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PCA9512DP

Description
Level shifting hot swappable I2C and SMBus buffer
CategoryAnalog mixed-signal IC    Drivers and interfaces   
File Size124KB,16 Pages
ManufacturerPhilips Semiconductors (NXP Semiconductors N.V.)
Websitehttps://www.nxp.com/
Download Datasheet Parametric Compare View All

PCA9512DP Overview

Level shifting hot swappable I2C and SMBus buffer

PCA9512DP Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerPhilips Semiconductors (NXP Semiconductors N.V.)
package instructionTSSOP, TSSOP8,.19
Reach Compliance Codeunknown
Interface integrated circuit typeINTERFACE CIRCUIT
JESD-30 codeR-PDSO-G8
JESD-609 codee0
Number of terminals8
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeTSSOP
Encapsulate equivalent codeTSSOP8,.19
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
power supply3/5 V
Certification statusNot Qualified
Maximum slew rate3.6 mA
surface mountYES
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.635 mm
Terminal locationDUAL
INTEGRATED CIRCUITS
PCA9512
Level shifting hot swappable
I
2
C and SMBus buffer
Product data sheet
2004 Oct 05
Philips
Semiconductors

PCA9512DP Related Products

PCA9512DP PCA9512 PCA9512D
Description Level shifting hot swappable I2C and SMBus buffer Level shifting hot swappable I2C and SMBus buffer Level shifting hot swappable I2C and SMBus buffer
Is it Rohs certified? incompatible - incompatible
Maker Philips Semiconductors (NXP Semiconductors N.V.) - Philips Semiconductors (NXP Semiconductors N.V.)
package instruction TSSOP, TSSOP8,.19 - SOP, SOP8,.25
Reach Compliance Code unknown - unknown
Interface integrated circuit type INTERFACE CIRCUIT - INTERFACE CIRCUIT
JESD-30 code R-PDSO-G8 - R-PDSO-G8
JESD-609 code e0 - e0
Number of terminals 8 - 8
Maximum operating temperature 85 °C - 85 °C
Minimum operating temperature -40 °C - -40 °C
Package body material PLASTIC/EPOXY - PLASTIC/EPOXY
encapsulated code TSSOP - SOP
Encapsulate equivalent code TSSOP8,.19 - SOP8,.25
Package shape RECTANGULAR - RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE, SHRINK PITCH - SMALL OUTLINE
power supply 3/5 V - 3/5 V
Certification status Not Qualified - Not Qualified
Maximum slew rate 3.6 mA - 3.6 mA
surface mount YES - YES
Temperature level INDUSTRIAL - INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb)
Terminal form GULL WING - GULL WING
Terminal pitch 0.635 mm - 1.27 mm
Terminal location DUAL - DUAL

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