High Frequency Ceramic Solutions
2.45 GHz Impedance Matched Balun-BPF: For TI CC253X, CC254X, CC257X,
CC853X and CC852X Chipset family
Detail Specification:
4/29/2013
P/N 2450BM15A0002
Page 1 of 2
12 min. @ 1GHz
18 min. @ 4800~5000MHz
20 min. @ 7200~7500MHz
180° ± 15
2W max.
4,000
-40°C to +125°C
+5 ~ +35 °C, Humidity
45~75%RH, 18 mos. max
General Specifications
Part Number
Frequency (MHz)
Unbalanced Impedance
Balanced Differential
Impedance
Insertion Loss
Insertion Loss
Return Loss
(-40°C to 125°C)
2450BM15A0002
2400 - 2500
50
Ω
Impedance match to T.I. CC253X,
CC254X, CC257X, CC853X and CC852X
Chipsets
Differential Mode
Attenuation (dB)
-40°C to 125°C
Phase Diff.
(-40°C to 125°C)
Input Power
Reel Quanity
Operating Temperature
Recommended Storage
Conditions
1.5 dB max.
(-40°C to +85°C)
1.7 dB max.
(-40°C to +125°C)
9.5 dB min.
Part Number Explanation
P/N
Suffix
Packaging
Style
Termination Style
Bulk
T&R
Suffix = S
Suffix = E
Suffix = None
Eg. 2450BM15A0002S
Eg. 2450BM15A0002E
Eg. 2450BM15A0002(E or S)
Terminal Configuration
No.
100% Tin
Evaluation Board
Function
Unbalanced Port
GND
Balanced Port
Balanced Port
GND
GND
2450BM15A0002-EBSMA
1
2
3
Mechanical Dimensions
In
L
W
T
a
b
c
g
p
0.079 ± 0.004
0.049 ± 0.004
0.028 ± 0.004
0.012 ± 0.004
0.008 ± 0.004
0.012 +.004/-.008
0.014 ± 0.004
0.026 ± 0.002
mm
2.00 ± 0.10
1.25 ± 0.10
0.70 ± 0.10
0.30 ± 0.10
0.20 ± 0.10
0.30 +0.1/-0.2
0.35 ± 0.10
0.65 ± 0.05
g
b
T
L
W
4
5
6
c
a
p
Mounting Considerations
Mount these devices with brown mark facing up. Units: mm
*
Line width should be designed to provide 50
Ω
impedance matching characteristics.
0.35
Solder Resist
Land
Through-hole (
0.3)
0.8
Note: No DC
Blocking Capacitor
required (internal)
*
T.I. Chipset
1.0
0.30
Johanson Technology, Inc. reserves the right to make design changes without notice.
All sales are subject to Johanson Technology, Inc. terms and conditions.
www.johansontechnology.com
4001 Calle Tecate • Camarillo, CA 93012 • TEL 805.389.1166 FAX 805.389.1821
Ver 1.2
2013 Johanson Technology, Inc. All Rights Reserved
High Frequency Ceramic Solutions
2.45 GHz Impedance Matched Balun-BPF: For TI CC253X, CC254X, CC257X,
CC853X and CC852X Chipset family
Detail Specification:
4/29/2013
P/N 2450BM15A0002
Page 2 of 2
Typical Electrical Performance at 25°C and 125°C
0
-5
-10
-15
-20
-25
-30
-35
-40
-45
0.5
1.5
2.5
3.5
4.5
freq, GHz
25C Unbalanced RL
125C Unbalanced RL
25C Balanced Return Loss
125C Balanced Return Loss
25C Insertion Loss/Attenuation (Differential Mode)
125C Insertion Loss/Attenuation (Differential Mode)
5.5
6.5
7.5
8.5
Technical notes and Reference Designs
Technical Note:
www.johansontechnology.com/CC2530AppNote
Gerber Files and TI Reference Notes:
http://www.ti.com/tool/cc2530balun-refdes
Johanson Technology, Inc. reserves the right to make design changes without notice.
All sales are subject to Johanson Technology, Inc. terms and conditions.
www.johansontechnology.com
4001 Calle Tecate • Camarillo, CA 93012 • TEL 805.389.1166 FAX 805.389.1821
Ver 1.2
2013 Johanson Technology, Inc. All Rights Reserved