SFM
Vishay Electro-Films
Thin Film Top-Contact Resistor
CHIP
RESISTORS
FEATURES
•
Wire bondable
Product may not
be to scale
•
Small size: 0.020 inches square
•
Resistance range: 1.0
Ω
to 1 MΩ
•
DC power rating: 250 mW
•
Oxidized silicon substrate for good power dissipation
•
Resistor material tantalum nitride, self passivating
•
Moisture resistant
The SFM series single-value resistor chips offer a small size,
wide ohmic value range and excellent power capacity.
The SFMs tantalum nitride resistor material offers excellent
resistance to high moisture environments.
The SFMs are manufactured using Vishay Electro-Films
(EFI) sophisticated thin film equipment and manufacturing
technology. The SFMs are 100 % electrically tested and
visually inspected to MIL-STD-883.
APPLICATIONS
Vishay EFI SFM top-contact resistor chips are designed to handle substantial power loads in many types of hybrid packages.
They are ideally suited for this purpose because of their small size.
TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES AND TOLERANCES
Tightest Standard Tolerance Available
1%
0.5 %
0.1 %
± 25 ppm/°C
± 50 ppm/°C
± 100 ppm/°C
± 250 ppm/°C
PROCESS CODE
CLASS H*
050
051
045
040
*MIL-PRF-38534 inspection criteria
CLASS K*
123
122
121
120
1
Ω
10
Ω
30
Ω
100
Ω
200 kΩ 360 kΩ 620 kΩ 1 MΩ
STANDARD ELECTRICAL SPECIFICATIONS
PARAMETER
Noise, MIL-STD-202, Method 308
100
Ω
- 250 kΩ
< 100
Ω
or > 251 kΩ
Moisture Resistance, MIL-STD-202
Method 106
Stability, 1000 h, + 125 °C, 125 mW
Operating Temperature Range
Thermal Shock, MIL-STD-202,
Method 107, Test Condition F
High Temperature Exposure, + 150 °C, 100 h
Dielectric Voltage Breakdown
Insulation Resistance
Operating Voltage
DC Power Rating at + 70 °C (Derated to Zero at + 175 °C)
5 x Rated Power Short-Time Overload, + 25 °C, 5 s
- 35 dB typ.
- 20 dB typ.
± 0.5 % max.
ΔR/R
± 0.25 % max.
ΔR/R
- 55 °C to + 125 °C
± 0.25 % max.
ΔR/R
± 0.5 % max.
ΔR/R
200 V
10
12
min.
100 V max.
250 mW
± 0.25 % max.
ΔR/R
www.vishay.com
38
For technical questions, contact: efi@vishay.com
Document Number: 61017
Revision: 12-Mar-08
SFM
Thin Film Top-Contact Resistor
Vishay Electro-Films
CONFIGURATIONS
in inches
0.004
0.020
0.020
CHIP
RESISTORS
0.007
0.020
0.016
0.006
0.004
0.004
0.004
0.016
TYPICAL RANGE
1
Ω
- 29
Ω
TYPICAL RANGE
30
Ω
-
819
Ω
TYPICAL RANGE
820
Ω
- 1 MΩ
SCHEMATIC
MECHANICAL SPECIFICATIONS
in inches
PARAMETER
Chip Size
Chip Thickness
Chip Substrate Material
Resistor Material
Bonding Pad Size
Number of Pads
Pad Material
Backing
Options:
Gold backing for eutectic die attach
Gold bonding pads, 15 kÅ minimum thickness
Consult Applications Engineer
0.020 x 0.020 ± 0.003 (0.5 x 0.5 ± 0.076 mm)
0.010 ± 0.002 (0.254 ± 0.05 mm)
Oxidized silicon, 10 kÅ minimum SiO
2
Tantalum nitride, self-passivating
0.004 x 0.004 (0.10 x 0.10 mm)
2
25 kÅ minimum aluminum
None, lapped semiconductor silicon
ORDERING INFORMATION
Example: 100 % visual, 10 kΩ, ± 1 %, ± 100 ppm/°C TCR, aluminum pads, class H visual inspection
W
INSPECTION/
PACKAGING
W = 100 % visually inspected
parts in matrix tray per
MIL-STD-883
X = Sample , commercial
visually inspected parts loaded
in matrix trays (4 % AQL)
SFM
PRODUCT
FAMILY
045
PROCESS
CODE
See Process Code
table
1000
RESISTANCE
VALUE
Use first 4 digits of
resistance
1
MULTIPLIER
CODE
D
= 0.0001
C
= 0.001
B
= 0.01
A
= 0.1
0
=1
1
= 10
2
= 100
3
= 1000
4
= 10 000
F
TOLERANCE
CODE
B
= 0.1 %
C
= 0.2 %
D
= 0.5 %
F
= 1.0 %
G
= 2.0 %
H
= 2.5 %
J
= 5.0 %
K
= 10 %
*Coating standard
Document Number: 61017
Revision: 12-Mar-08
For technical questions, contact: efi@vishay.com
www.vishay.com
39
Legal Disclaimer Notice
Vishay
Disclaimer
All product specifications and data are subject to change without notice.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein
or in any other disclosure relating to any product.
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any
information provided herein to the maximum extent permitted by law. The product specifications do not expand or
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed
therein, which apply to these products.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
document or by any conduct of Vishay.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless
otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such
applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting
from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding
products designed for such applications.
Product names and markings noted herein may be trademarks of their respective owners.
Document Number: 91000
Revision: 18-Jul-08
www.vishay.com
1
Wireless Connectivity
京公网安备 11010802033920号
EEWORLD
