FIFO, 1KX9, 50ns, Asynchronous, CMOS, PDIP28,
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | DALLAS |
| Reach Compliance Code | unknown |
| Maximum access time | 50 ns |
| Other features | RETRANSMIT |
| Maximum clock frequency (fCLK) | 15.38 MHz |
| JESD-30 code | R-PDIP-T28 |
| JESD-609 code | e0 |
| memory density | 9216 bit |
| Memory IC Type | OTHER FIFO |
| memory width | 9 |
| Number of functions | 1 |
| Number of terminals | 28 |
| word count | 1024 words |
| character code | 1000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| organize | 1KX9 |
| Output characteristics | 3-STATE |
| Exportable | NO |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP28,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | PARALLEL |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum standby current | 0.008 A |
| Maximum slew rate | 0.12 mA |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Base Number Matches | 1 |
| DS2010N-50 | DS2010N-80 | DS2010-80 | DS2010N-65 | |
|---|---|---|---|---|
| Description | FIFO, 1KX9, 50ns, Asynchronous, CMOS, PDIP28, | FIFO, 1KX9, 80ns, Asynchronous, CMOS, PDIP28, | FIFO, 1KX9, 80ns, Asynchronous, CMOS, PDIP28, | FIFO, 1KX9, 65ns, Asynchronous, CMOS, PDIP28, |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
| Maker | DALLAS | DALLAS | DALLAS | DALLAS |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| Maximum access time | 50 ns | 80 ns | 80 ns | 65 ns |
| Maximum clock frequency (fCLK) | 15.38 MHz | 10 MHz | 10 MHz | 12.5 MHz |
| JESD-30 code | R-PDIP-T28 | R-PDIP-T28 | R-PDIP-T28 | R-PDIP-T28 |
| JESD-609 code | e0 | e0 | e0 | e0 |
| memory density | 9216 bit | 9216 bit | 9216 bit | 9216 bit |
| Memory IC Type | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO |
| memory width | 9 | 9 | 9 | 9 |
| Number of functions | 1 | 1 | 1 | 1 |
| Number of terminals | 28 | 28 | 28 | 28 |
| word count | 1024 words | 1024 words | 1024 words | 1024 words |
| character code | 1000 | 1000 | 1000 | 1000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 85 °C | 85 °C | 70 °C | 85 °C |
| Minimum operating temperature | -40 °C | -40 °C | - | -40 °C |
| organize | 1KX9 | 1KX9 | 1KX9 | 1KX9 |
| Exportable | NO | NO | NO | NO |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | DIP | DIP | DIP |
| Encapsulate equivalent code | DIP28,.6 | DIP28,.6 | DIP28,.6 | DIP28,.6 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| power supply | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum standby current | 0.008 A | 0.008 A | 0.008 A | 0.008 A |
| Maximum slew rate | 0.12 mA | 0.12 mA | 0.12 mA | 0.12 mA |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL |
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