EEWORLDEEWORLDEEWORLD

Part Number

Search
 PDF

1812N301K201VHWM

Description
Ceramic Capacitor, Multilayer, Ceramic, 200V, 10% +Tol, 10% -Tol, C0G, -/+30ppm/Cel TC, 0.0003uF, 1812,
CategoryPassive components    capacitor   
File Size51KB,4 Pages
ManufacturerKnowles
Websitehttp://www.knowles.com
Download Datasheet Parametric View All

1812N301K201VHWM Overview

Ceramic Capacitor, Multilayer, Ceramic, 200V, 10% +Tol, 10% -Tol, C0G, -/+30ppm/Cel TC, 0.0003uF, 1812,

1812N301K201VHWM Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Objectid883583135
package instruction, 1812
Reach Compliance Codecompliant
Country Of OriginMainland China, USA
ECCN codeEAR99
YTEOL6.62
capacitance0.0003 µF
Capacitor typeCERAMIC CAPACITOR
dielectric materialsCERAMIC
high1.65 mm
length4.57 mm
multi-layerYes
negative tolerance10%
Number of terminals2
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package formSMT
method of packingWaffle Pack
positive tolerance10%
Rated (DC) voltage (URdc)200 V
series1812NH(200V,.065)
size code1812
Temperature characteristic codeC0G
Temperature Coefficient30ppm/Cel ppm/°C
width3.18 mm
CC3200 wireless wifi processor full voice interactive control smart home system
Table of contents Chapter 1 System's main functions and module description 2 1.1 Main functions of the system 2 1.2 Module Description 3Chapter 2 Main Chip 3 2.1 Main processor chip 3 2.2 Auxiliary ch...
Jacktang Wireless Connectivity
PCB design based on TPS5430 power chip
1.1 Introduction to TPS5430 Chip As a member of the SWIFT DC/DC regulator series, the TPS5430 is a high output current PWM converter that integrates a low impedance high-side N-channel MOSFET. It inte...
bqgup Innovation Lab
Specific steps to implement bit fields and register file structures
[size=4] defines a register file structure in which the registers of the SCI peripheral are listed in order from low to high according to their actual addresses. [/size] [size=4]/*********************...
灞波儿奔 DSP and ARM Processors
A case study on low power design
[font=微软雅黑][color=#ff0000][backcolor=rgb(204, 232, 207)] [img]http://www.miractech.com/Upload/20151123001530yZDR.png[/img] [img]http://www.miractech.com/Upload/20151123001531KcEb.png[/img] [/backcolor...
qewnja Analog electronics
Free | VIP tickets to EDI CON, the annual RF conference (Beijing, April 1-3)
[font=微软雅黑][size=4]If you are an RF practitioner and are interested in high-frequency and high-speed technologies, you must not miss this technology event. [/size][/font] [font=微软雅黑][size=4] [/size][/...
EEWORLD社区 RF/Wirelessly
Year-end benefits! 2019 TI Industrial Applications Selected Courses Summary, Grab the Building to Win Gifts
Activity introduction2019.12.10 - 2019.12.31, watch the 2019 TI Industrial Applications Selected Courses, write comments, and participate in the grab-the-floor event for a chance to win exquisite gift...
EE大学堂 TI Technology Forum

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号