EEPROM Card, 8MX16, 70ns, Parallel, CMOS, PBGA80
Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Objectid | 1126065590 |
package instruction | FBGA, BGA80,8X12,32 |
Reach Compliance Code | compliant |
ECCN code | EAR99 |
Maximum access time | 70 ns |
startup block | BOTTOM/TOP |
command user interface | YES |
Universal Flash Interface | YES |
Data polling | YES |
JESD-30 code | R-PBGA-B80 |
JESD-609 code | e1 |
memory density | 134217728 bit |
Memory IC Type | EEPROM CARD |
memory width | 16 |
Number of departments/size | 16,254 |
Number of terminals | 80 |
word count | 8388608 words |
character code | 8000000 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 8MX16 |
Package body material | PLASTIC/EPOXY |
encapsulated code | FBGA |
Encapsulate equivalent code | BGA80,8X12,32 |
Package shape | RECTANGULAR |
Package form | GRID ARRAY, FINE PITCH |
page size | 8 words |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | 260 |
power supply | 3/3.3 V |
Programming voltage | 2.7 V |
Certification status | Not Qualified |
ready/busy | YES |
Department size | 4K,32K |
Maximum standby current | 0.00003 A |
Maximum slew rate | 0.055 mA |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | TIN SILVER COPPER |
Terminal form | BALL |
Terminal pitch | 0.8 mm |
Terminal location | BOTTOM |
switch bit | YES |
type | NOR TYPE |