fpga - field programmable gate array cpld - apex II 2432 macro 492 ios
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | Altera (Intel) |
Parts packaging code | BGA |
package instruction | 27 X 27 MM, 1 MM PITCH, FINE LINE, BGA-672 |
Contacts | 672 |
Reach Compliance Code | _compli |
ECCN code | 3A001.A.7.A |
JESD-30 code | S-PBGA-B672 |
JESD-609 code | e0 |
length | 27 mm |
Humidity sensitivity level | 3 |
Number of I/O lines | 492 |
Number of entries | 480 |
Number of logical units | 24320 |
Output times | 480 |
Number of terminals | 672 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | |
organize | 492 I/O |
Output function | MACROCELL |
Package body material | PLASTIC/EPOXY |
encapsulated code | BGA |
Encapsulate equivalent code | BGA672,26X26,40 |
Package shape | SQUARE |
Package form | GRID ARRAY |
Peak Reflow Temperature (Celsius) | 220 |
power supply | 1.5,1.5/3.3 V |
Programmable logic type | LOADABLE PLD |
propagation delay | 1.94 ns |
Certification status | Not Qualified |
Maximum seat height | 2.1 mm |
Maximum supply voltage | 1.575 V |
Minimum supply voltage | 1.425 V |
Nominal supply voltage | 1.5 V |
surface mount | YES |
technology | CMOS |
Temperature level | OTHER |
Terminal surface | Tin/Lead (Sn63Pb37) |
Terminal form | BALL |
Terminal pitch | 1 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | 30 |
width | 27 mm |