EEWORLDEEWORLDEEWORLD

Part Number

Search

B32632-A1682-K020

Description
CAPACITOR, METALLIZED FILM, POLYPROPYLENE, 1600 V, 0.0068 uF, THROUGH HOLE MOUNT, RADIAL LEADED
CategoryPassive components    capacitor   
File Size633KB,21 Pages
ManufacturerTDK Corporation
Websitehttp://www.tdk.com
Environmental Compliance  
Download Datasheet Parametric View All

B32632-A1682-K020 Overview

CAPACITOR, METALLIZED FILM, POLYPROPYLENE, 1600 V, 0.0068 uF, THROUGH HOLE MOUNT, RADIAL LEADED

B32632-A1682-K020 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
Objectid1918730776
package instruction,
Reach Compliance Codecompliant
Other featuresRATED AC VOLTAGE (V): 450
capacitance0.0068 µF
Capacitor typeFILM CAPACITOR
dielectric materialsPOLYPROPYLENE
JESD-609 codee3
Manufacturer's serial numberB32632
Installation featuresTHROUGH HOLE MOUNT
negative tolerance10%
Maximum operating temperature85 °C
Minimum operating temperature-55 °C
Package shapeRECTANGULAR PACKAGE
method of packingBULK
positive tolerance10%
Rated (DC) voltage (URdc)1600 V
surface mountNO
Terminal surfaceMATTE TIN
Terminal shapeWIRE
Film Capacitors
Metallized Polypropylene Film Capacitors (MFP)
Series/Type:
Date:
B32632 ... B32634
August 2004
© EPCOS AG 2004. Reproduction, publication and dissemination of this data sheet, enclosures hereto and the
information contained therein without EPCOS' prior express consent is prohibited.
Purchase orders are subject to the General Conditions for the Supply of Products and Services of the Electrical
and Electronics Industry recommended by the ZVEI (German Electrical and Electronic Manufacturers' Associ-
ation), unless otherwise agreed.
Ping An Bank is recruiting application operation and maintenance engineers, and the school must be 985 or 211
985, 211 are hard requirements. Contact: Cathy18665320397...
shuqinzhanziao Recruitment
When BLE meets MEMS——by lb8820265
When BLE meets MEMS Author: lb8820265Table of contents Let's talk about what you need to know to get started with BLE development Build an Android BLE project When BLE meets MEMS: Conquering and train...
okhxyyo RF/Wirelessly
[ESK32-360 Review] Experience of using ESK32-360
The ESK32-360 development board is a development board for the HT32F1654 microcontroller launched by Holtek Semiconductor. Holtek Semiconductor is a semiconductor company under Holtek Semiconductor of...
littleshrimp Domestic Chip Exchange
Tips for debugging audio amplifiers
Author: Henry KwokExternal component placement Grounding Problems Power Supply and Decoupling PWM Filter Heat dissipation issues I2C/I2S Communication1. Component placement The Class D amplifier gener...
alan000345 TI Technology Forum
GD32E503V-EVAL Evaluation Summary
Event details: https://en.eeworld.com/bbs/elecplay/content/156@I love downloading【GD32E503 Review】+Hardware System and Environment Establishment [GD32E503 Review] + Transplanting TencentOS-tiny [GD32E...
okhxyyo Domestic Chip Exchange
1
[i=s]This post was last edited by anrui-2021 on 2021-12-22 11:31[/i]...
anrui-2021 Analog electronics

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号