TO-220 & TO-218 & TO-247 Heat Sinks
5304
High rise style heat sink features staggered fins and Wave-On
TM
solderable mounts
0
100
Mounting Surface Temp
Rise Above Ambient—°C
80
60
40
20
0
0
Air Velocity—Feet Per Minute
400
200
600
800
1000
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5
4
3
2
1
0
10.16
(0.400)
24.13
(0.950)
44.45
(1.750)
30.61
(1.205)
12.70
(0.500)
CLIP 50
4.06 TYP
(0.160)
6.60
(0.260)
ø 3.20 THRU
(0.126)
19.05
(0.750)
ø 2.79 x 0.76
(0.110) (0.030)
HIGH DITTIN
High rise style heat sink features
staggered fins and Wave-On
TM
solderable mounts
for easy attach-
ment to the PC card. Models include
thru holes on one side to attach
devices using standard hardware
and dittins with special slots on the
other for easy device attachment
using a convenient spring clip.
4
8
12
16
Heat Dissipated—Watts
20
44.45
(1.750)
"A"
2.54
(0.100)
3.00
(0.118)
4.24
(0.167)
14.99
(0.590)
1.57
7.62
(0.300) (0.060)
3.48
(0.137)
14.99
(0.590)
2.54
(0.100)
7.49
(0.295)
12.45
(0.490)
ORDERING INFORMATION
Part Number
530401B00100G
530401B00150G
530402B00100G
530402B00150G
Description
High rise style heat sink staggered fins
With device clip #50
High rise style heat sink staggered fins
With device clip #50
Device
TO-218, TO-247
TO-218, TO-247
TO-220
TO-220
“A” Dim
21.08 (0.830)
21.08 (0.830)
18.29 (0.720)
18.29 (0.720)
Dia of PCB
Plated Thru
Hole for Tabs
4.75 (0.187)
4.75 (0.187)
4.75 (0.187)
4.75 (0.187)
Material: 1.60 (0.063) Thick Aluminum
Finish: Black Anodize
For additional options see page 82
5330, 5331, 5332, 5333 Extruded heat sink with radial fins
Air Velocity—Feet Per Minute
400
200
600
800
Grease
&
Epoxy
page112
0
100
Mounting Surface Temp
Rise Above Ambient—°C
80
60
40
20
0
0
53300X
53310X
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
1000
10
8
6
4
2
0
ø 3.18
X
0.64
(0.125) (0.025)
HIGH DITTIN
"A"
2
4
6
Heat Dissipated—Watts
8
10
"B"
3.96 2x
(0.156)
2.36 2x
(0.093)
25.40
(1.000)
"C"
80
60
40
20
0
0
2
4
6
Heat Dissipated—Watts
8
10
8
6
4
2
0
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
Mounting Surface Temp
Rise Above Ambient—°C
Extruded heat sink with radial
fins and clip attach feature
makes device attachment easy.
Includes two solderable mounting
pins which permit vertical mount-
ing and eliminate stress on device
leads. Available in four heights for
TO-220, TO-218 and TO-247 devices.
0
100
200
Air Velocity—Feet Per Minute
400
600
800
NOTCH
FOR CLIP 2x
1000
10
12.70
(0.500)
34.92
(1.375)
39.10
(1.540)
13.50
(0.530)
CLIP 51
6.60
(0.260)
53320X
53330X
ORDERING INFORMATION
Part Number
533001B02551G
533002B02551G
533101B02551G
533102B02551G
533201B02551G
533202B02551G
533301B02551G
533302B02551G
Device
TO-218, TO-247
TO-220
TO-218, TO-247
TO-220
TO-218, TO-247
TO-220
TO-218, TO-247
TO-220
“A” Dim
25.40 (1.000)
25.40 (1.000)
38.10 (1.500)
38.10 (1.500)
50.80 (2.000)
50.80 (2.000)
63.50 (2.500)
63.50 (2.500)
“B” Dim
21.59 (0.850)
18.29 (0.720)
21.59 (0.850)
18.29 (0.720)
21.59 (0.850)
18.29 (0.720)
21.59 (0.850)
18.29 (0.720)
“C” Dim
17.02 (0.670)
15.88 (0.625)
17.02 (0.670)
15.88 (0.625)
17.02 (0.670)
15.88 (0.625)
17.02 (0.670)
15.88 (0.625)
Dia of PCB
Plated Thru
Hole for Pins
2.67 (0.105)
2.67 (0.105)
2.67 (0.105)
2.67 (0.105)
2.67 (0.105)
2.67 (0.105)
2.67 (0.105)
2.67 (0.105)
Material: Aluminum
Finish: Black Anodize
For additional options see page 83
AMERICA
EUROPE
www.aavidthermalloy.com
USA
Tel: +1 (603) 224-9988 email: info@aavid.com
Italy
Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom
Tel: +44 1793 401400 email: sales.uk@aavid.com
ASIA
Singapore
Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan
Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
55
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
Grease
&
Epoxy
page112
Mounting
Kits
page 99
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