Serial IO/Communication Controller, 2 Channel(s), 0.125MBps, CMOS, CDIP70, 1.900 INCH, CERAMIC, DIP-70
Parameter Name | Attribute value |
Objectid | 1154982309 |
package instruction | 1.900 INCH, CERAMIC, DIP-70 |
Reach Compliance Code | compliant |
Other features | LG-MAX |
Address bus width | 16 |
boundary scan | NO |
maximum clock frequency | 16 MHz |
letter of agreement | MIL STD 1553A; MIL STD 1553B; MIL STD 1760; MCAIR; STANAG-3838 |
Data encoding/decoding methods | NRZ; BIPH-LEVEL(MANCHESTER) |
Maximum data transfer rate | 0.125 MBps |
External data bus width | 16 |
JESD-30 code | R-CDIP-T70 |
JESD-609 code | e4 |
length | 48.26 mm |
low power mode | YES |
Number of serial I/Os | 2 |
Number of terminals | 70 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
Package body material | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | DIP |
Encapsulate equivalent code | SPGA70,7X35MOD |
Package shape | RECTANGULAR |
Package form | IN-LINE |
power supply | 5 V |
Certification status | Not Qualified |
Maximum seat height | 4.19 mm |
Maximum supply voltage | 5.5 V |
Minimum supply voltage | 4.5 V |
Nominal supply voltage | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | GOLD OVER NICKEL |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
width | 22.86 mm |