EEPROM Card, 32MX16, 95ns, Parallel, CMOS, PBGA64,
Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Objectid | 1124627699 |
package instruction | FBGA, BGA64,10X14,20 |
Reach Compliance Code | compliant |
ECCN code | EAR99 |
Maximum access time | 95 ns |
startup block | TOP |
command user interface | YES |
Universal Flash Interface | YES |
Data polling | YES |
JESD-30 code | R-PBGA-B64 |
JESD-609 code | e3 |
memory density | 536870912 bit |
Memory IC Type | EEPROM CARD |
memory width | 16 |
Humidity sensitivity level | 1 |
Number of departments/size | 4,511 |
Number of terminals | 64 |
word count | 33554432 words |
character code | 32000000 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 32MX16 |
Package body material | PLASTIC/EPOXY |
encapsulated code | FBGA |
Encapsulate equivalent code | BGA64,10X14,20 |
Package shape | RECTANGULAR |
Package form | GRID ARRAY, FINE PITCH |
Parallel/Serial | PARALLEL |
power supply | 1.8 V |
Programming voltage | 2.7 V |
Certification status | Not Qualified |
ready/busy | YES |
Department size | 16K,64K |
Maximum standby current | 0.00003 A |
Maximum slew rate | 0.07 mA |
Nominal supply voltage (Vsup) | 1.8 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | MATTE TIN |
Terminal form | BALL |
Terminal pitch | 0.5 mm |
Terminal location | BOTTOM |
switch bit | YES |
type | NOR TYPE |