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CMF040224K1%50PPM/KNS

Description
Fixed Resistor, Thin Film, 0.063W, 24000ohm, 50V, 1% +/-Tol, 50ppm/Cel, Surface Mount, 0402, CHIP
CategoryPassive components    The resistor   
File Size396KB,2 Pages
ManufacturerMicrotech GmbH Electronic
Environmental Compliance
Download Datasheet Parametric View All

CMF040224K1%50PPM/KNS Overview

Fixed Resistor, Thin Film, 0.063W, 24000ohm, 50V, 1% +/-Tol, 50ppm/Cel, Surface Mount, 0402, CHIP

CMF040224K1%50PPM/KNS Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Objectid8299735432
package instructionCHIP
Reach Compliance Codecompliant
Country Of OriginGermany
ECCN codeEAR99
YTEOL8.05
Other featuresHIGH-PRECISION
structureChip
JESD-609 codee3
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature155 °C
Minimum operating temperature-55 °C
Package height0.35 mm
Package length1.19 mm
Package shapeRECTANGULAR PACKAGE
Package formSMT
Package width0.55 mm
method of packingBULK
Rated power dissipation(P)0.063 W
Rated temperature70 °C
GuidelineTS 16949
resistance24000 Ω
Resistor typeFIXED RESISTOR
size code0402
surface mountYES
technologyTHIN FILM
Temperature Coefficient50 ppm/°C
Terminal surfaceTin (Sn) - with Nickel (Ni) barrier
Terminal shapeWRAPAROUND
Tolerance1%
Operating Voltage50 V

CMF040224K1%50PPM/KNS Preview

microtech GmbH electronic Teltow
Chip resistors - Made in Germany
Thin film series
Type: CMF
Sizes: 0402, 0603, 0805, 1206, 1210, 1218, 2010, 2512
Characteristics:
Chip resistors in thin film technology
High-precision resistor layers
Resistance area coated with surface passivation
Highest stability and reliability
Very tight tolerances (≥0,05%) - low temperature coefficient (≥10ppm/K)
Low current noise, good pulse strength
R-Value-Matching available
RoHS-conform
Sulfur resistance verified according to ASTM B 809
Order quantities from 1000 pieces for <1% and <TCR 50 available by extra charge
Customer specific barcodes available - also in 2D
All sizes can be manufactured with the following contact variants
Electroplated pure tin
Contact with low rest permeability -N, suitable only for reflow soldering method
(The recommended storage time should not exceed 1 year after delivery)
Epoxy bondable contact -K
Size
L
Length
Min
Max
ISO/TS 16949:2009
ISO 14001:2009
Dimensions (in mm):
W
Width
Min
Max
H
Depth
Min
Max
t
Contact
back
Min
Max
T
Contact
front
Min
Max
H
0402
0603
0805
1206
1210
1218
2010
2512
0,95
1,50
1,85
2,90
3,00
3,00
4,80
6,10
1,10
1,70
2,15
3,35
3,30
3,30
5,20
6,50
0,45
0,75
1,10
1,45
2,35
4,50
2,30
3,00
0,60
0,95
1,40
1,75
2,65
4,80
2,70
3,30
0,25
0,35
0,35
0,35
0,50
0,50
0,50
0,50
0,40
0,55
0,65
0,65
0,75
0,75
0,75
0,75
0,10
0,10
0,15
0,25
0,35
0,35
0,35
0,35
0,35
0,50
0,60
0,75
0,85
0,85
0,85
0,85
0,05
0,10
0,15
0,15
0,25
0,25
0,25
0,25
0,35
0,50
0,60
0,75
0,85
0,85
0,85
0,85
T
L
W
t
Packaging units:
Reel
Ø
180 mm
330 mm
Samples on request
Card tape
acc. EN 60286-3
5 T pcs.
10 T pcs. for size 0402
10 T pcs.
20 T pcs.
4 T pcs.
8 T pcs.
16 T pcs.
Blister tape
Ordering information:
CMF
Type
-N
Contact
0603
Size
0402
.
to
.
2512
10k
0,1%
10ppm/K
±
TCR
10
15
25
50
K
Marking
P
Packaging
5
(optional)
R-
±
Tolerance
Value
1R
.
to
.
4M7
0,05
0,1
0,25
0,5
1
pcs. / Reel
(T pcs.)
Depends
on size
and
packaging
unit
CMF Standard (without
add.)
-N (non magnetic)
-K (epoxy bondable)
K- with
P- Card tape
(from size 0603) B- Blister tape
N- without
S- Bulk
(only size 0402)
Page 6
Revision: 14-Nov-17
Catalog microtech GmbH electronic
microtech GmbH electronic Teltow
ISO/TS 16949:2009
ISO 14001:2009
Chip resistors - Made in Germany
Thin film series
Type: CMF
Sizes: 0402, 0603, 0805, 1206, 1210, 1218, 2010, 2512
Technical data – depending on size:
Size
Precision
application
U
max
P
70
(V)
(W)
Professional
application
U
max
P
70
(V)
(W)
R-Range
R-Tolerance
(± %)
0,1 / 0,25 / 0,5 / 1
0,1 / 0,25 / 0,5 / 1
0,1 / 0,25 / 0,5 / 1
1
0,05 / 0,1 / 0,25 / 0,5 / 1
0,05 / 0,1 / 0,25 / 0,5 / 1
0,05 / 0,1 / 0,25 / 0,5 / 1
0,05 / 0,1 / 0,25 / 0,5 / 1
0,05 / 0,1 / 0,25 / 0,5 / 1
0,05 / 0,1 / 0,25 / 0,5 / 1
0,05 / 0,1 / 0,25 / 0,5 / 1
0,05 / 0,1 / 0,25 / 0,5 / 1
0,05 / 0,1 / 0,25 / 0,5 / 1
0,05 / 0,1 / 0,25 / 0,5 / 1
0,05 / 0,1 / 0,25 / 0,5 / 1
0,05 / 0,1 / 0,25 / 0,5 / 1
0,05 / 0,1 / 0,25 / 0,5 / 1
0,05 / 0,1 / 0,25 / 0,5 / 1
4)
1) 2)
TCR
(± ppm/K)
15
25
50
50
10 / 15
4)
25
50
10 / 15
4)
25
50
10
15
25
50
10 / 15
25
50
10 / 15
4)
5)
4)
4)
5)
Packaging
P
B
S
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
100R – 47k0
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
0402
12,5
0,016
50
0,063
100R – 221k
100R – 511k
10R0 – 1M00
100R – 332k
10R0 – 511k
1)
1R00 – 1M50
1) 2)
100R – 511k
10R0 – 1M00
1)
1R00 – 2M00
100R – 1M00
0603
25,0
0,032
75
0,100
0805
35,0
0,050
150
0,125
1206
50,0
0,100
200
0,250
35R0 – 1M00
10R0 – 2M00
1R00 – 4M70
1)
1) 2)
1210
2010
2512
1218
1)
50,0
100,0
100,0
50,0
0,100
0,150
0,250
0,300
200
300
500
200
0,500
0,500
1,000
1,000
100R – 1M00
10R0 – 2M00
10R0 – 4M70
100R – 1M00
1)
1)
2)
10R – 100R from
±
0,1% tolerance
1R – 10R from
±
0,5% tolerance
3)
For continuous operation sufficient heat dissipation must be ensured.
TCR
±
5 on request
TCR
±
10 on request
Technical data - general:
Technical data
Operating temperature range
Climatic category acc. EN 60068
Solderability acc. EN 60068-2-58
Soldering heat resistance acc. EN 60068-2-58
Long time stability
Storage 155°C / 1000 h
Endurance P
70
/ 70°C / 1000 h
Endurance P
70
/ 70°C / 8000 h
Endurance P
70
/ 70°C / 225000 h
1)
Damp heat, steady state (56d / 40°C / 96%)
1)
Precision application
-10°C … +85°C
10 / 85 / 56
245°C 3s
± (0,05% +0,01R) at 260°C 10s
± (0,1% +0,02R)
± (0,1% +0,02R)
± (0,25% +0,02R)
± (1,0% +0,02R)
± (0,1% +0,02R)
Professional application
-55°C … +155°C
55 / 155 / 56
245°C 3s
± (0,05% +0,01R) at 260°C 10s
± (0,25% +0,05R)
± (0,25% +0,05R)
± (0,5% +0,05R)
± (1,5% +0,05R)
± (0,25% +0,05R)
calculated acc. Arrhenius
Data, unless specified, acc. EN 140401-801.
Catalog microtech GmbH electronic
Revision: 01-Nov-16
Page 7

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