digital to analog converters - dac 10-bit 32ch precision dac
| Parameter Name | Attribute value |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Parts packaging code | QFN |
| package instruction | HVQCCN, LCC56,.31SQ,20 |
| Contacts | 56 |
| Reach Compliance Code | compli |
| ECCN code | 3A001.A.5.B |
| Maximum analog output voltage | 10 V |
| Minimum analog output voltage | |
| Converter type | D/A CONVERTER |
| Enter bit code | BINARY |
| Input format | SERIAL |
| JESD-30 code | S-XQCC-N56 |
| JESD-609 code | e3 |
| length | 8 mm |
| Maximum linear error (EL) | 0.0244% |
| Humidity sensitivity level | 3 |
| Number of digits | 16 |
| Number of functions | 1 |
| Number of terminals | 56 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | |
| Package body material | UNSPECIFIED |
| encapsulated code | HVQCCN |
| Encapsulate equivalent code | LCC56,.31SQ,20 |
| Package shape | SQUARE |
| Package form | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Peak Reflow Temperature (Celsius) | 260 |
| power supply | 3/5,5,10.5 V |
| Certification status | Not Qualified |
| Maximum seat height | 0.8 mm |
| Maximum stabilization time | 20 µs |
| Nominal settling time (tstl) | 20 µs |
| Nominal supply voltage | 5 V |
| surface mount | YES |
| technology | BICMOS |
| Temperature level | OTHER |
| Terminal surface | Matte Tin (Sn) |
| Terminal form | NO LEAD |
| Terminal pitch | 0.5 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | 30 |
| width | 8 mm |
| Base Number Matches | 1 |
| MAX5733BUTN+T | MAX5734BUTN+ | MAX5735BUTN+ | MAX5732AUTN+T | |
|---|---|---|---|---|
| Description | digital to analog converters - dac 10-bit 32ch precision dac | digital to analog converters - dac 10-bit 32ch precision dac | digital to analog converters - dac 10-bit 32ch precision dac | digital to analog converters - dac 10-bit 32ch precision dac |
| Is it lead-free? | Lead free | Lead free | Lead free | Lead free |
| Is it Rohs certified? | conform to | conform to | conform to | conform to |
| Parts packaging code | QFN | QFN | QFN | QFN |
| package instruction | HVQCCN, LCC56,.31SQ,20 | HVQCCN, LCC56,.31SQ,20 | HVQCCN, LCC56,.31SQ,20 | HVQCCN, LCC56,.31SQ,20 |
| Contacts | 56 | 56 | 56 | 56 |
| Reach Compliance Code | compli | compli | compli | compli |
| ECCN code | 3A001.A.5.B | EAR99 | EAR99 | 3A001.A.5.B |
| Maximum analog output voltage | 10 V | 7.5 V | 5 V | 5 V |
| Converter type | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER |
| Enter bit code | BINARY | BINARY | BINARY | BINARY |
| Input format | SERIAL | SERIAL | SERIAL | SERIAL |
| JESD-30 code | S-XQCC-N56 | S-XQCC-N56 | S-XQCC-N56 | S-XQCC-N56 |
| JESD-609 code | e3 | e3 | e3 | e3 |
| length | 8 mm | 8 mm | 8 mm | 8 mm |
| Maximum linear error (EL) | 0.0244% | 0.0244% | 0.0244% | 0.0122% |
| Humidity sensitivity level | 3 | 3 | 3 | 3 |
| Number of digits | 16 | 16 | 16 | 16 |
| Number of functions | 1 | 1 | 1 | 1 |
| Number of terminals | 56 | 56 | 56 | 56 |
| Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C |
| Package body material | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| encapsulated code | HVQCCN | HVQCCN | HVQCCN | HVQCCN |
| Encapsulate equivalent code | LCC56,.31SQ,20 | LCC56,.31SQ,20 | LCC56,.31SQ,20 | LCC56,.31SQ,20 |
| Package shape | SQUARE | SQUARE | SQUARE | SQUARE |
| Package form | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Peak Reflow Temperature (Celsius) | 260 | 260 | 260 | 260 |
| power supply | 3/5,5,10.5 V | -3,3/5,5,8 V | +-5,3/5 V | 3/5,5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
| Maximum stabilization time | 20 µs | 20 µs | 20 µs | 20 µs |
| Nominal settling time (tstl) | 20 µs | 20 µs | 20 µs | 20 µs |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | YES | YES | YES |
| technology | BICMOS | BICMOS | BICMOS | BICMOS |
| Temperature level | OTHER | OTHER | OTHER | OTHER |
| Terminal surface | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
| Terminal form | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
| Terminal pitch | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| Terminal location | QUAD | QUAD | QUAD | QUAD |
| Maximum time at peak reflow temperature | 30 | NOT SPECIFIED | NOT SPECIFIED | 30 |
| width | 8 mm | 8 mm | 8 mm | 8 mm |
| Maker | - | Maxim | Maxim | Maxim |
| Factory Lead Time | - | 6 weeks | 6 weeks | 15 weeks |
EEWorld
subscription
account
EEWorld
service
account
Automotive
development
circle
京公网安备 11010802033920号
EEWORLD