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CM1205-08CP

Description
Trans Voltage Suppressor Diode, 5.5V V(RWM), Unidirectional, 8 Element, Silicon, 3.10 X 1.15 MM, 0.68 MM HEIGHT, ROHS COMPLIANT, CSP-10
CategoryDiscrete semiconductor    diode   
File Size160KB,7 Pages
ManufacturerCalifornia Micro Devices
Environmental Compliance
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CM1205-08CP Overview

Trans Voltage Suppressor Diode, 5.5V V(RWM), Unidirectional, 8 Element, Silicon, 3.10 X 1.15 MM, 0.68 MM HEIGHT, ROHS COMPLIANT, CSP-10

CM1205-08CP Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerCalifornia Micro Devices
Parts packaging codeCSP
package instructionR-PBGA-B10
Contacts10
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum clamping voltage12 V
ConfigurationCOMMON ANODE, 8 ELEMENTS
Diode component materialsSILICON
Diode typeTRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 codeR-PBGA-B10
JESD-609 codee1
Humidity sensitivity level1
Number of components8
Number of terminals10
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)NOT SPECIFIED
polarityUNIDIRECTIONAL
Certification statusNot Qualified
Maximum repetitive peak reverse voltage5.5 V
surface mountYES
technologyAVALANCHE
Terminal surfaceTIN SILVER COPPER
Terminal formBALL
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
Base Number Matches1
CM1205
ESD Protection Arrays, Chip Scale Package
Features
Functionally and pin compatible with CAMD’s
PACDN1404C, PACDN1408C and PACDN1416C
family of ESD protection devices
4, 8, or 16 transient voltage suppressors in a single
package
Optiguard
TM
coated for improved reliability at
assembly
In-system Electrostatic Discharge (ESD) protection
to +25kV contact discharge per IEC 61000-4-2
international standard
Compact Chip Scale Package (0.65mm pitch) for-
mat saves board space and eases layout in space
critical applications compared to discrete solutions
and traditional wire bonded packages
Lead-free versions available
Product Description
The CM1205 family of transient voltage suppressor
arrays provides a very high level of protection for sensi-
tive electronic components that may be subjected to
ESD.
These devices are designed and characterized to
safely dissipate ESD strikes at levels well beyond the
maximum requirements set forth in the IEC 61000-4-2
international standard (Level 4, +8kV contact dis-
charge). All I/Os are rated at +25kV using the IEC
61000-4-2 contact discharge method. Using the MIL-
STD-883D (Method 3015) specification for Human
Body Model (HBM) ESD, all pins are protected for con-
tact discharges to greater than +30kV.
The Chip Scale Package format of these devices
enable extremely small footprints that are necessary in
portable electronics such as cellular phones, PDAs,
internet appliances and PCs. The large solder bumps
allow for standard attachment to laminate boards with-
out the use of underfill.
The CM1205 features OptiGuard
TM
coating for
improved reliability at assembly and is available with
optional lead-free finishing.
Applications
ESD protection for sensitive electronic equipment
I/O port, keypad and button circuitry protection for
portable devices
Wireless Handsets
Handheld PCs / PDAs
MP3 Players
Digital Cameras and Camcorders
Notebooks
Desktop PCs
Electrical Schematic
B1
B2
B3
B1
B2
B3
B4
B5
D1
D2
D3
D4
D5
A1
A2
A3
A1
A2
A3
A4
A5
C1
B1
C2
B2
C3
B3
C4
B4
C5
B5
CM1205-04CS/CP
CM1205-08CS/CP
A1
A2
A3
A4
A5
CM1205-16CS/CP
© 2003 California Micro Devices Corp. All rights reserved.
11/17/03
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
L
Tel: 408.263.3214
L
Fax: 408.263.7846
L
www.calmicro.com
1

CM1205-08CP Related Products

CM1205-08CP CM1205-04CP CM1205-08CS CM1205-04CS CM1205-16CP CM1205-16CS
Description Trans Voltage Suppressor Diode, 5.5V V(RWM), Unidirectional, 8 Element, Silicon, 3.10 X 1.15 MM, 0.68 MM HEIGHT, ROHS COMPLIANT, CSP-10 Trans Voltage Suppressor Diode, 5.5V V(RWM), Unidirectional, 4 Element, Silicon, CSP-6 Trans Voltage Suppressor Diode, 5.5V V(RWM), Unidirectional, 8 Element, Silicon, CSP-10 Trans Voltage Suppressor Diode, 5.5V V(RWM), Unidirectional, 4 Element, Silicon, CSP-6 Trans Voltage Suppressor Diode, 5.5V V(RWM), Unidirectional, 16 Element, Silicon, CSP-20 Trans Voltage Suppressor Diode, 5.5V V(RWM), Unidirectional, 16 Element, Silicon, CSP-20
Is it Rohs certified? conform to conform to incompatible incompatible conform to incompatible
Maker California Micro Devices California Micro Devices California Micro Devices California Micro Devices California Micro Devices California Micro Devices
Parts packaging code CSP CSP CSP CSP CSP CSP
package instruction R-PBGA-B10 R-PBGA-B6 R-PBGA-B10 R-PBGA-B6 R-PBGA-B20 R-PBGA-B20
Contacts 10 6 10 6 20 20
Reach Compliance Code unknown unknown unknown unknown unknown unknown
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum clamping voltage 12 V 12 V 12 V 12 V 12 V 12 V
Configuration COMMON ANODE, 8 ELEMENTS COMMON ANODE, 4 ELEMENTS COMMON ANODE, 8 ELEMENTS COMMON ANODE, 4 ELEMENTS COMMON ANODE, 16 ELEMENTS COMMON ANODE, 16 ELEMENTS
Diode component materials SILICON SILICON SILICON SILICON SILICON SILICON
Diode type TRANS VOLTAGE SUPPRESSOR DIODE TRANS VOLTAGE SUPPRESSOR DIODE TRANS VOLTAGE SUPPRESSOR DIODE TRANS VOLTAGE SUPPRESSOR DIODE TRANS VOLTAGE SUPPRESSOR DIODE TRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 code R-PBGA-B10 R-PBGA-B6 R-PBGA-B10 R-PBGA-B6 R-PBGA-B20 R-PBGA-B20
JESD-609 code e1 e1 e0 e0 e1 e0
Number of components 8 4 8 4 16 16
Number of terminals 10 6 10 6 20 20
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Celsius) NOT SPECIFIED 250 220 220 250 220
polarity UNIDIRECTIONAL UNIDIRECTIONAL UNIDIRECTIONAL UNIDIRECTIONAL UNIDIRECTIONAL UNIDIRECTIONAL
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum repetitive peak reverse voltage 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
surface mount YES YES YES YES YES YES
technology AVALANCHE AVALANCHE AVALANCHE AVALANCHE AVALANCHE AVALANCHE
Terminal surface TIN SILVER COPPER TIN SILVER COPPER TIN LEAD TIN LEAD TIN SILVER COPPER TIN LEAD
Terminal form BALL BALL BALL BALL BALL BALL
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED

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