All multiple inputs and outputs must be shorted together
1/2 ; 5/6 ; 7/8 ; 9/10 ; 11/12
Absolute maximum ratings
Symbol
V
R
V
RRM
I
F
I
FSM
Parameter
Maximum DC reverse Voltage
Maximum Peak Repetitive Reverse Voltage
DC Forward Current
Non-Repetitive Forward Surge Current
Max ratings
1600
t=10ms
T
C
= 80°C
T
J
= 45°C
70
600
Unit
V
A
APTDR70X1601G – Rev 0 August, 2007
These Devices are sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed. See application note
APT0502 on www.microsemi.com
www.microsemi.com
1-3
APTDR70X1601G
All ratings @ T
j
= 25°C unless otherwise specified
Electrical Characteristics
Symbol Characteristic
I
R
V
F
V
T
r
T
Reverse Current
Forward Voltage
On – state Voltage
On – state Slope resistance
Test Conditions
V
R
= 1600V
I
F
= 70A
T
j
= 25°C
T
j
= 125°C
T
j
= 25°C
T
j
= 125°C
Min
Typ
20
3
1.3
1.1
0.8
6.5
Max
Unit
µA
mA
V
V
mΩ
Thermal and package characteristics
Symbol
R
thJC
V
ISOL
T
J
T
STG
T
C
Torque
Wt
Characteristic
Junction to Case Thermal Resistance
RMS Isolation Voltage, any terminal to case t =1 min, I isol<1mA, 50/60Hz
Min
3500
-40
-40
-40
2.5
Typ
Max
1.2
150
125
100
4.7
80
Unit
°C/W
V
°C
N.m
g
Operating junction temperature range
Storage Temperature Range
Operating Case Temperature
Mounting torque
Package Weight
To heatsink
M4
SP1 Package outline
(dimensions in mm)
See application note 1904 - Mounting Instructions for SP1 Power Modules on www.microsemi.com
www.microsemi.com
2-3
APTDR70X1601G – Rev 0 August, 2007
APTDR70X1601G
Typical Performance Curve
Forward Characteristic
140
120
100
I
F
(A)
80
60
40
20
0
0.0
0.4
0.8
V
F
(V)
1.2
1.6
2.0
T
J
=25°C
Non-Repetitive Forward Surge Current
600
500
I
FSM
(A)
T
J
=45°C
T
J
=125°C
400
300
200
100
0
0.01
t (s)
50Hz
80% V
RRM
T
J
=125°C
0.1
maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration
1.4
Thermal Impedance (°C/W)
1.2
1
0.8
0.6
0.4
0.2
0.5
0.3
0.1
Single Pulse
0.0001
0.001
0.01
0.1
1
10
0.9
0.7
0.05
0
0.00001
Rectangular Pulse Duration in Seconds
Microsemi reserves the right to change, without notice, the specifications and information contained herein
Microsemi's products are covered by one or more of U.S patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522
5,262,336 6,503,786 5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,058 and foreign patents. U.S and Foreign patents pending. All Rights Reserved.
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