SPST, 4 Func, 1 Channel, CMOS, CDFP14
Parameter Name | Attribute value |
package instruction | , |
Reach Compliance Code | unknown |
Analog Integrated Circuits - Other Types | SPST |
JESD-30 code | R-CDFP-F14 |
JESD-609 code | e4 |
Nominal Negative Supply Voltage (Vsup) | |
Number of channels | 1 |
Number of functions | 4 |
Number of terminals | 14 |
Maximum on-state resistance (Ron) | 320 Ω |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
Package body material | CERAMIC, METAL-SEALED COFIRED |
Package shape | RECTANGULAR |
Package form | FLATPACK |
Certification status | Not Qualified |
Maximum supply current (Isup) | 0.025 mA |
Nominal supply voltage (Vsup) | 15 V |
surface mount | YES |
Maximum disconnect time | 95 ns |
Maximum connection time | 95 ns |
technology | CMOS |
Temperature level | MILITARY |
Terminal surface | GOLD |
Terminal form | FLAT |
Terminal location | DUAL |
total dose | 100k Rad(Si) V |
Base Number Matches | 1 |
5962R9665201VXC | CD4066BFMS | CD4066BDMSR | CD4066BDMS | 5962R9665201VCC | CD4066BKMSR | CD4066BKMS | |
---|---|---|---|---|---|---|---|
Description | SPST, 4 Func, 1 Channel, CMOS, CDFP14 | SPST, 4 Func, 1 Channel, CMOS, CDIP14 | SPST, 4 Func, 1 Channel, CMOS, CDIP14 | SPST, 4 Func, 1 Channel, CMOS, CDIP14 | SPST, 4 Func, 1 Channel, CMOS, CDIP14 | SPST, 4 Func, 1 Channel, CMOS, CDFP14 | SPST, 4 Func, 1 Channel, CMOS, CDFP14 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
Analog Integrated Circuits - Other Types | SPST | SPST | SPST | SPST | SPST | SPST | SPST |
JESD-30 code | R-CDFP-F14 | R-GDIP-T14 | R-CDIP-T14 | R-CDIP-T14 | R-CDIP-T14 | R-CDFP-F14 | R-CDFP-F14 |
Number of channels | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of functions | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
Number of terminals | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
Maximum on-state resistance (Ron) | 320 Ω | 320 Ω | 320 Ω | 320 Ω | 320 Ω | 320 Ω | 320 Ω |
Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | FLATPACK | IN-LINE | IN-LINE | IN-LINE | IN-LINE | FLATPACK | FLATPACK |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum supply current (Isup) | 0.025 mA | 0.025 mA | 0.025 mA | 0.025 mA | 0.025 mA | 0.025 mA | 0.025 mA |
Nominal supply voltage (Vsup) | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V |
surface mount | YES | NO | NO | NO | NO | YES | YES |
Maximum disconnect time | 95 ns | 95 ns | 95 ns | 95 ns | 95 ns | 95 ns | 95 ns |
Maximum connection time | 95 ns | 95 ns | 95 ns | 95 ns | 95 ns | 95 ns | 95 ns |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
Terminal form | FLAT | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | FLAT | FLAT |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
JESD-609 code | e4 | - | e0 | - | e4 | e0 | - |
Terminal surface | GOLD | - | Tin/Lead (Sn/Pb) | - | GOLD | Tin/Lead (Sn/Pb) | - |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | - |