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S25FL256SAGBHIA13

Description
Flash, 64MX4, PBGA24, FBGA-24
Categorystorage    storage   
File Size2MB,154 Pages
ManufacturerSPANSION
Websitehttp://www.spansion.com/
Environmental Compliance
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S25FL256SAGBHIA13 Overview

Flash, 64MX4, PBGA24, FBGA-24

S25FL256SAGBHIA13 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Objectid1164809427
Parts packaging codeBGA
package instructionTBGA, BGA24,5X5,40
Contacts24
Reach Compliance Codeunknown
ECCN code3A991.B.1.A
Other featuresALSO CONFIGURABLE AS 128M X 1
Spare memory width2
Maximum clock frequency (fCLK)133 MHz
Data retention time - minimum20
Durability100000 Write/Erase Cycles
JESD-30 codeR-PBGA-B24
length8 mm
memory density268435456 bit
Memory IC TypeFLASH
memory width4
Number of functions1
Number of terminals24
word count67108864 words
character code64000000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize64MX4
Package body materialPLASTIC/EPOXY
encapsulated codeTBGA
Encapsulate equivalent codeBGA24,5X5,40
Package shapeRECTANGULAR
Package formGRID ARRAY, THIN PROFILE
Parallel/SerialSERIAL
power supply3/3.3 V
Programming voltage3 V
Certification statusNot Qualified
Maximum seat height1.2 mm
Serial bus typeSPI
Maximum standby current0.0001 A
Maximum slew rate0.1 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)2.7 V
Nominal supply voltage (Vsup)3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
typeNOR TYPE
width6 mm
Maximum write cycle time (tWC)500 ms
write protectHARDWARE/SOFTWARE

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Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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