Flash, 64MX4, PBGA24, FBGA-24
Parameter Name | Attribute value |
Is it Rohs certified? | conform to |
Objectid | 1164809427 |
Parts packaging code | BGA |
package instruction | TBGA, BGA24,5X5,40 |
Contacts | 24 |
Reach Compliance Code | unknown |
ECCN code | 3A991.B.1.A |
Other features | ALSO CONFIGURABLE AS 128M X 1 |
Spare memory width | 2 |
Maximum clock frequency (fCLK) | 133 MHz |
Data retention time - minimum | 20 |
Durability | 100000 Write/Erase Cycles |
JESD-30 code | R-PBGA-B24 |
length | 8 mm |
memory density | 268435456 bit |
Memory IC Type | FLASH |
memory width | 4 |
Number of functions | 1 |
Number of terminals | 24 |
word count | 67108864 words |
character code | 64000000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 64MX4 |
Package body material | PLASTIC/EPOXY |
encapsulated code | TBGA |
Encapsulate equivalent code | BGA24,5X5,40 |
Package shape | RECTANGULAR |
Package form | GRID ARRAY, THIN PROFILE |
Parallel/Serial | SERIAL |
power supply | 3/3.3 V |
Programming voltage | 3 V |
Certification status | Not Qualified |
Maximum seat height | 1.2 mm |
Serial bus type | SPI |
Maximum standby current | 0.0001 A |
Maximum slew rate | 0.1 mA |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 2.7 V |
Nominal supply voltage (Vsup) | 3 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal form | BALL |
Terminal pitch | 1 mm |
Terminal location | BOTTOM |
type | NOR TYPE |
width | 6 mm |
Maximum write cycle time (tWC) | 500 ms |
write protect | HARDWARE/SOFTWARE |