PHT
www.vishay.com
Vishay Sfernice
High Stability - High Temperature (230 °C)
Thin Film Wraparound Chip Resistors
FEATURES
• Operating temperature range:
- 55 °C; + 215 °C
• Storage temperature: - 55 °C; + 230 °C
• Gold terminations (< 1 μm thick)
• 4 sizes available (0603, 0805, 1206, 2010).
Other sizes upon request.
• Temperature coefficient down to 15 ppm
(- 55 °C; + 215 °C)
• Tolerance down to 0.05 %
• Load life stability: 0.5 % max after 1000 h at 215 °C
(ambient) at Pn
• SMD wraparound
• 0.02 % upon request
• TCR remains constant after long term storage at 230 °C
(15 000 h)
• Compliant to RoHS Directive 2002/95/EC
Note
**
Please see document “Vishay Material Category Policy”:
www.vishay.com/doc?99902
INTRODUCTION
For applications such as down hole applications, the need
for parts able to withstand very severe conditions
(temperature as high as 215 °C powered or up to 230 °C
un-powered) has leaded Vishay Sfernice to push out the
limit of the thin film technology.
Designers might read the application note: Power
Dissipation Considerations in High Precision Vishay
Sfernice Thin Film Chip Resistors and Arrays
(P, PRA etc…) (High Temperature Application)
www.vishay.com/doc?53047
in conjunction with this
datasheet to help them to properly design their PCBs and
get the best performances of the PHT.
Vishay Sfernice R&D engineers will be willing to support any
customer design considerations.
DIMENSIONS
in millimeters (inches)
A
D
D
C
B
E
E
A
MAX. TOL.
+ 0.152 (+ 0.006)
MIN. TOL.
- 0.152 (- 0.006)
NOMINAL
0603
0805
1206
2010
1.52 (0.060)
1.91 (0.075)
3.06 (0.120)
5.08 (0.200)
B
MAX. TOL.
+ 0.127 (+ 0.005)
MIN. TOL.
- 0.127 (- 0.005)
NOMINAL
0.85 (0.033)
0.38 (0.015)
1.27 (0.050)
1.60 (0.063)
2.54 (0.100)
0.5 (0.02)
± 0.127 (0.005)
0.13 (0.005)
0.40 (0.016)
0.48 (0.019)
D/E
C
CASE SIZE
NOMINAL
NOMINAL
Revision: 28-Nov-11
1
For technical questions, contact:
sfer@vishay.com
Document Number: 53050
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
PHT
www.vishay.com
SUGGESTED LAND PATTERN (TO IPC-7351A)
Vishay Sfernice
G
min.
X
max.
Z
max.
DIMENSIONS (in millimeter)
CHIP SIZE
Z
max.
0603
0805
1206
2010
2.37
2.76
3.91
5.93
G
min.
0.35
0.74
1.85
3.71
X
max.
0.98
1.40
1.73
2.67
STANDARD ELECTRICAL SPECIFICATIONS
TEST
Series
Ohmic range
(1)
Temperature coefficient
(2)
Tolerance
Power rating (Pn)
(3)
Operating temperature range
Limiting voltage
(3)
Load life stability
Storage temperature range
Shelf life stability
Notes
(1)
Please refer to table 3 for TCR versus ohmic values
(2)
See table 2
(3)
See table 1
SPECIFICATIONS
0603, 0805, 1206, 2010
10R to 7M6 (depending on series)
15 ppm/°C, 30 ppm/°C, 55 ppm/°C
0.05 %, 0.1 %, 0.5 %, 1 %
12.5 mW to 100 mW
- 55 °C; + 215 °C
75 V to 300 V
0.50 %
- 55 °C; + 230 °C
0.7 % typ. (1 % max.)
8000 h/230 °C
1000 h/215 °C (ambient) at Pn
215 °C
- 55 °C; + 215 °C
CONDITIONS
Caution:
Performances obtained with following mounting conditions:
PCB: Polyimide
Solder paste: PbSnAg (93.5/5/1.5)
Revision: 28-Nov-11
2
For technical questions, contact:
sfer@vishay.com
Document Number: 53050
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
PHT
www.vishay.com
Vishay Sfernice
POWER RATING
(1)
12.5 mW
20 mW
33 mW
100 mW
LIMITING VOLTAGE
75 V
150 V
200 V
300 V
TABLE 1
SIZE
0603
0805
1206
2010
Note
(1)
For power handling improvement, please refer to application note 53047: Power Dissipation Considerations in High Precision Vishay
Sfernice Thin Film Chip Resistors and Arrays (High Temperature Applications) www.vishay.com/doc?/53047 and consult Vishay Sfernice
TABLE 2 - TEMPERATURE COEFFICIENT
Y
E
H
10 ppm/°C
15 ppm/°C
25 ppm/°C
30 ppm/°C
50 ppm/°C
55 ppm/°C
- 55 °C; + 155 °C
- 55 °C; + 215 °C
- 55 °C; + 155 °C
- 55 °C; + 215 °C
- 55 °C; + 155 °C
- 55 °C; + 215 °C
TABLE 3
SERIES
0402
0603
0805
1206
2010
RANGE ()
From
10R
to 100K
From > 100K to
150K
From
10R
to 332K
From > 332K to
500K
From
10R
to 511K
From > 511K to
750K
From
10R
to 2M
From > 2M to
3M5
From
10R
to 5M
From > 5M to
7M5
TOL. (± %)
0.05, 0.1, 0.5, 1
0.05, 0.1, 0.5, 1
0.05, 0.1, 0.5, 1
0.05, 0.1, 0.5, 1
0.05, 0.1, 0.5, 1
0.05, 0.1, 0.5, 1
0.05, 0.1, 0.5, 1
0.05, 0.1, 0.5, 1
0.05, 0.1, 0.5, 1
0.05, 0.1, 0.5, 1
TCR CODE
Y; E; H
E; H
Y; E; H
E; H
Y; E; H
E; H
Y; E; H
E; H
Y; E; H
E; H
PHT STABILITY CURVE
High Temperature Drift vs. Time
2.0
1.8
1.6
1.4
Drift in %
1.2
1.0
0.8
With Pd
0.6 (T
j
= 230 °C)
0.4
0.2
0.0
0
2000
4000
6000
8000
Time in h
10 000
12 000
14 000
T = 215 °C
T = 200 °C
T = 185 °C
T = 230 °C
Note
• Stability will be dependent on resistivity of resistor. Above curves are worst case.
Revision: 28-Nov-11
Document Number: 53050
3
For technical questions, contact:
sfer@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
PHT
www.vishay.com
Vishay Sfernice
MECHANICAL SPECIFICATIONS
Substrate
Resistive Element
Passivation
Protection
Terminations
Note
• For other terminations, please consult
Alumina
Nichrome (NiCr)
Silicon nitride (Si
3
N
4
)
Epoxy + Silicone
Gold (< 1 μm) over nickel barrier
POPULAR OPTIONS
It is recommended to consult Vishay Sfernice for availability first.
Option: Enlarged terminations:
For stringent and special power dissipation requirements, the thermal resistance between the resistive layer and the solder joint
can be reduced using enlarged terminations chip resistors which are soldered on large and thick copper pads acting as heatsink
(see application note: 53048 Power Dissipation in High Precision Vishay Sfernice Chip Resistors and Arrays (P Thin Film, PRA
Arrays, CHP Thick Film)
www.vishay.com/doc?53048.
Option to order: 0063 (applies to size 1206/2010).
DIMENSIONS
(Option 0063) in millimeters
Bottom view for mounting
A
Uncoated
ceramic
Enlarged
termination
B
F
D
E
A
CASE SIZE
MAX. TOL.
+ 0.152
MIN. TOL.
- 0.152
NOMINAL
1206
2010
3.06
5.08
B
MAX. TOL.
+ 0.127
MIN. TOL.
- 0.127
NOMINAL
1.60
2.54
E
MAX. TOL.
+ 0.13
MIN. TOL.
- 0.13
NOMINAL
0.40
0.48
D
MAX. TOL.
+ 0.13
MIN. TOL.
- 0.13
NOMINAL
1.215
2.25
NOMINAL
0.63
F
MIN.
0.50
MAX.
0.76
SUGGESTED LAND PATTERN
(Option 0063)
G
min.
X
max.
Z
max.
CHIP SIZE
1206
2010
DIMENSIONS (in millimeter)
Z
max.
3.91
5.93
G
min.
0.50
X
max.
1.73
2.67
Revision: 28-Nov-11
4
For technical questions, contact:
sfer@vishay.com
Document Number: 53050
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
PHT
www.vishay.com
PACKAGING
ESD packaging available: waffle-pack, and plastic tape and
reel (low conductivity). Paper tape available upon request
(ESD only).
NUMBER OF PIECES PER PACKAGE
SIZE MOQ
WAFFLE PACK
2" × 2"
TAPE AND REEL
MIN.
MAX.
TAPE
WIDTH
Vishay Sfernice
PACKAGING RULES
Waffle Pack
Can be filled up to maximum quantity indicated in the table
here above, taking into account the minimum order quantity.
When quantity ordered exceeds maximum quantity of a
single waffle pack, the waffle packs are stacked up on the
top of each other and closed by one single cover.
To get “not stacked up” waffle pack in case of ordered
quantity > maximum number of pieces per package:
Please consult Vishay Sfernice for specific ordering
code.
Tape and Reel
Can be filled up to maximum quantity indicated in the table
here above, taking into account the minimum order quantity.
When quantity ordered is between the MOQ and the
maximum reel capacity, only one reel is provided.
When several reels are needed for ordered quantity
within MOQ and maximum reel capacity: Please consult
Vishay Sfernice for specific ordering code.
0603
100
0805
100
1206
2010
Note
(1)
12 mm on request
140
60
2000
8 mm
(1)
100
4000
8 mm
GLOBAL PART NUMBER INFORMATION
Global Part Numbering: PHT1206Y1001BGT063
P
H
T
1
2
0
6
Y
1
0
0
1
B
G
T
0
6
3
GLOBAL
MODEL
PHT
SIZE
0603
0805
1206
2010
TCR
Y
E
H
VALUE
The first three digits are
significant figures and
the last digit specifies
the number of zeros to
follow, R designates
decimal point
10R0
= 10
3901
= 3900
1004
= 1 M
TOLERANCE
W
= 0.05 %
B
= 0.1 %
D
= 0.5 %
F
=1%
TERMINATION
G
= Gold
N
= Tin/silver
(2)
PACKAGING
T
= Tape and reel
Blank
= Waffle pack
OPTION
Leave blank
if no option
Note
(2)
For usage at temperatures up to 200 °C maximum N (tin/silver termination are available upon request)
Revision: 28-Nov-11
5
For technical questions, contact:
sfer@vishay.com
Document Number: 53050
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
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