IC fpga 324 I/O 456fbga
Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Maker | XILINX |
Parts packaging code | BGA |
package instruction | 23 X 23 MM, 1 MM PITCH, LEAD FREE, MO-034AAJ-1, FBGA-456 |
Contacts | 456 |
Reach Compliance Code | unknown |
ECCN code | 3A991.D |
maximum clock frequency | 750 MHz |
Combined latency of CLB-Max | 0.39 ns |
JESD-30 code | S-PBGA-B456 |
JESD-609 code | e1 |
length | 23 mm |
Humidity sensitivity level | 3 |
Configurable number of logic blocks | 1280 |
Equivalent number of gates | 1000000 |
Number of entries | 324 |
Number of logical units | 11520 |
Output times | 324 |
Number of terminals | 456 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | |
organize | 1280 CLBS, 1000000 GATES |
Package body material | PLASTIC/EPOXY |
encapsulated code | BGA |
Encapsulate equivalent code | BGA456,22X22,40 |
Package shape | SQUARE |
Package form | GRID ARRAY |
Peak Reflow Temperature (Celsius) | 250 |
power supply | 1.5,1.5/3.3,3.3 V |
Programmable logic type | FIELD PROGRAMMABLE GATE ARRAY |
Certification status | Not Qualified |
Maximum seat height | 2.6 mm |
Maximum supply voltage | 1.575 V |
Minimum supply voltage | 1.425 V |
Nominal supply voltage | 1.5 V |
surface mount | YES |
technology | CMOS |
Temperature level | OTHER |
Terminal surface | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) |
Terminal form | BALL |
Terminal pitch | 1 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | 30 |
width | 23 mm |
Base Number Matches | 1 |