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IRKH71/06A

Description
scr dbl LOscr 600v 75a add-A-pak
CategoryAnalog mixed-signal IC    Trigger device   
File Size319KB,10 Pages
ManufacturerVishay
Websitehttp://www.vishay.com
Download Datasheet Parametric View All

IRKH71/06A Overview

scr dbl LOscr 600v 75a add-A-pak

IRKH71/06A Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerVishay
Parts packaging codeTO-240AA
package instructionFLANGE MOUNT, R-XUFM-X5
Contacts5
Manufacturer packaging codeADD-A-PAK
Reach Compliance Codeunknow
Other featuresUL RECOGNIZED
Shell connectionISOLATED
ConfigurationSINGLE WITH BUILT-IN DIODE
Maximum DC gate trigger current150 mA
Maximum DC gate trigger voltage4 V
Quick connection descriptionG-K
Description of screw terminalsA-K-AK
Maximum holding current200 mA
JEDEC-95 codeTO-240AA
JESD-30 codeR-XUFM-X5
Maximum leakage current15 mA
Humidity sensitivity level1
On-state non-repetitive peak current1740 A
Number of components1
Number of terminals5
Maximum on-state current75000 A
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
Package body materialUNSPECIFIED
Package shapeRECTANGULAR
Package formFLANGE MOUNT
Peak Reflow Temperature (Celsius)225
Certification statusNot Qualified
Maximum rms on-state current165 A
Off-state repetitive peak voltage600 V
Repeated peak reverse voltage600 V
surface mountNO
Terminal formUNSPECIFIED
Terminal locationUPPER
Maximum time at peak reflow temperatureNOT SPECIFIED
Trigger device typeSCR
Base Number Matches1
Bulletin I27132 rev. I 09/04
IRK.71, .91 SERIES
THYRISTOR/ DIODE and
THYRISTOR/ THYRISTOR
Features
High Voltage
Industrial Standard Package
Thick Al metal die and double stick bonding
Thick copper baseplate
UL E78996 approved
3500V
RMS
isolating voltage
ADD-A-pak
TM
GEN V Power Modules
Benefits
Up to 1600V
Full compatible TO-240AA
High Surge capability
Easy Mounting on heatsink
Al
2
0
3
DBC insulator
Heatsink grounded
75 A
95 A
Mechanical Description
The Generation V of Add-A-pak module combine the
excellent thermal performance obtained by the usage
of Direct Bonded Copper substrate with superior
mechanical ruggedness, thanks to the insertion of a
solid Copper baseplate at the bottom side of the device.
The Cu baseplate allow an easier mounting on the
majority of heatsink with increased tolerance of surface
roughness and improve thermal spread.
The Generation V of AAP module is manufactured
without hard mold, eliminating in this way any possible
direct stress on the leads.
The electrical terminals are secured against axial pull-out:
they are fixed to the module housing via a click-stop
feature already tested and proved as reliable on other IR
modules.
Electrical Description
These modules are intended for general purpose high
voltage applications such as high voltage regulated power
supplies, lighting circuits, temperature and motor speed
control circuits, UPS and battery charger.
Major Ratings and Characteristics
Parameters
I
T(AV)
or I
F(AV)
@ 85°C
I
O(RMS)
(*)
I
TSM
@ 50Hz
I
FSM
@ 60Hz
I
2
t
@ 50Hz
@ 60Hz
I
2
√t
V
RRM
range
T
STG
T
J
(*) As AC switch.
IRK.71
75
165
1665
1740
13.86
12.56
138.6
IRK.91
95
210
1785
1870
15.91
14.52
159.1
Units
A
A
A
A
KA
2
s
KA
2
s
KA
2
√s
V
o
o
400 to 1600
- 40 to 125
- 40 to125
C
C
www.irf.com
1

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Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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