PHP
www.vishay.com
Vishay Dale Thin Film
High Power Thin Film Wraparound Chip Resistor
FEATURES
•
•
•
•
•
•
PHP series chip resistors are designed with enlarged
backside terminations to reduce the thermal resistance
between the topside resistor layer and the solder joint on the
end users circuit board.
Actual power handling capability is limited by the end user
mounting process. As with any high power chip resistor the
ability to remove the generated heat is critical to the overall
performance of the device.
•
•
•
•
•
High purity ceramic substrate
Power rating to 2.5 W
Resistance range 10
to 30.1 k
Resistor tolerance to ± 0.1 %
TCR to ± 25 ppm/°C
Flame resistant UL 94 V-0
Power supplies
Power switching
Braking system
Test and measurement equipment
Motor deflection circuits
APPLICATIONS
TYPICAL PERFORMANCE
ABSOLUTE
TCR
TOL.
25
0.1
STANDARD ELECTRICAL SPECIFICATIONS
TEST
Material
Resistance Range
TCR: Absolute
Tolerance: Absolute
Power Rating: Resistor
Stability: Absolute
Stability: Ratio
Voltage Coefficient
Working Voltage
Operating Temperature Range
Storage Temperature Range
Noise
Shelf Life Stability: Absolute
SPECIFICATIONS
Nichrome
10
to 30.1 k
25 ppm/°C, 50 ppm/°C (standard)
and, 100 ppm/°C
0.1 %, 0.5 %, 1.0 % and, 5.0 %
0.375 W - 2.5 W
(1)
R
0.1 %
Not applicable
< 0.1 ppm/V
75 V to 200 V
-55 °C to +155 °C
-55 °C to +155 °C
< -30 dB
± 0.01 %
CONDITIONS
-
-
-55 °C to +125 °C
+25 °C
Maximum at +70 °C
2000 h at +70 °C
-
-
-
-
-
-
1 year at +25 °C
COMPONENT RATINGS
CASE SIZE
POWER RATING (mW)
0603
375
(1)
0805
625
(1)
1206
1000
(1)
2512
2500
(1)
Note
(1)
Dependent on component mounting by user.
WORKING VOLTAGE (V)
75
100
200
200
RESISTANCE RANGE ()
10 to 30.1K
10 to 30.1K
10 to 30.1K
10 to 30.1K
ENVIRONMENTAL TESTS
(Vishay Performance vs. MIL-PRF-55342 Requirements)
ENVIRONMENTAL TEST
Resistance Temperature Characteristic
Maximum Ambient Temperature at Rated Wattage
Maximum Ambient Temperature at Power Derating
Thermal Shock
Low Temperature Operation
Short Time Overload
High Temperature Exposure
Resistance to Soldering Heat
Moisture Resistance
Life at +70 °C for 2000 h
Revision: 27-Jun-16
LIMITS MIL-PRF-55342
CHARACTERISTIC “E”
± 25 ppm/°C
+70 °C
+150 °C
± 0.1 %
± 0.1 %
± 0.1 %
± 0.1 %
± 0.2 %
± 0.2 %
± 0.5 %
TYPICAL VISHAY PERFORMANCE
± 15 ppm/°C
+70 °C
+150 °C
± 0.04 %
± 0.001 %
± 0.003 %
± 0.030 %
± 0.007 %
± 0.002 %
± 0.100 %
Document Number: 60076
1
For technical questions, contact:
thinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
PHP
www.vishay.com
Vishay Dale Thin Film
DIMENSIONS
in inches
D
T
E
L
W
CASE SIZE
0603
0805
1206
2512
LENGTH
0.064 ± 0.006
0.080 ± 0.006
0.126 ± 0.008
0.259 + 0.009/- 0.015
WIDTH
W (± 0.005)
0.032
0.050
0.063
0.124
THICKNESS
MIN./MAX.
0.020 max.
0.015/0.033
0.015/0.033
0.015/0.033
TOP PAD
D (± 0.005)
0.012
0.016
0.020 + 0.005/- 0.010
0.02
BOTTOM PAD
E (± 0.005)
0.021
0.025
0.040
0.050
LAND PATTERN DIMENSIONS
in inches
0603 Land Pattern
0.0920
0.0340
0.0710
0.0140
0.0390
0.0755
0.0220
1206 Land Pattern
0.1730
0805 Land Pattern
0.1050
2512 Land Pattern
0.2910
0.0520
0.0200
0.0425
0.1260
0.1090
0.0910
STANDARD MATERIAL SPECIFICATIONS
Resistive Element
Substrate Material
Terminations (Tin/Lead)
Terminations (Lead (Pb)-free)
Nichrome
Alumina (Al
2
O
3
)
Tin/lead solder over nickel barrier
Tin/silver/copper (Sn96.5Ag3.0Cu0.5) solder over nickel barrier
Revision: 27-Jun-16
Document Number: 60076
2
For technical questions, contact:
thinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
PHP
www.vishay.com
Vishay Dale Thin Film
PHP CHIP TEMP. VS. APPLIED POWER
5.00
4.50
4.00
3.50
3.00
2.50
2.00
1.50
1.00
0.50
0.00
0805 - 100
Ω
0805 - 5 kΩ
0805 - 20 kΩ
PHP CHIP TEMP. VS. APPLIED POWER
5.00
4.50
4.00
3.50
3.00
2.50
2.00
1.50
1.00
0.50
0.00
0603 - 100
Ω
0603 - 5 kΩ
0603 - 18.8 kΩ
Applied Power (W)
70
150
200
Applied Power (W)
70
150
200
Chip
Surface
Temperature (°C)
Chip
Surface
Temperature (°C)
Note
• Chip surface temperature measured using FLIR SC645 thermal
imaging system with an approximate test card surface
temperature of 85 °C.
Note
• Chip surface temperature measured using FLIR SC645 thermal
imaging system with an approximate test card surface
temperature of 85 °C.
PHP CHIP TEMP. VS. APPLIED POWER
5.00
4.50
4.00
3.50
3.00
2.50
2.00
1.50
1.00
0.50
0.00
1206 - 100
Ω
1206 - 5 kΩ
1206 - 10 kΩ
PHP CHIP TEMP. VS. APPLIED POWER
10.00
9.00
8.00
7.00
6.00
5.00
4.00
3.00
2.00
1.00
0.00
2512 - 10
Ω
2512 - 10 kΩ
2512 - 30 kΩ
Applied Power (W)
Applied Power (W)
70
150
200
70
150
200
Chip
Surface
Temperature (°C)
Notes
• Chip surface temperature measured using FLIR A40 thermal
imaging system with an approximate test card surface
temperature of 25 °C.
• Thermal imaging was conducted under ambient conditions
resulting in a steady state test card surface temperature of 85 °C
over the full range of power levels.
• Thermal imaging and load life testing was conducted mounting
one device to 2" x 3" test cards with 2.5 mil copper plating on
both surfaces. Thermal vias on 120 mil centers were utilized for
heat transfer between surfaces of the test card.
Chip
Surface
Temperature (°C)
Notes
• Chip surface temperature measured using FLIR A40 thermal
imaging system with an approximate test card surface
temperature of 25 °C.
Case Size
Resistance
Value
Temperature
70
150
200
2512
Up to 10
2512
Up to 10 k
Power (W)
2.44
6.82
9.33
1.81
4.89
6.63
1.87
5.19
7.09
2512
Up to 30 k
Revision: 27-Jun-16
Document Number: 60076
3
For technical questions, contact:
thinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
PHP
www.vishay.com
Vishay Dale Thin Film
SINGLE PULSE CURVES
1000
100
Ω
- 2512
100
Ω
- 1206
Pulse Power (W)
100
10
1
100
Ω
- 0805
100
Ω
- 0603
0.1
0.00001
0.0001
0.001
0.01
0.1
1
10
Pulse Duration (s)
DERATING CURVE
100
Percent of Rated Power
80
60
40
20
0
0
70
125
155
Ambient Temperature °C
GLOBAL PART NUMBER INFORMATION
P
GLOBAL
MODEL
PHP
H
P
0
CASE
SIZE
0603
0805
1206
2512
1
2
0
6
E
1
0
0
2
B
B
T
1
SUBSTRATE
0
= Alumina
TCR
E
=
± 25 ppm/°C
H
=
± 50 ppm/°C
K
=
± 100 ppm/°C
RESISTANCE
The first 3 digits
are significant
figures and the
last digit
specifies the
number of
zeros to follow.
“R” designates
the decimal
point.
Example:
10R0 = 10
1000 = 100
1001 = 1 k
TOLERANCE
TERMINATION
PACKAGING
BS
= BULK
100 min., 1 mult
WS
= WAFFLE
100 min., 1 mult
WI
= WAFFLE
(item single lot
day code)
100 min., 1 mult
TAPE AND REEL
T1
= 1000 min.,
1000 mult
T3
= 300 min., 300 mult
T5
= 500 min., 500 mult
TF
= Full reel
TS
= 100 min., 1 mult
TI
= 100 min., 1 mult
(item single lot
date code)
TP
= 100 min., 1 mult
(package unit
single lot date)
B
= ± 0.1 %
B
= Wraparound
Sn/Pb solder
D
= ± 0.5 %
w/nickel barrier
F
= ± 1.0 %
G
= ± 2.0 %
J
= ± 5.0 %
S
= Wraparound
lead (Pb)-free solder
SAC-305
RoHS-compliant - e1
Revision: 27-Jun-16
Document Number: 60076
4
For technical questions, contact:
thinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
Legal Disclaimer Notice
www.vishay.com
Vishay
Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
disclosure relating to any product.
Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or
the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular
purpose, non-infringement and merchantability.
Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of
typical requirements that are often placed on Vishay products in generic applications. Such statements are not binding
statements about the suitability of products for a particular application. It is the customer’s responsibility to validate that a
particular product with the properties described in the product specification is suitable for use in a particular application.
Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over
time. All operating parameters, including typical parameters, must be validated for each customer application by the customer’s
technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase,
including but not limited to the warranty expressed therein.
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
applications or for any other application in which the failure of the Vishay product could result in personal injury or death.
Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk.
Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for
such applications.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document
or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners.
© 2017 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED
Revision: 08-Feb-17
1
Document Number: 91000
Power technology
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