M55342E08W138AP-TR datasheet, PDF

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M55342E08W138AP-TR: DescriptionFixed Resistor, Thin Film, 0.8W, 138ohm, 150V, 0.1% +/-Tol, 25ppm/Cel, Surface Mount, 2010, CHIP; CategoryPassive components The resistor; File Size106KB，1 Pages; ManufacturerState of the Art Inc.; Environmental Compliance

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M55342E08W138AP-TR Overview

Fixed Resistor, Thin Film, 0.8W, 138ohm, 150V, 0.1% +/-Tol, 25ppm/Cel, Surface Mount, 2010, CHIP

M55342E08W138AP-TR Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Objectid	2069978609
package instruction	CHIP
Reach Compliance Code	compliant
Country Of Origin	USA
ECCN code	EAR99
YTEOL	7.12
Other features	PRECISION
structure	Chip
JESD-609 code	e4
Manufacturer's serial number	M55342/08
Installation features	SURFACE MOUNT
Number of terminals	2
Maximum operating temperature	150 °C
Minimum operating temperature	-55 °C
Package height	0.64 mm
Package length	5.13 mm
Package shape	RECTANGULAR PACKAGE
Package form	SMT
Package width	2.38 mm
method of packing	TR
Rated power dissipation(P)	0.8 W
Rated temperature	70 °C
Guideline	MIL-PRF-55342
resistance	138 Ω
Resistor type	FIXED RESISTOR
series	M55342/08-THIN FILM
size code	2010
surface mount	YES
technology	THIN FILM
Temperature Coefficient	25 ppm/°C
Terminal surface	Gold (Au)
Terminal shape	WRAPAROUND
Tolerance	0.1%
Operating Voltage	150 V

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State of the Art, Inc.

Thin Film Chip Resistor

M55342/08 RM2010

PROTECTIVE

ENCAPSULANT

PRECISION

THIN FILM

RESISTOR

99.6% ALUMINA CHIP

WRAPAROUND

TERMINATIONS

PRETINNED

PERFORMANCE

TEMPERATURE RISE (°C)

Resistance Range

Tolerances

Maximum Power

Maximum Voltage

100

- 1M

0.1%, 1%, 2%, 5%

800 mW

150 Volts

CURRENT NOISE

POWER DISSIPATION

fiber epoxy board

ceramic board

TESTS

TCR (-55 to +125

C) in ppm/

Thermal Shock

Low Temperature Operation

Short-time Overload

Resistance to Soldering Heat

Moisture Resistance

Life, 2,000 Hours

High Temperature Exposure

CHARACTERISTICS*

±25

±0.1%

±0.2%

±0.5%

±0.1%

±50

±0.25%

±0.1%

±0.25%

±0.4%

±0.5%

±0.2%

POWER DISSIPATION (WATTS)

LIFE TEST

POWER DERATING

*Maximum allowable change per MIL-PRF-55342,

typical change is 10% of these values.

PART NUMBERING

M55342 H 08 B 100D R - TR

PACKAGING CODE: TR = Tape & Reel W= Waffle Pack

PRODUCT LEVEL DESIGNATOR: M: 1% per 1000 hrs. R: 0.01% P: 0.1% T: Space Level C: Non - ER

RESISTANCE AND TOLERANCE CODE:

Three significant digits, with a letter indicating the

decimal location, the tolerance, and the value range.

TERMINATION MATERIALS:

SIZE CODE: /08 = RM2010

TEMPERATURE CHARACTERISTIC: E: ± 25ppm H: ± 50ppm

PERFORMANCE SPECIFICATION MIL-PRF-55342

B: Solderable wraparound

A: 0.1%

D: 1%

G: 2%

J: 5%

B: 0.1% K

E: 1% K

H: 2% K

K: 5% K

C: 0.1% M

F: 1% M

T: 2% M

L: 5% M

W: Gold wire bondable

MECHANICAL

INCHES

MILLIMETERS

.252

MINIMUM

RECOMMENDED

MOUNTING

PADS

(INCHES)

Length

Width

Thickness

Top Term

Bottom Term

Gap

Approx. Weight

.202 (.191 - .218)

.094 (.093 - .103)

.025 (.015 - .033)

.020 (.015 - .025)

.019 (.015 - .025)

.164 (.160 - .168)

.0323 grams

5.13

2.38

0.64

0.51

0.48

4.17

(4.85 - 5.54)

(2.36 - 2.62)

(0.38 - 0.84)

(0.38 - 0.64)

(4.06 - 4.27)

.100

.154

.049

2470 Fox Hill Road, State College, PA 16803-1797

Phone (814) 355-8004 Fax (814) 355-2714 Toll Free 1-800-458-3401

“Specifications subject to change without notice.”

www.resistor.com

04/09/08

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