Field Programmable Gate Array, 320 CLBs, 9000 Gates, 50MHz, CMOS, CPGA175
Parameter Name | Attribute value |
package instruction | PGA, |
Reach Compliance Code | unknown |
ECCN code | 3A001.A.2.C |
maximum clock frequency | 50 MHz |
JESD-30 code | S-CPGA-P175 |
length | 42.164 mm |
Configurable number of logic blocks | 320 |
Equivalent number of gates | 9000 |
Number of terminals | 175 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
organize | 320 CLBS, 9000 GATES |
Package body material | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | PGA |
Package shape | SQUARE |
Package form | GRID ARRAY |
Programmable logic type | FIELD PROGRAMMABLE GATE ARRAY |
Certification status | Not Qualified |
Maximum seat height | 4.318 mm |
Nominal supply voltage | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | MILITARY |
Terminal form | PIN/PEG |
Terminal pitch | 2.54 mm |
Terminal location | PERPENDICULAR |
width | 42.164 mm |
Base Number Matches | 1 |
5962-8982301MXX | 5962-8982301XX | 5962-8982302XX | 5962-8982302MXX | |
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Description | Field Programmable Gate Array, 320 CLBs, 9000 Gates, 50MHz, CMOS, CPGA175 | Field Programmable Gate Array, 320 CLBs, 9000 Gates, 16MHz, CMOS, CPGA175, CERAMIC, PGA-175 | Field Programmable Gate Array, 320 CLBs, 9000 Gates, 25MHz, CMOS, CPGA175, CERAMIC, PGA-175 | Field Programmable Gate Array, 320 CLBs, 5000 Gates, 70MHz, CMOS, CPGA175, CERAMIC, PGA-175 |
package instruction | PGA, | PGA, | PGA, | PGA, |
Reach Compliance Code | unknown | unknown | unknown | unknown |
ECCN code | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
maximum clock frequency | 50 MHz | 16 MHz | 25 MHz | 70 MHz |
JESD-30 code | S-CPGA-P175 | R-CPGA-P175 | R-CPGA-P175 | S-CPGA-P175 |
Configurable number of logic blocks | 320 | 320 | 320 | 320 |
Equivalent number of gates | 9000 | 9000 | 9000 | 5000 |
Number of terminals | 175 | 175 | 175 | 175 |
Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C |
Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C |
organize | 320 CLBS, 9000 GATES | 320 CLBS, 9000 GATES | 320 CLBS, 9000 GATES | 320 CLBS, 5000 GATES |
Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | PGA | PGA | PGA | PGA |
Package shape | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE |
Package form | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY |
Programmable logic type | FIELD PROGRAMMABLE GATE ARRAY | FIELD PROGRAMMABLE GATE ARRAY | FIELD PROGRAMMABLE GATE ARRAY | FIELD PROGRAMMABLE GATE ARRAY |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Nominal supply voltage | 5 V | 5 V | 5 V | 5 V |
surface mount | NO | NO | NO | NO |
technology | CMOS | CMOS | CMOS | CMOS |
Temperature level | MILITARY | MILITARY | MILITARY | MILITARY |
Terminal form | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG |
Terminal location | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR |
Base Number Matches | 1 | 1 | 1 | 1 |
Maker | - | XILINX | XILINX | XILINX |
Parts packaging code | - | PGA | PGA | PGA |
Contacts | - | 175 | 175 | 175 |
Combined latency of CLB-Max | - | 14 ns | 9 ns | 2 ns |
JESD-609 code | - | e4 | e4 | e4 |
Filter level | - | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 |
Terminal surface | - | GOLD | GOLD | GOLD |