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WBDDQSC-B-03-8250-F-D

Description
Array/Network Resistor, Bussed, 0.05W, 825ohm, 100V, 1% +/-Tol, -25,25ppm/Cel, 1109,
CategoryPassive components    The resistor   
File Size273KB,4 Pages
ManufacturerTT Electronics plc
Websitehttp://www.ttelectronics.com/
Download Datasheet Parametric View All

WBDDQSC-B-03-8250-F-D Overview

Array/Network Resistor, Bussed, 0.05W, 825ohm, 100V, 1% +/-Tol, -25,25ppm/Cel, 1109,

WBDDQSC-B-03-8250-F-D Parametric

Parameter NameAttribute value
Objectid803142585
Reach Compliance Codecompliant
ECCN codeEAR99
structureChip
Network TypeBussed
Number of terminals24
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Package height0.406 mm
Package length2.921 mm
Package formSMT
Package width2.184 mm
method of packingTray
Rated power dissipation(P)0.05 W
resistance825 Ω
Resistor typeARRAY/NETWORK RESISTOR
seriesWBC-NETWORK
size code1109
Temperature Coefficient25 ppm/°C
Tolerance1%
Operating Voltage100 V
Wire Bondable
Resistor Network Arrays
Chip Network Array Series
·
·
·
·
Absolute tolerances to ±0.1%
Tight TCR tracking to ±5ppm/°C
Ratio match tolerances to ±0.05%
Ultra-stable tantalum nitride resistors
IRC’s TaNSil
®
network array resistors are ideally suited for applications that demand a small footprint. The small wire
bondable chip package provides higher component density, lower resistor cost and high reliability.
The tantalum nitride film system on silicon provides precision tolerance, exceptional TCR tracking and low cost.
Excellent performance in harsh, humid environments is a trademark of IRC’s self-passivating TaNSil
®
resistor film.
For applications requiring high performance resistor networks in a low cost, wire bondable package, specify IRC
network array die.
General Note
TT electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT electronics’ own data and is considered accurate at time of going to print.
www.bitechnologies.com www.irctt.com www.welwyn-tt.com
© TT electronics plc
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