1K/2K/4K/8K/16K SPI Serial CMOS EEPROM
Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Maker | Catalyst |
Parts packaging code | SOIC |
package instruction | TSSOP, TSSOP8,.25 |
Contacts | 8 |
Reach Compliance Code | unknow |
ECCN code | EAR99 |
Maximum clock frequency (fCLK) | 5 MHz |
Data retention time - minimum | 100 |
Durability | 1000000 Write/Erase Cycles |
JESD-30 code | R-PDSO-G8 |
JESD-609 code | e3 |
length | 4.4 mm |
memory density | 16384 bi |
Memory IC Type | EEPROM |
memory width | 8 |
Number of functions | 1 |
Number of terminals | 8 |
word count | 2048 words |
character code | 2000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 2KX8 |
Package body material | PLASTIC/EPOXY |
encapsulated code | TSSOP |
Encapsulate equivalent code | TSSOP8,.25 |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
Parallel/Serial | SERIAL |
Peak Reflow Temperature (Celsius) | 260 |
power supply | 3/5 V |
Certification status | Not Qualified |
Maximum seat height | 1.2 mm |
Serial bus type | SPI |
Maximum slew rate | 0.005 mA |
Maximum supply voltage (Vsup) | 6 V |
Minimum supply voltage (Vsup) | 2.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | MATTE TIN |
Terminal form | GULL WING |
Terminal pitch | 0.65 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 3 mm |
Maximum write cycle time (tWC) | 5 ms |
write protect | HARDWARE/SOFTWARE |