EEWORLDEEWORLDEEWORLD

Part Number

Search

PRA135C2-388KDWBT31

Description
Array/Network Resistor, Bussed, Thin Film, 0.125W, 388000ohm, 100V, 0.5% +/-Tol, -10,10ppm/Cel, 1107,
CategoryPassive components    The resistor   
File Size80KB,5 Pages
ManufacturerVishay
Websitehttp://www.vishay.com
Download Datasheet Parametric View All

PRA135C2-388KDWBT31 Overview

Array/Network Resistor, Bussed, Thin Film, 0.125W, 388000ohm, 100V, 0.5% +/-Tol, -10,10ppm/Cel, 1107,

PRA135C2-388KDWBT31 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Objectid982309966
package instructionSMT, 1107
Reach Compliance Codecompliant
Country Of OriginFrance
ECCN codeEAR99
YTEOL5.4
structureChip
JESD-609 codee0
Network TypeBussed
Number of terminals4
Maximum operating temperature155 °C
Minimum operating temperature-55 °C
Package height0.4 mm
Package length2.7 mm
Package formSMT
Package width1.85 mm
method of packingTR
Rated power dissipation(P)0.125 W
resistance388000 Ω
Resistor typeARRAY/NETWORK RESISTOR
seriesPRA (CNW)
size code1107
technologyTHIN FILM
Temperature Coefficient10 ppm/°C
Terminal surfaceTin/Lead (Sn/Pb) - with Nickel (Ni) barrier
Tolerance0.5%
Operating Voltage100 V
PRA 100, 135, 182 (CNW)
Vishay Sfernice
High Precision Resistor Chip Arrays
FEATURES
High stability passivated nichrome resistive
layer 0.02 % on ratio, 1000 h at Pn at + 70 °C
Tight TCR (10 ppm/°C) and TCR tracking
(to 1 ppm/°C)
Very low noise < 35 dB and voltage coefficient
< 0.01 ppm/V
Ratio tolerance to 0.01 % (R
200R)
Pre-tinned terminations over nickel barrier
High temperature option (200 °C)
SMD wraparound chip resistor array
Compliant to RoHS directive 2002/95/EC
PRA arrays can be used in most applications requiring a
matched pair (or set) of resistor elements. The networks
provide 1 ppm/°C TCR tracking, a ratio tolerance as tight as
0.01 % and outstanding stability. They are available in 1 mm,
1.35 mm and 1.82 mm pitch.
TYPICAL PERFORMANCE
ABS
TCR
TOL
10 ppm/°C
ABS
0.1 %
TRACKING
2 ppm/°C
RATIO
0.05 %
DIMENSIONS
Suggested Land Pattern
R
S
R
P
Q
F
A
I: Independent resistors
E
Termination
Electrical diagram
R1
R2
R7
R8
DIM.
A
B
C
D
E
(1)
F
G
P
Q
R
S
PRA 100
mm
1.6
0.4
0.65
+ 0.2
- 0.1
+ 0.2
- 0.2
+ 0.15
- 0.15
PRA 135
mil
63
16
mm
1.85
0.4
1.05
+ 0.2
- 0.1
+ 0.2
- 0.2
+ 0.15
- 0.15
PRA 182
mil
72
16
41
10
mm
3.0
0.4
1.3
+ 0.2
- 0.1
+ 0.2
- 0.2
+ 0.35
- 0.15
B
D
C
F
G
mil
118
16
51
10
Number
of resistors:
2 to
8
R1 = R2 = ... R8
25.5
10
0.25
0.25
0.25
E = (N x F) ± 0.2 mm
1
0.4
+ 0.1
-0
E = (N x F) ± 8 mil
53.1
15
41.3
12
40
31.5
1.82
0.4
+ 0.1
-0
C: One common point
N
resistors
R1
E
40
15
27.5
12
40
23.5
1.35
0.4
+ 0.1
-0
72
15
59.8
12
40
70.8
B
C
D
A
R2
R7
R8
0.7
0.3
1
0.6
1.05
0.3
1
0.8
1.52
0.3
1
1.8
F
G
Note
(1)
E depends on number of resistors
* Pb containing terminations are not RoHS compliant, exemptions may apply
** Please see document “Vishay Material Category Policy”:
www.vishay.com/doc?99902
www.vishay.com
66
For technical questions, contact:
sfer@vishay.com
Number
of resistors:
2 to
8
R1 = R2 = ... R8
Document Number: 53033
Revision: 17-Aug-09
Shortlist Announced: ST Sensor Driven Transplantation Competition + Bone Sensor Evaluation Activity
18 users have received development kits.Click here to view your tracking number (while logged into the forum account)——————————————————————————————Event details: Click here to viewFirst of all, I woul...
nmg MEMS sensors
In the instruction LCALL ADDR16, ADDR16 is two bytes, plus one byte of instruction code, why is it PC+2?
In the instruction LCALL ADDR16, ADDR16 is two bytes, plus one byte of instruction code, why is it PC+2? Shouldn't it be (PC)+3?...
一沙一世 51mcu
Apple iPhone 14 series disassembly: Who are the main component suppliers?
Abstract: Recently, iFixit, a professional disassembly organization abroad, and Microcomputer Division, a domestic disassembly organization, have disassembled the iPhone 14 series. Since the iPhone 14...
wangerxian Talking
Design techniques and key points for efficient automatic PCB routing
[size=4]Although the current EDA tools are very powerful, as the PCB size requirements are getting smaller and smaller and the device density is getting higher and higher, the difficulty of PCB design...
ohahaha PCB Design
HIL test failure
[i=s]This post was last edited by TinkyWinky on 2019-8-16 18:50[/i] While the HIL was being tested, the HIL loaded the software again, causing the HIL to disconnect. I would like to ask where the erro...
TinkyWinky Analog electronics
The United States will release an unclassified UFO report in June. The former senior project director of the Department of Defense said: It really exists
Have you ever seen a UFO or some unexplained flying object? I have seen it twice, both at night: once, there was something like a light bulb in the sky, it was definitely not an airplane or a meteor, ...
eric_wang Talking

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号