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P13U0R1J500GB

Description
Ceramic Capacitor, Ceramic, 50V, -/+30ppm/Cel TC, 0.0000001uF, 0101
CategoryPassive components    capacitor   
File Size179KB,3 Pages
ManufacturerCapax Technologies Inc
Websitehttp://www.capaxtechnologies.com/
Environmental Compliance
Download Datasheet Parametric View All

P13U0R1J500GB Overview

Ceramic Capacitor, Ceramic, 50V, -/+30ppm/Cel TC, 0.0000001uF, 0101

P13U0R1J500GB Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
Reach Compliance Codecompliant
ECCN codeEAR99
capacitance1e-7 µF
Capacitor typeCERAMIC CAPACITOR
Custom functionsBulk Packaging On Request
dielectric materialsCERAMIC
high0.127 mm
JESD-609 codee4
length0.33 mm
multi-layerNo
negative tolerance5%
Number of terminals2
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package formSMT
method of packingWaffle Pack
positive tolerance5%
Rated (DC) voltage (URdc)50 V
size code0101
Temperature Coefficient-/+30ppm/Cel ppm/°C
Terminal surfaceGold (Au) - with Nickel (Ni) barrier
width0.33 mm
Base Number Matches1
Technologies, Inc
Ceramic Single-Layer
Microwave Capacitors
Parallel Plate Ceramic Single Layer Microwave Capacitors (SLCs)
are ideally suited for applications such as GaAs integrated
circuits, microwave integrated circuits, DC block, bypass, and tuning,
and RF/microwave components. The SLC design offers
increased capacitance for additional bandwidth, increased stability in
capacitance over various temperatures, and more capacitance in
smaller case sizes for greater board density.
SLCs are suitable solutions for applications that require:
Through 40 GHz with minimum insertion loss.
Specified material from a selection of fourteen standard
dielectric options.
Imperviousness to electrostatic discharge and more ruggedness than MOS/MNS capacitors.
Gold plated electrode termination, which is compatible with solder, eutectic, epoxy and wire
bonding production methods.
General Specifications
M
ECHANICAL
H
IGH
R
ELIABILITY
T
ESTING
Bond Strength: Exceeds MIL-STD-883,
Method 2011 Destructive Bond Pull Test
Die Shear Strength: Exceeds applicable
MIL-STD-883 requirements.
Low Voltage Humidity: Paragraph 3.17, MIL-C-49464
Burn-in/Life Test: MIL-STD-202, Method 108, Condition A/F
Solderability: MIL-STD-202, Method 208
Group A: 100 Hour burn-in, 100% screening.
Group B: Group A tests, solderability, bond strength,
die shear strength, and temperature coefficient.
Group C: Group B tests, thermal shock, resistance to
soldering heat, low voltage humidity, and life test.
E
NVIRONMENTAL
S
TRIPLINE
T
HICKNESS
C
AP
L
W
C
ASE
D
IMENSIONS
in
Case Size
Width (W)
Length (L)
Thickness
(50V)
Thickness
(100V)
P10
.010
(.254)
.010
(.254)
.005
(.127)
.007
(.178)
Inches (mm)
P13
.013
(.330)
.013
(.330)
.005
(.127)
.007
(.178)
P15
.015
(.381)
.015
(.381)
.005
(.127)
.007
(.178)
P20
.020
(.508)
.020
(.508)
.005
(.127)
.007
(.178)
P25
.025
(.635)
.025
(.635)
.005
(.127)
.007
(.178)
P30
.030
(.762)
.030
(.762)
.005
(.127)
.007
(.178)
P35
.035
(.889)
.035
(.889)
.005
(.127)
.007
(.178)
P40
.040
(1.02)
.040
(1.02)
.005
(.127)
.007
(.178)
P50
.050
(1.27)
.050
(1.27)
.008
(.203)
P70
.070
(1.78)
.070
(1.78)
.008
(.203)
P90
.90
(2.29)
.100
(2.54)
.009
(.229)
PA0
.100
(2.54)
.100
(2.54)
.010
(.254)
** Tolerance: ±.002 (.050) or 10%
C
APAX
T
ECHNOLOGIES
, I
NC
º
24842 A
VE
T
IBBITTS
º
V
ALENCIA
, C
A
º
91355
º
661.257.7666
º
F
AX
: 661.257.4819
WWW
.C
APAX
T
ECHNOLOGIES
.C
OM
º
P
AGE
1
º

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