|
CD74HCT10MG4 |
CD74HC10MTG4 |
CD74HC10M96G4 |
CD74HCT10MTG4 |
CD74HCT10M96 |
Description |
Logic Gates Hi Spd CMOS Log Tr 3-Input NAND |
Logic Gates Hi Spd CMOS Triple 3 Input NAND |
Logic Gates Hi Spd CMOS Triple 3 Input NAND |
Logic Gates Hi Spd CMOS Log Tr 3-Input NAND |
Power supply voltage: 4.5V ~ 5.5V Logic circuit family: 74HCT Logic type: NAND gate circuit/number of components: 3 Number of inputs/bits per component: 3 Quiescent current (maximum value): 2uA |
Is it lead-free? |
Lead free |
Lead free |
Lead free |
Lead free |
Lead free |
Is it Rohs certified? |
conform to |
conform to |
conform to |
conform to |
conform to |
Maker |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Parts packaging code |
SOIC |
SOIC |
SOIC |
SOIC |
SOIC |
package instruction |
GREEN, PLASTIC, MS-012AB, SOIC-14 |
SOP, SOP14,.25 |
SOP, SOP14,.25 |
SOP, SOP14,.25 |
SOIC-14 |
Contacts |
14 |
14 |
14 |
14 |
14 |
Reach Compliance Code |
unknown |
unknown |
unknown |
unknown |
compliant |
series |
HCT |
HC/UH |
HC/UH |
HCT |
HCT |
JESD-30 code |
R-PDSO-G14 |
R-PDSO-G14 |
R-PDSO-G14 |
R-PDSO-G14 |
R-PDSO-G14 |
JESD-609 code |
e4 |
e4 |
e4 |
e4 |
e4 |
length |
8.65 mm |
8.65 mm |
8.65 mm |
8.65 mm |
8.65 mm |
Load capacitance (CL) |
50 pF |
50 pF |
50 pF |
50 pF |
50 pF |
Logic integrated circuit type |
NAND GATE |
NAND GATE |
NAND GATE |
NAND GATE |
NAND GATE |
MaximumI(ol) |
0.004 A |
0.004 A |
0.004 A |
0.004 A |
0.004 A |
Humidity sensitivity level |
1 |
1 |
1 |
1 |
1 |
Number of functions |
3 |
3 |
3 |
3 |
3 |
Number of entries |
3 |
3 |
3 |
3 |
3 |
Number of terminals |
14 |
14 |
14 |
14 |
14 |
Maximum operating temperature |
125 °C |
125 °C |
125 °C |
125 °C |
125 °C |
Minimum operating temperature |
-55 °C |
-55 °C |
-55 °C |
-55 °C |
-55 °C |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
SOP |
SOP |
SOP |
SOP |
SOP |
Encapsulate equivalent code |
SOP14,.25 |
SOP14,.25 |
SOP14,.25 |
SOP14,.25 |
SOP14,.25 |
Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
SMALL OUTLINE |
SMALL OUTLINE |
SMALL OUTLINE |
SMALL OUTLINE |
SMALL OUTLINE |
method of packing |
TUBE |
TAPE AND REEL |
TAPE AND REEL |
TAPE AND REEL |
TR |
Peak Reflow Temperature (Celsius) |
260 |
260 |
260 |
260 |
260 |
power supply |
5 V |
2/6 V |
2/6 V |
5 V |
5 V |
Prop。Delay @ Nom-Sup |
36 ns |
30 ns |
30 ns |
36 ns |
36 ns |
propagation delay (tpd) |
36 ns |
150 ns |
150 ns |
36 ns |
36 ns |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Schmitt trigger |
NO |
NO |
NO |
NO |
NO |
Maximum seat height |
1.75 mm |
1.75 mm |
1.75 mm |
1.75 mm |
1.75 mm |
Maximum supply voltage (Vsup) |
5.5 V |
6 V |
6 V |
5.5 V |
5.5 V |
Minimum supply voltage (Vsup) |
4.5 V |
2 V |
2 V |
4.5 V |
4.5 V |
Nominal supply voltage (Vsup) |
5 V |
4.5 V |
4.5 V |
5 V |
5 V |
surface mount |
YES |
YES |
YES |
YES |
YES |
technology |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
Temperature level |
MILITARY |
MILITARY |
MILITARY |
MILITARY |
MILITARY |
Terminal surface |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Terminal form |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
Terminal pitch |
1.27 mm |
1.27 mm |
1.27 mm |
1.27 mm |
1.27 mm |
Terminal location |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
width |
3.9 mm |
3.9 mm |
3.9 mm |
3.9 mm |
3.9 mm |