SpecNo.JENF243J-0003D-01
Reference Only
P1/8
CHIP NOISE FILTER NFZ32BW□□□HN11L
1. Scope
REFERENCE SPECIFICATION
This reference specification applies to NFZ32BW_HN11L Series, Chip Noise Filter.
2. Part Numbering
(ex)
NF
Z
32
BW
1R0
H
N
1
1
L
Product ID Structure Dimension Features Impedance Performance Category Numbers Other Packaging
(L×W)
of Circuit
L:Taping
3. Rating
・Operating
Temperature Range.
(Ambient temperature; Self-temperature rise is not included)
(Product temperature; Self- temperature rise is included)
・Storage
Temperature Range.
-40 to +125°C
Customer
Part Number
MURATA
Part Number
Impedance
at 1MHz
(Ω)
Tolerance
-40 to +105°C
-40 to +125°C
DC Resistance
(Ω)
Tolerance
∗1
Rated Current(mA)
∗2
Ambient
temperature
85℃
∗3
Ambient
temperature
105℃
NFZ32BW3R3HN11L
NFZ32BW6R8HN11L
NFZ32BW8R4HN11L
NFZ32BW9R8HN11L
NFZ32BW120HN11L
NFZ32BW190HN11L
NFZ32BW210HN11L
NFZ32BW310HN11L
NFZ32BW520HN11L
NFZ32BW650HN11L
NFZ32BW101HN11L
NFZ32BW151HN11L
3.3
6.8
8.4
9.8
12
19
21
31
52
65
100
150
±30%
0.024
0.036
0.048
0.053
0.064
0.089
0.100
0.155
0.220
0.295
0.475
0.685
±20%
2900
2500
2400
2100
1850
1800
1550
1200
1100
900
900
700
1490
1380
1360
1110
910
900
800
610
550
450
330
270
∗1：As
for the rated current, rated current derated as figure.1 depending on the operating temperature.
∗2：When
applied rated current to the Products, temperature rise caused by self heating will be 40°C or less.
∗3：When
applied rated current to the Products, temperature rise caused by self heating will be 20°C or less.
Fugure. 1
Rated
Current
at 85℃
Rated Current [mA]
Rated
Current
at 105℃
85
Operating Temperature
(
Ambient temperature
)[℃]
105
4. Testing Conditions
《Unless
otherwise specified》
Temperature : Ordinary Temperature (15 to 35°C)
Humidity
: Ordinary Humidity (25 to 85 % (RH))
《In
case of doubt》
Temperature
: 20 ± 2°C
Humidity
: 60 to 70 % (RH)
Atmospheric Pressure : 86 to 106 kPa
MURATA MFG.CO., LTD
SpecNo.JENF243J-0003D-01
Reference Only
2.5±0.2
1.55±0.15
P2/8
5. Appearance and Dimensions
2.7±0.2
Ａ
Ａ
2.5±0.2
3.2±0.3
Ａ ：2.8 以 下
※½品本½への表示はありません。
■Unit
Mass (Typical value)
0.044½
※
No marking.
(
(in mm)
単 ½
mm)
0.9±0.3 1.3±0.2 0.9±0.3
6. Electrical Performance
No.
6.1
Item
Impedance
Specification
Impedance shall meet item 3.
Test Method
Measuring Equipment：KEYSIGHT
4192A or
equivalent
Measuring Frequency：1MHz
Measuring Equipment：Digital multi meter
6.2
DC Resistance
DC Resistance shall meet item 3.
7. Mechanical Performance
No.
7.1
Item
Shear Test
Specification
Chip coil shall not be damaged.
Test Method
Substrate：Glass-epoxy substrate
Chip Coil
Force：10N
Hold Duration：5±1s
Substrate
Ｆ
7.2
Bending Test
Substrate：Glass-epoxy substrate
(100×40×1.0mm)
Speed of Applying Force：0.5mm / s
Deflection：2mm
Hold Duration：5s
Pressure jig
R230
F
Deflection
45
45
Product
(in mm)
7.3
Vibration
Chip Noise Filter shall not be
damaged.
Oscillation Frequency：10 to 2000 to 10Hz for 20 min
Total amplitude：1.5 mm or Acceleration amplitude
98 m/s
2
whichever is smaller.
Testing Time：A period of 2 hours in each of 3 mutually
perpendicular directions. (Total 6 hours)
MURATA MFG.CO., LTD
SpecNo.JENF243J-0003D-01
No.
7.4
Item
Solderability
Reference Only
Specification
The wetting area of the electrode
shall be at least 90% covered with
new solder coating.
Test Method
P3/8
Flux：Ethanol solution of rosin,25(wt)%
(Immersed for 5s to 10s)
Solder：Sn-3.0Ag-0.5Cu
Pre-Heating：150±10°C / 60 to 90s
Solder Temperature：240±5°C
Immersion Time：3±1 s
Flux：Ethanol solution of rosin,25(wt)%
(Immersed for 5s to 10s)
Solder：Sn-3.0Ag-0.5Cu
Pre-Heating：150±10°C / 60 to 90s
Solder Temperature：270±5°C
Immersion Time：10±1 s
Then measured after exposure in the room condition for
24±2 hours.
7.5
Resistance to
Soldering Heat
Appearance：No damage
Impedance Change：within ±10%
8. Environmental Performance (It shall be soldered on the substrate.)
No.
8.1
Item
Heat Resistance
Specification
Appearance：No damage
Impedance Change：within ± 10%
DC Resistance Change：within ± 10%
Test Method
Temperature：105±2°C
Time：1000h (+48h , -0h)
Then measured after exposure in the room condition
for 24±2 hours.
Temperature：-40±2°C
Time：1000h (+48h , -0h)
Then measured after exposure in the room condition
for 24±2 hours.
Temperature: 40±2°C
Humidity: 90~95%(RH)
Time：1000h (+48h , -0h)
Then measured after exposure in the room condition
for 24±2 hours.
1 cycle：
1 step：-40±2°C / 30±3 min
2 step：Ordinary temp. / 10 to 15 min
3 step：+105±2°C / 30±3 min
4 step：Ordinary temp. / 10 to 15 min
Total of 100 cycles
Then measured after exposure in the room condition
for 24±2 hours.
8.2
Cold Resistance
8.3
Humidity
8.4
Temperature
Cycle
9. Specification of Packaging
9.1 Appearance and Dimensions of plastic tape
+0.1
φ
1.5
-0
※
Lead- in/out wire
1.75±0.1
(
0.2
)
※
The packing directions of the chip coil
in taping are unified with the in/out
positions of the lead wire.
Dimension of the Cavity is measured
at the bottom side.
3.5±0.05
3.6±0.2
4.0±0.1
2.9±0.2
4.0±0.1
1.7±0.2
Direction of feed
8.0±0.2
(in mm)
2.0±0.05
MURATA MFG.CO., LTD
SpecNo.JENF243J-0003D-01
Reference Only
P4/8
9.2 Specification of Taping
(1) Packing quantity (standard quantity)
2,000 pcs / reel
(2) Packing Method
Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape.
(3) Sprocket hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
Plastic tape and Cover tape has no spliced point.
(5) Missing components number
Missing components number within 0.1 % of the number per reel or 1 pc., whichever is greater, and
are not continuous. The specified quantity per reel is kept.
9.3 Pull Strength
Embossed carrier tape
Cover tape
9.4 Peeling off force of cover tape
Speed of Peeling off
Peeling off force
300mm/min
0.2 to 0.7N
(minimum value is typical)
Plastic tape
165 to 180 degree
F
Cover tape
10N min.
5N min.
9.5 Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape (cover tape) and trailer-tape (empty tape) as follows.
Trailer
:
160 min.
2.0±0.5
Label
190 min
Empty tape
Leader
210 min
Cover tape
φ
60± 1
0
9±1
0
13±1.4
φ
13.0±0.2
φ
21.0±0.8
Direction of feed
φ
180
±
3
0
(in mm)
9.6 Marking for reel
Customer part number, MURATA part number, Inspection number(∗1), RoHS marking(∗2), Quantity etc
½½½
∗1)
<Expression of Inspection No.>
□□
OOOO
×××
(1)
(2)
(3
)
(1) Factory Code
(2) Date
First digit
: Year / Last digit of year
Second digit
: Month / Jan. to Sep.
→
1 to 9, Oct. to Dec.
→
O, N, D
Third, Fourth digit : Day
(3) Serial No.
∗2)
« Expression of RoHS marking »
(1) RoHS regulation conformity
(2) MURATA classification number
9.7 Marking for Outside package (corrugated paper box)
Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS marking (∗2) ,
Quantity, etc
½½½
ROHS – Y (△)
(1) (2)
MURATA MFG.CO., LTD
SpecNo.JENF243J-0003D-01
9.8. Specification of Outer Case
Reference Only
Outer Case Dimensions (mm)
Label
P5/8
W
186
D
186
H
93
Standard Reel Quantity
in Outer Case (Reel)
5
H
D
W
∗Above
Outer Case size is typical. It depends on a quantity
of an order.
10.
Caution
Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high reliability for
the prevention of defects which might directly cause damage to the third party's life, body or property.
(1) Aircraft equipment
(2) Aerospace equipment
(3) Undersea equipment
(4) Power plant control equipment
(5) Medical equipment
(6) Transportation equipment (vehicles, trains, ships, etc.)
(7) Traffic signal equipment
(8) Disaster prevention / crime prevention equipment
(9) Data-processing equipment
(10) Applications of similar complexity and /or reliability requirements
to the applications listed in the above
11. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
11.1 Land pattern designing
Recommended land pattern for flow and reflow soldering is as follows:
It has been designed for Electric characteristics and solderability.
Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or
solderability may be affected, or result to "position shift" in soldering process.
(Reflow)
Land
Chip Noise Filter
Solder Resist
(Flow)
Chip Noise Filter
Land
Solder Resist
0.8
2.5
(in mm)
2.2
4.8
1.3
(in mm)
(Distance between the products for Flow)
(in mm)
MURATA MFG.CO., LTD
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