EEPROM Card, 8MX16, 65ns, Parallel, CMOS, PBGA64
Parameter Name | Attribute value |
Is it Rohs certified? | conform to |
Objectid | 1126065567 |
package instruction | BGA, BGA64,8X8,40 |
Reach Compliance Code | compliant |
ECCN code | EAR99 |
Maximum access time | 65 ns |
Spare memory width | 8 |
command user interface | YES |
Universal Flash Interface | YES |
Data polling | YES |
JESD-30 code | S-PBGA-B64 |
JESD-609 code | e3 |
memory density | 134217728 bit |
Memory IC Type | EEPROM CARD |
memory width | 16 |
Humidity sensitivity level | 1 |
Number of departments/size | 128 |
Number of terminals | 64 |
word count | 8388608 words |
character code | 8000000 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 8MX16 |
Package body material | PLASTIC/EPOXY |
encapsulated code | BGA |
Encapsulate equivalent code | BGA64,8X8,40 |
Package shape | SQUARE |
Package form | GRID ARRAY |
page size | 8/16 words |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | 260 |
power supply | 1.8/3.3,3/3.3 V |
Programming voltage | 2.7 V |
Certification status | Not Qualified |
ready/busy | YES |
Department size | 128K |
Maximum standby current | 0.00004 A |
Maximum slew rate | 0.055 mA |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | MATTE TIN |
Terminal form | BALL |
Terminal pitch | 1 mm |
Terminal location | BOTTOM |
switch bit | YES |
type | NOR TYPE |