SE5539N datasheet, PDF - EEWORLD Datasheet

SE5539N: Descriptionhigh frequency operational amplifier; CategoryAnalog mixed-signal IC Amplifier circuit; File Size162KB，14 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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SE5539N Overview

high frequency operational amplifier

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	NXP
Parts packaging code	DIP
package instruction	DIP,
Contacts	14
Reach Compliance Code	unknown
ECCN code	EAR99
Is Samacsys	N
Amplifier type	OPERATIONAL AMPLIFIER
JESD-30 code	R-PDIP-T14
length	19.025 mm
Humidity sensitivity level	1
Number of functions	1
Number of terminals	14
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Peak Reflow Temperature (Celsius)	225
Certification status	Not Qualified
Maximum seat height	4.2 mm
surface mount	NO
technology	BIPOLAR
Temperature level	MILITARY
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.62 mm
Base Number Matches	1

INTEGRATED CIRCUITS

NE/SE5539

High frequency operational amplifier

Product data

Supersedes data of 2001 Aug 03

File under Integrated Circuits, IC11 Data Handbook

2002 Jan 25

Philips

Semiconductors

	SE5539N	NE5539	NE5539D	NE5539F	NE5539N	SE5539F	SE5539
Description	high frequency operational amplifier	high frequency operational amplifier	high frequency operational amplifier	high frequency operational amplifier	high frequency operational amplifier	high frequency operational amplifier	high frequency operational amplifier
Maker	NXP	-	NXP	NXP	NXP	NXP	-
package instruction	DIP,	-	SOP,	DIP,	DIP,	DIP,	-
Reach Compliance Code	unknown	-	unknow	unknow	unknow	unknow	-
Amplifier type	OPERATIONAL AMPLIFIER	-	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER	-
JESD-30 code	R-PDIP-T14	-	R-PDSO-G14	R-CDIP-T14	R-PDIP-T14	R-CDIP-T14	-
length	19.025 mm	-	8.65 mm	19.535 mm	19.025 mm	19.535 mm	-
Number of functions	1	-	1	1	1	1	-
Number of terminals	14	-	14	14	14	14	-
Package body material	PLASTIC/EPOXY	-	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED	-
encapsulated code	DIP	-	SOP	DIP	DIP	DIP	-
Package shape	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	-
Package form	IN-LINE	-	SMALL OUTLINE	IN-LINE	IN-LINE	IN-LINE	-
Certification status	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-
Maximum seat height	4.2 mm	-	1.75 mm	5.08 mm	4.2 mm	5.08 mm	-
surface mount	NO	-	YES	NO	NO	NO	-
technology	BIPOLAR	-	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	-
Temperature level	MILITARY	-	COMMERCIAL	-	COMMERCIAL	MILITARY	-
Terminal form	THROUGH-HOLE	-	GULL WING	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	-
Terminal pitch	2.54 mm	-	1.27 mm	2.54 mm	2.54 mm	2.54 mm	-
Terminal location	DUAL	-	DUAL	DUAL	DUAL	DUAL	-
width	7.62 mm	-	3.9 mm	7.62 mm	7.62 mm	7.62 mm	-

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