Freescale Semiconductor Inc.
Data Sheet: Technical Data
Document Number: IMX6DQCEC
Rev. 4, 07/2015
MCIMX6QxExxxxC
MCIMX6QxExxxxD
MCIMX6DxExxxxC
MCIMX6DxExxxxD
i.MX 6Dual/6Quad
Applications Processors
for Consumer Products
Package Information
Case FCPBGA 21 x 21 mm, 0.8 mm pitch
Ordering Information
See
Table 1 on page 3
1
Introduction
1
The i.MX 6Dual and i.MX 6Quad processors represent
Freescale Semiconductor’s latest achievement in
integrated multimedia applications processors. These
processors are part of a growing family of
multimedia-focused products that offer high
performance processing and are optimized for lowest
power consumption.
The i.MX 6Dual/6Quad processors feature the Freescale
advanced implementation of the quad
ARM
®
Cortex
®
-A9 core, which operates at speeds up to
1 GHz. They include 2D and 3D graphics processors, 3D
1080p video processing, and integrated power
management. Each processor provides a 64-bit
DDR3/LVDDR3/LPDDR2-1066 memory interface and
a number of other interfaces for connecting peripherals,
such as WLAN, Bluetooth
®
, GPS, hard drive, displays,
and camera sensors.
The i.MX 6Dual/6Quad processors are specifically
useful for applications such as the following:
• Netbooks (web tablets)
2
3
4
5
6
7
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 3
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.3 Updated Signal Naming Convention . . . . . . . . . . . . 7
Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.1 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Modules List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.1 Special Signal Considerations. . . . . . . . . . . . . . . . 18
3.2 Recommended Connections for Unused Analog
Interfaces. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Electrical Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 19
4.1 Chip-Level Conditions . . . . . . . . . . . . . . . . . . . . . . 19
4.2 Power Supplies Requirements and Restrictions . . 32
4.3 Integrated LDO Voltage Regulator Parameters . . . 33
4.4 PLL Electrical Characteristics . . . . . . . . . . . . . . . . 35
4.5 On-Chip Oscillators . . . . . . . . . . . . . . . . . . . . . . . . 36
4.6 I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 38
4.7 I/O AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 42
4.8 Output Buffer Impedance Parameters . . . . . . . . . . 47
4.9 System Modules Timing . . . . . . . . . . . . . . . . . . . . 51
4.10 General-Purpose Media Interface (GPMI) Timing. 66
4.11 External Peripheral Interface Parameters . . . . . . . 75
Boot Mode Configuration . . . . . . . . . . . . . . . . . . . . . . . 141
5.1 Boot Mode Configuration Pins. . . . . . . . . . . . . . . 141
5.2 Boot Devices Interfaces Allocation . . . . . . . . . . . 142
Package Information and Contact Assignments . . . . . . 144
6.1 Updated Signal Naming Convention . . . . . . . . . . 144
6.2 21 x 21 mm Package Information . . . . . . . . . . . . 145
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 167
© 2012-2015 Freescale Semiconductor, Inc. All rights reserved.
Introduction
•
•
•
•
•
•
Nettops (Internet desktop devices)
High-end mobile Internet devices (MID)
High-end PDAs
High-end portable media players (PMP) with HD video capability
Gaming consoles
Portable navigation devices (PND)
The i.MX 6Dual/6Quad processors offers numerous advanced features, such as:
• Applications processors—The processors enhance the capabilities of high-tier portable
applications by fulfilling the ever increasing MIPS needs of operating systems and games.
Freescale’s Dynamic Voltage and Frequency Scaling (DVFS) provides significant power
reduction, allowing the device to run at lower voltage and frequency with sufficient MIPS for tasks
such as audio decode.
• Multilevel memory system—The multilevel memory system of each processor is based on the L1
instruction and data caches, L2 cache, and internal and external memory. The processors support
many types of external memory devices, including DDR3, low voltage DDR3, LPDDR2, NOR
Flash, PSRAM, cellular RAM, NAND Flash (MLC and SLC), OneNAND™, and managed
NAND, including eMMC up to rev 4.4/4.41.
• Smart speed technology—The processors have power management throughout the device that
enables the rich suite of multimedia features and peripherals to consume minimum power in both
active and various low power modes. Smart speed technology enables the designer to deliver a
feature-rich product, requiring levels of power far lower than industry expectations.
• Dynamic voltage and frequency scaling—The processors improve the power efficiency of devices
by scaling the voltage and frequency to optimize performance.
• Multimedia powerhouse—The multimedia performance of each processor is enhanced by a
multilevel cache system, Neon
®
MPE (Media Processor Engine) co-processor, a multi-standard
hardware video codec, 2 autonomous and independent image processing units (IPU), and a
programmable smart DMA (SDMA) controller.
• Powerful graphics acceleration—Each processor provides three independent, integrated graphics
processing units: an OpenGL
®
ES 2.0 3D graphics accelerator with four shaders (up to 200 MTri/s
and OpenCL support), 2D graphics accelerator, and dedicated OpenVG™ 1.1 accelerator.
• Interface flexibility—Each processor supports connections to a variety of interfaces: LCD
controller for up to four displays (including parallel display, HDMI1.4, MIPI display, and LVDS
display), dual CMOS sensor interface (parallel or through MIPI), high-speed USB on-the-go with
PHY, high-speed USB host with PHY, multiple expansion card ports (high-speed MMC/SDIO host
and other), 10/100/1000 Mbps Gigabit Ethernet controller, and a variety of other popular interfaces
(such as UART, I
2
C, and I
2
S serial audio, SATA-II, and PCIe-II).
• Advanced security—The processors deliver hardware-enabled security features that enable secure
e-commerce, digital rights management (DRM), information encryption, secure boot, and secure
software downloads. The security features are discussed in detail in the i.MX 6Dual/6Quad
security reference manual (IMX6DQ6SDLSRM).
i.MX 6Dual/6Quad Applications Processors for Consumer Products, Rev. 4, 07/2015
2
Freescale Semiconductor Inc.
Introduction
•
Integrated power management—The processors integrate linear regulators and internally generate
voltage levels for different domains. This significantly simplifies system power management
structure.
1.1
Ordering Information
Table 1shows
examples of orderable part numbers covered by this data sheet. This table does not include
all possible orderable part numbers. The latest part numbers are available on freescale.com/imx6series. If
your desired part number is not listed in the table, or you have questions about available parts, see
freescale.com/imx6series or contact your Freescale representative.
Table 1. Example Orderable Part Numbers
Part Number
MCIMX6Q5EYM10AC
MCIMX6Q5EYM10AD
SCIMX6Q5EYM10CC
SCIMX6Q5EYM10CD
MCIMX6D5EYM10AC
MCIMX6D5EYM10AD
SCIMX6D5EYM10CC
SCIMX6D5EYM10CD
1
Quad/Dual CPU
i.MX 6Quad
i.MX 6Quad
i.MX 6Quad
i.MX 6Quad
i.MX 6Dual
i.MX 6Dual
i.MX 6Dual
i.MX 6Dual
Options
With VPU, GPU
With VPU, GPU
With VPU, GPU,
HDCP
With VPU, GPU,
HDCP
With VPU, GPU
With VPU, GPU
With VPU, GPU,
HDCP
With VPU, GPU,
HDCP
Speed
1
Grade
1 GHz
1 GHz
1 GHz
1 GHz
1 GHz
1 GHz
1 GHz
1 GHz
Temperature
Grade
Extended
Consumer
Extended
Consumer
Extended
Consumer
Extended
Consumer
Extended
Consumer
Extended
Consumer
Extended
Consumer
Extended
Consumer
Package
21 mm x 21 mm, 0.8 mm
pitch, FCPBGA (non-lidded)
21 mm x 21 mm, 0.8 mm
pitch, FCPBGA (non-lidded)
21 mm x 21 mm, 0.8 mm
pitch, FCPBGA (non-lidded)
21 mm x 21 mm, 0.8 mm
pitch, FCPBGA (non-lidded)
21 mm x 21 mm, 0.8 mm
pitch, FCPBGA (non-lidded)
21 mm x 21 mm, 0.8 mm
pitch, FCPBGA (non-lidded)
21 mm x 21 mm, 0.8 mm
pitch, FCPBGA (non-lidded)
21 mm x 21 mm, 0.8 mm
pitch, FCPBGA (non-lidded)
If a 24 MHz input clock is used (required for USB), the maximum SoC speed is limited to 996 MHz.
Figure 1
describes the part number nomenclature to identify the characteristics of the specific part number
you have (for example, cores, frequency, temperature grade, fuse options, silicon revision).
Figure 1
applies to the i.MX 6Dual/6Quad.
The two characteristics that identify which data sheet a specific part applies to are the part number series
field and the temperature grade (junction) field:
• The i.MX 6Dual/6Quad Automotive and Infotainment Applications Processors data sheet
(IMX6DQAEC) covers parts listed with “A (Automotive temp)”
• The i.MX 6Dual/6Quad Applications Processors for Consumer Products data sheet (IMX6DQCEC)
covers parts listed with “D (Commercial temp)” or “E (Extended Commercial temp)”
• The i.MX 6Dual/6Quad Applications Processors for Industrial Products data sheet (IMX6DQIEC)
covers parts listed with “C (Industrial temp)”
i.MX 6Dual/6Quad Applications Processors for Consumer Products, Rev. 4, 07/2015
Freescale Semiconductor Inc.
3
Introduction
Ensure that you have the right data sheet for your specific part by checking the temperature grade
(junction) field and matching it to the right data sheet. If you have questions, see freescale.com/imx6series
or contact your Freescale representative.
MC
Qualification level
Prototype Samples
Mass Production
Special
IMX6
MC
PC
MC
SC
X
@
+
VV
$$
%
A
Silicon revision
1
Rev 1.2
Rev 1.3
A
C
D
Fusing
Default Setting
%
A
C
Part # series
i.MX 6Quad
i.MX 6Dual
X
Q
D
HDCP Enabled
Frequency
800 MHz
2
(Industrial grade)
852 MHz (Automotive grade)
$$
08
08
10
12
RoHS
Part differentiator
Industrial – w/ VPU, GPU, no MLB
Automotive – w/ VPU, GPU
Consumer – w/ VPU, GPU
Automotive – w/ GPU, no VPU
@
7
6
5
4
1 GHz
3
1.2 GHz
Package type
FCPBGA 21x21 0.8mm (lidded)
VT
YM
Temperature Tj
Extended Commercial: -20 to + 105
°
C
Industrial: -40 to +105
°
C
Automotive: -40 to +
125
°
C
+
E
C
A
FCPBGA 21x21 0.8mm (non lidded)
1. See the freescale.com\imx6series Web page for latest information on the available silicon revision.
2. If a 24 MHz input clock is used (required for USB), the maximum SoC speed is limited to 792 MHz.
3. If a 24 MHz input clock is used (required for USB), the maximum SoC speed is limited to 996 MHz.
Figure 1. Part Number Nomenclature—i.MX 6Quad and i.MX 6Dual
1.2
Features
The i.MX 6Dual/6Quad processors are based on ARM Cortex-A9 MPCore platform, which has the
following features:
• ARM Cortex-A9 MPCore 4xCPU processor (with TrustZone
®
)
• The core configuration is symmetric, where each core includes:
— 32 KByte L1 Instruction Cache
— 32 KByte L1 Data Cache
— Private Timer and Watchdog
— Cortex-A9 NEON MPE (Media Processing Engine) Co-processor
The ARM Cortex-A9 MPCore complex includes:
• General Interrupt Controller (GIC) with 128 interrupt support
• Global Timer
• Snoop Control Unit (SCU)
i.MX 6Dual/6Quad Applications Processors for Consumer Products, Rev. 4, 07/2015
4
Freescale Semiconductor Inc.
Introduction
•
•
•
•
1 MB unified I/D L2 cache, shared by two/four cores
Two Master AXI (64-bit) bus interfaces output of L2 cache
Frequency of the core (including Neon and L1 cache) as per
Table 6.
NEON MPE coprocessor
— SIMD Media Processing Architecture
— NEON register file with 32x64-bit general-purpose registers
— NEON Integer execute pipeline (ALU, Shift, MAC)
— NEON dual, single-precision floating point execute pipeline (FADD, FMUL)
— NEON load/store and permute pipeline
The SoC-level memory system consists of the following additional components:
— Boot ROM, including HAB (96 KB)
— Internal multimedia / shared, fast access RAM (OCRAM, 256 KB)
— Secure/non-secure RAM (16 KB)
• External memory interfaces:
— 16-bit, 32-bit, and 64-bit DDR3-1066, LVDDR3-1066, and 1/2 LPDDR2-1066 channels,
supporting DDR interleaving mode, for 2x32 LPDDR2-1066
— 8-bit NAND-Flash, including support for Raw MLC/SLC, 2 KB, 4 KB, and 8 KB page size,
BA-NAND, PBA-NAND, LBA-NAND, OneNAND™ and others. BCH ECC up to 40 bit.
— 16/32-bit NOR Flash. All EIMv2 pins are muxed on other interfaces.
— 16/32-bit PSRAM, Cellular RAM
Each i.MX 6Dual/6Quad processor enables the following interfaces to external devices (some of them are
muxed and not available simultaneously):
• Hard Disk Drives—SATA II, 3.0 Gbps
• Displays—Total five interfaces available. Total raw pixel rate of all interfaces is up to 450
Mpixels/sec, 24 bpp. Up to four interfaces may be active in parallel.
— One Parallel 24-bit display port, up to 225 Mpixels/sec (for example, WUXGA at 60 Hz or dual
HD1080 and WXGA at 60 Hz)
— LVDS serial ports—One port up to 165 Mpixels/sec or two ports up to 85 MP/sec (for example,
WUXGA at 60 Hz) each
— HDMI 1.4 port
— MIPI/DSI, two lanes at 1 Gbps
• Camera sensors:
— Parallel Camera port (up to 20 bit and up to 240 MHz peak)
— MIPI CSI-2 serial camera port, supporting up to 1000 Mbps/lane in 1/2/3-lane mode and up to
800 Mbps/lane in 4-lane mode. The CSI-2 Receiver core can manage one clock lane and up to
four data lanes. Each i.MX 6Dual/6Quad processor has four lanes.
• Expansion cards:
— Four MMC/SD/SDIO card ports all supporting:
i.MX 6Dual/6Quad Applications Processors for Consumer Products, Rev. 4, 07/2015
Freescale Semiconductor Inc.
5
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