0
R
XC95288XL High Performance
CPLD
0
5
DS055 (v2.1 April 3, 2007
Product Specification
cations and computing systems. It is comprised of 16
54V18 Function Blocks, providing 6,400 usable gates with
propagation delays of 6 ns. See
Figure 2
for architecture
overview.
Features
•
•
•
•
6 ns pin-to-pin logic delays
System frequency up to 208 MHz
288 macrocells with 6,400 usable gates
Available in small footprint packages
- 144-pin TQFP (117 user I/O pins)
- 208-pin PQFP (168 user I/O pins)
- 256-pin BGA (192 user I/O pins)
- 256-pin FBGA (192 user I/O pins)
- 280-pin CSP (192 user I/O pins)
- Pb-free available for all packages
Optimized for high-performance 3.3V systems
- Low power operation
- 5V tolerant I/O pins accept 5V, 3.3V, and 2.5V
signals
- 3.3V or 2.5V output capability
- Advanced 0.35 micron feature size CMOS
Fast FLASH™ technology
Advanced system features
- In-system programmable
- Superior pin-locking and routability with
Fast CONNECT™ II switch matrix
- Extra wide 54-input Function Blocks
- Up to 90 product-terms per macrocell with
individual product-term allocation
- Local clock inversion with three global and one
product-term clocks
- Individual output enable per output pin with local
inversion
- Input hysteresis on all user and boundary-scan pin
inputs
- Bus-hold circuitry on all user pin inputs
- Full IEEE Standard 1149.1 boundary-scan (JTAG)
Fast concurrent programming
Slew rate control on individual outputs
Enhanced data security features
Excellent quality and reliability
- Endurance exceeding 10,000 program/erase
cycles
- 20 year data retention
- ESD protection exceeding 2,000V
Pin-compatible with 5V-core XC95288 device in the
208-pin HQFP package
Power Estimation
Power dissipation in CPLDs can vary substantially depend-
ing on the system frequency, design application and output
loading. To help reduce power dissipation, each macrocell
in a XC9500XL device may be configured for low-power
mode (from the default high-performance mode). In addi-
tion, unused product-terms and macrocells are automati-
cally deactivated by the software to further conserve power.
For a general estimate of I
CC
, the following equation may be
used:
I
CC
(mA) = MC
HS
(0.175*PT
HS
+ 0.345) + MC
LP
(0.052*PT
LP
+ 0.272) + 0.04 * MC
TOG
(MC
HS
+MC
LP
)* f
where:
MC
HS
= # macrocells in high-speed configuration
PT
HS
= average number of high-speed product terms
per macrocell
MC
LP
= # macrocells in low power configuration
PT
LP
= average number of low power product terms per
macrocell
f = maximum clock frequency
MCTOG = average % of flip-flops toggling per clock
(~12%)
This calculation was derived from laboratory measurements
of an XC9500XL part filled with 16-bit counters and allowing
a single output (the LSB) to be enabled. The actual I
CC
value varies with the design application and should be veri-
fied during normal system operation.
Figure 1
shows the
above estimation in a graphical form. For a more detailed
discussion of power consumption in this device, see Xilinx
•
•
•
•
•
•
•
WARNING: Programming temperature range of
T
A
= 0° C to +70° C
Description
The XC95288XL is a 3.3V CPLD targeted for high-perfor-
mance, low-voltage applications in leading-edge communi-
© 1998-2007 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at
http://www.xilinx.com/legal.htm.
All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.
DS055 (v2.1 April 3, 2007
Product Specification
www.xilinx.com
1-800-255-7778
1
XC95288XL High Performance CPLD
R
Absolute Maximum Ratings
(2)
Symbol
V
CC
V
IN
V
TS
T
STG
T
J
Description
Supply voltage relative to GND
Input voltage relative to GND
(1)
Voltage applied to 3-state output
(1)
Storage temperature (ambient)
(3)
Junction temperature
Value
–0.5 to 4.0
–0.5 to 5.5
–0.5 to 5.5
–65 to +150
+150
Units
V
V
V
o
C
o
C
Notes:
1. Maximum DC undershoot below GND must be limited to either 0.5V or 10 mA, whichever is easier to achieve. During transitions, the
device pins may undershoot to –2.0V or overshoot to +7.0V, provided this over- or undershoot lasts less than 10 ns and with the
forcing current being limited to 200 mA. External I/O voltage may not exceed V
CCINT
by 4.0V.
2. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress
ratings only, and functional operation of the device at these or any other conditions beyond those listed under Operating Conditions
is not implied. Exposure to Absolute Maximum Ratings conditions for extended periods of time may affect device reliability.
3. For soldering guidelines and thermal considerations, see the
Device Packaging
information on the Xilinx website. For Pb-free
packages, see
XAPP427.
Recommended Operation Conditions
Symbol
V
CCINT
V
CCIO
V
IL
V
IH
V
O
Parameter
Supply voltage for internal logic
and input buffers
Commercial T
A
= 0
o
C to 70
o
C
Industrial T
A
= –40
o
C to +85
o
C
Min
3.0
3.0
3.0
2.3
0
2.0
0
Max
3.6
3.6
3.6
2.7
0.80
5.5
V
CCIO
Units
V
V
V
V
V
V
V
Supply voltage for output drivers for 3.3V operation
Supply voltage for output drivers for 2.5V operation
Low-level input voltage
High-level input voltage
Output voltage
Quality and Reliability Characteristics
Symbol
T
DR
N
PE
V
ESD
Data Retention
Program/Erase Cycles (Endurance)
Electrostatic Discharge (ESD)
Parameter
Min
20
10,000
2,000
Max
-
-
-
Units
Years
Cycles
Volts
DC Characteristic Over Recommended Operating Conditions
Symbol
V
OH
V
OL
I
IL
I
IH
I
IH
Parameter
Output high voltage for 3.3V outputs
Output high voltage for 2.5V outputs
Output low voltage for 3.3V outputs
Output low voltage for 2.5V outputs
Input leakage current
I/O high-Z leakage current
I/O high-Z leakage current
Test Conditions
I
OH
= –4.0 mA
I
OH
= –500
μA
I
OL
= 8.0 mA
I
OL
= 500
μA
V
CC
= Max; V
IN
= GND or V
CC
V
CC
= Max; V
IN
= GND or V
CC
V
CC
= Max; V
CCIO
= Max;
V
IN
= GND or 3.6V
V
CC
Min < V
IN
< 5.5V
C
IN
I
CC
I/O capacitance
Operating supply current
(low power mode, active)
V
IN
= GND; f = 1.0 MHz
V
IN
= GND, No load; f = 1.0 MHz
Min
2.4
90% V
CCIO
-
-
-
-
-
-
-
85 (Typical)
Max
-
-
0.4
0.4
±10
±10
±10
±50
10
Units
V
V
V
V
μA
μA
μA
μA
pF
mA
4
www.xilinx.com
1-800-255-7778
DS055 (v2.1 April 3, 2007
Product Specification
PCB Design
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