puts data outputs into high impedance state
Easily expandable in depth and width
JTAG port, provided for Boundary Scan function (PBGA Only)
Independent Read and Write Clocks (permit reading and writing
simultaneously)
Available in a 128-pin Thin Quad Flat Pack (TQFP) or a 144-pin Plastic
Ball Grid Array (PBGA) (with additional features)
Pin compatible to the SuperSync II (IDT72V3640/72V3650/72V3660/
72V3670/72V3680/72V3690) family
High-performance submicron CMOS technology
Industrial temperature range (–40°C to +85°C) is available
°
°
FUNCTIONAL BLOCK DIAGRAM
*Available on the PBGA package only.
D
0
-D
n
(x36, x18 or x9)
WEN
WCLK/WR
LD SEN
*
INPUT REGISTER
OFFSET REGISTER
FF/IR
PAF
EF/OR
PAE
HF
FWFT/SI
PFM
FSEL0
FSEL1
*
ASYW
WRITE CONTROL
LOGIC
RAM ARRAY
65,536 x 36
131,072 x 36
WRITE POINTER
FLAG
LOGIC
READ POINTER
BE
IP
BM
IW
OW
MRS
PRS
CONTROL
LOGIC
BUS
CONFIGURATION
RESET
LOGIC
OUTPUT REGISTER
READ
CONTROL
LOGIC
RT
RM
ASYR
*
RCLK/RD
*
*
**
*
TCK
TRST
TMS
TDI
TDO
JTAG CONTROL
(BOUNDARY
SCAN)
*
OE
Q
0
-Q
n
(x36, x18 or x9)
REN
*
6117 drw01
IDT and the IDT logo are a registered trademarks of Integrated Device Technology, Inc. The SuperSync II FIFO is a trademark of Integrated Device Technology, Inc.
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
1
2003 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice.
JULY 2003
DSC-6117/8

72V36100L7.5PF Related Products

72V36100L7.5PF IDT72V36100L7.5BB IDT72V36110L7.5BB 72V36100L7.5BB 72V36110L7.5PF 72V36110L7.5BB
Description FIFO, 64KX36, 5ns, Synchronous, CMOS, PQFP128, PLASTIC, TQFP-128 FIFO, 64KX36, 10ns, Synchronous/Asynchronous, CMOS, PBGA144 FIFO, 128KX36, 10ns, Synchronous/Asynchronous, CMOS, PBGA144 FIFO, 64KX36, 10ns, Synchronous/Asynchronous, CMOS, PBGA144 FIFO, 128KX36, 5ns, Synchronous, CMOS, PQFP128, PLASTIC, TQFP-128 FIFO, 128KX36, 10ns, Synchronous/Asynchronous, CMOS, PBGA144
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible
Reach Compliance Code not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant
Maximum access time 5 ns 10 ns 10 ns 10 ns 5 ns 10 ns
Maximum clock frequency (fCLK) 133.3 MHz 83 MHz 83 MHz 83 MHz 133.3 MHz 83 MHz
JESD-30 code R-PQFP-G128 S-PBGA-B144 S-PBGA-B144 S-PBGA-B144 R-PQFP-G128 S-PBGA-B144
JESD-609 code e0 e0 e0 e0 e0 e0
memory density 2359296 bit 2359296 bit 4718592 bit 2359296 bit 4718592 bit 4718592 bit
Memory IC Type OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO
memory width 36 36 36 36 36 36
Humidity sensitivity level 3 3 3 3 3 3
Number of terminals 128 144 144 144 128 144
word count 65536 words 65536 words 131072 words 65536 words 131072 words 131072 words
character code 64000 64000 128000 64000 128000 128000
Operating mode SYNCHRONOUS SYNCHRONOUS/ASYNCHRONOUS SYNCHRONOUS/ASYNCHRONOUS SYNCHRONOUS/ASYNCHRONOUS SYNCHRONOUS SYNCHRONOUS/ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize 64KX36 64KX36 128KX36 64KX36 128KX36 128KX36
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code QFP BGA BGA BGA QFP BGA
Encapsulate equivalent code QFP128,.63X.87,20 BGA144,12X12,40 BGA144,12X12,40 BGA144,12X12,40 QFP128,.63X.87,20 BGA144,12X12,40
Package shape RECTANGULAR SQUARE SQUARE SQUARE RECTANGULAR SQUARE
Package form FLATPACK GRID ARRAY GRID ARRAY GRID ARRAY FLATPACK GRID ARRAY
power supply 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum standby current 0.015 A 0.015 A 0.015 A 0.015 A 0.015 A 0.015 A
Maximum slew rate 0.04 mA 0.04 mA 0.04 mA 0.04 mA 0.04 mA 0.04 mA
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn85Pb15) Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37) Tin/Lead (Sn85Pb15) Tin/Lead (Sn63Pb37)
Terminal form GULL WING BALL BALL BALL GULL WING BALL
Terminal pitch 0.5 mm 1 mm 1 mm 1 mm 0.5 mm 1 mm
Terminal location QUAD BOTTOM BOTTOM BOTTOM QUAD BOTTOM
Maker IDT (Integrated Device Technology) - IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)

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