CY7C1041DV33
4-Mbit (256 K × 16) Static RAM
4-Mbit (256 K × 16) Static RAM
Features
■
Functional Description
The CY7C1041DV33 is a high performance CMOS Static RAM
organized as 256 K words by 16-bits. To write to the device, take
chip enable (CE) and write enable (WE) inputs LOW. If byte low
enable (BLE) is LOW, then data from I/O pins (I/O
0
to I/O
7
) is
written into the location specified on the address pins (A
0
to A
17
).
If byte high enable (BHE) is LOW, then data from I/O pins (I/O
8
to I/O
15
) is written into the location specified on the address pins
(A
0
to A
17
).
To read from the device, take chip enable (CE) and output enable
(OE) LOW while forcing the write enable (WE) HIGH. If BLE is
LOW, then data from the memory location specified by the
address pins appears on I/O
0
to I/O
7
. If BHE is LOW, then data
from memory appears on I/O
8
to I/O
15
. See the
Truth Table on
page 10
for a complete description of read and write modes.
The input and output pins (I/O
0
to I/O
15
) are placed in a high
impedance state when the device is deselected (CE HIGH),
outputs are disabled (OE HIGH), BHE and BLE are disabled
(BHE, BLE HIGH), or during a write operation (CE LOW and WE
LOW).
The CY7C1041DV33 is available in a standard 44-pin 400-mil
wide SOJ and 44-pin TSOP II package with center power and
ground (revolutionary) pinout and a 48-ball fine-pitch ball grid
array (FBGA) package.
For best practice recommendations, refer to the Cypress
application note
AN1064, SRAM System Guidelines.
Temperature ranges
❐
Industrial: –40 °C to 85 °C
[1]
❐
Automotive-A
: –40 °C to 85 °C
[1]
: –40 °C to 125 °C
❐
Automotive-E
Pin and function compatible with CY7C1041CV33
High speed
❐
t
AA
= 10 ns
Low active power
❐
I
CC
= 90 mA at 10 ns (industrial)
Low CMOS standby power
❐
I
SB2
= 10 mA
2.0 V data retention
Automatic power-down when deselected
TTL compatible inputs and outputs
Easy memory expansion with CE and OE features
Available in Pb-free 48-ball VFBGA, 44-pin (400-mil) molded
SOJ, and 44-pin TSOP II Packages
■
■
■
■
■
■
■
■
■
Logic Block Diagram
INPUT BUFFER
A
0
A
1
A
2
A
3
A
4
A
5
A
6
A
7
A
8
ROW DECODER
SENSE AMPS
IO
0
–IO
7
IO
8
–IO
15
256K × 16
COLUMN
DECODER
A
9
A
10
A
11
A
12
A
13
A
14
A
15
A
16
A
17
BHE
WE
CE
OE
BLE
Note
1. Automotive product information is preliminary.
Cypress Semiconductor Corporation
Document Number: 38-05473 Rev. *I
•
198 Champion Court
•
San Jose
,
CA 95134-1709
•
408-943-2600
Revised January 24, 2011
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CY7C1041DV33
Contents
Selection Guide ................................................................ 3
Pin Configuration ............................................................. 3
Maximum Ratings ............................................................. 4
Operating Range ............................................................... 4
DC Electrical Characteristics .......................................... 4
Capacitance ...................................................................... 5
Thermal Resistance .......................................................... 5
AC Test Loads and Waveforms ....................................... 5
AC Switching Characteristics ......................................... 6
Data Retention Characteristics ....................................... 7
Data Retention Waveform ................................................ 7
Switching Waveforms ...................................................... 7
Truth Table ...................................................................... 10
Ordering Information ...................................................... 11
Ordering Code Definitions ......................................... 11
Package Diagrams .......................................................... 12
Acronyms ........................................................................ 15
Document Conventions ................................................. 15
Units of Measure ....................................................... 15
Document History Page ................................................. 16
Sales, Solutions, and Legal Information ...................... 17
Worldwide Sales and Design Support ....................... 17
Products .................................................................... 17
PSoC Solutions ......................................................... 17
Document Number: 38-05473 Rev. *I
Page 2 of 17
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CY7C1041DV33
Selection Guide
Description
Maximum access time
Maximum operating current
Maximum CMOS standby current
–10 (Industrial)
10
90
10
–10 (Automotive-A)
[2]
10
90
10
–12 (Automotive-E)
[2]
12
95
15
Unit
ns
mA
mA
Pin Configuration
Figure 1. 48-ball VFBGA (Pinout 1)
[3, 4]
1
BLE
IO
0
IO
1
V
SS
V
CC
IO
6
IO
7
NC
2
OE
BHE
IO
2
IO
3
IO
4
IO
5
NC
A
8
3
A
0
A
3
A
5
A
17
NC
A
14
A
12
A
9
4
A
1
A
4
A
6
A
7
A
16
A
15
A
13
A
10
5
A
2
CE
IO
10
6
NC
IO
8
IO
9
A
B
C
D
E
F
G
H
Figure 2. 48-ball VFBGA (Pinout 2)
[3, 4]
1
BLE
IO
8
IO
9
V
SS
V
CC
IO
14
IO
15
NC
2
OE
BHE
IO
10
IO
11
IO
12
IO
13
NC
A
8
3
A
0
A
3
A
5
A
17
NC
A
14
A
12
A
9
4
A
1
A
4
A
6
A
7
A
16
A
15
A
13
A
10
5
A
2
CE
IO
1
IO
3
IO
4
IO
5
WE
A
11
6
NC
IO
0
IO
2
V
CC
V
SS
IO
6
IO
7
NC
A
B
C
D
E
F
G
H
IO
11
V
CC
IO
12
IO
13
WE
A
11
V
SS
IO
14
IO
15
NC
Figure 3. 44-pin SOJ/TSOP II
A
0
A
1
A
2
A
3
A
4
CE
IO
0
IO
1
IO
2
IO
3
V
CC
V
SS
IO
4
IO
5
IO
6
IO
7
WE
A
5
A
6
A
7
A
8
A
9
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
A
17
A
16
A
15
OE
BHE
BLE
IO
15
IO
14
IO
13
IO
12
V
SS
V
CC
IO
11
IO
10
IO
9
IO
8
NC
A
14
A
13
A
12
A
11
A
10
Notes
2. Automotive product information is preliminary.
3. NC pins are not connected on the die.
4. Pinout 1 is compliant with CY7C1041CV33 and pinout 2 is JEDEC compliant. The difference between the two is that the higher and lower byte I/Os (I/O
[7:0]
and I/O
[15:8]
balls) are swapped.
Document Number: 38-05473 Rev. *I
Page 3 of 17
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CY7C1041DV33
Maximum Ratings
Exceeding maximum ratings may impair the useful life of the
device. These user guidelines are not tested.
Storage temperature ................................ –65
°C
to +150
°C
Ambient temperature with
power applied ........................................... –55
°C
to +125
°C
Supply voltage on V
CC
relative to GND
[5]
....–0.3 V to +4.6 V
DC voltage applied to outputs
in high Z State
[5]
................................... –0.3 V to V
CC
+0.3 V
DC input
voltage
[5]
................................ –0.3 V to V
CC
+0.3 V
Current into outputs (LOW) ......................................... 20 mA
Static discharge voltage............ ...............................> 2001 V
(MIL-STD-883, method 3015)
Latch-up current ..................................................... > 200 mA
Operating Range
Range
Industrial
Automotive-A
[1]
Automotive-E
[1]
Ambient
Temperature
V
CC
Speed
10 ns
10 ns
12 ns
–40
°C
to +85
°C
3.3 V
±
0.3 V
–40
°C
to +85
°C
3.3 V
±
0.3 V
–40
°C
to +125
°C
3.3 V
±
0.3 V
DC Electrical Characteristics
Over the Operating Range
Parameter
V
OH
V
OL
V
IH[5]
V
IL[5]
I
IX
I
OZ
I
CC
Description
Test Conditions
–10
(Industrial)
Min
Output HIGH voltage V
CC
= Min, I
OH
= –4.0 mA
Output LOW voltage
Input HIGH voltage
Input LOW voltage
Input leakage current GND < V
I
< V
CC
Output leakage
current
V
CC
operating
supply current
GND < V
OUT
< V
CC
, output
disabled
V
CC
= Max,
f = f
MAX
= 1/t
RC
100 MHz
83 MHz
66 MHz
40 MHz
I
SB1
Automatic CE
power-down current
—TTL inputs
Automatic CE
power-down current
—CMOS inputs
Max V
CC
, CE > V
IH
V
IN
> V
IH
or
V
IN
< V
IL
, f = f
MAX
Max V
CC
,
CE > V
CC
– 0.3 V,
V
IN
> V
CC
– 0.3 V,
or V
IN
< 0.3 V, f = 0
V
CC
= Min, I
OL
= 8.0 mA
2.4
–
2.0
–0.3
–1
–1
–
–
–
–
–
Max
–
0.4
V
CC
+ 0.3
0.8
+1
+1
90
80
70
60
20
–10
–12
(Automotive-A)
[6]
(Automotive-E)
[6]
Unit
Min
Max
Min
Max
2.4
–
2.0
–0.3
–1
–1
–
–
–
–
–
–
0.4
V
CC
+ 0.3
0.8
+1
+1
90
80
70
60
20
2.4
–
2.0
–0.3
–1
–1
–
–
–
–
–
–
0.4
V
CC
+ 0.3
0.8
+1
+1
–
95
85
75
15
V
V
V
V
μA
μA
mA
mA
mA
mA
mA
I
SB2
–
10
–
10
–
15
mA
Notes
5. Minimum voltage is –2.0 V and V
IH
(max) = V
CC
+ 2 V for pulse durations of less than 20 ns.
6. Automotive product information is preliminary.
Document Number: 38-05473 Rev. *I
Page 4 of 17
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CY7C1041DV33
Capacitance
[7]
Parameter
C
IN
C
OUT
Description
Input capacitance
I/O capacitance
Test Conditions
T
A
= 25
°C,
f = 1 MHz, V
CC
= 3.3 V
Max
8
8
Unit
pF
pF
Thermal Resistance
[7]
Parameter
Θ
JA
Θ
JC
Description
Thermal resistance
(junction to ambient)
Thermal resistance
(junction to case)
Test Conditions
Still Air, soldered on a 3 × 4.5 inch,
four layer printed circuit board
FBGA
Package
27.89
14.74
SOJ
Package
57.91
36.73
TSOP II
Package
50.66
17.17
Unit
°C/W
°C/W
AC Test Loads and Waveforms
The AC test loads and waveform diagram follows.
[8]
10 ns device
OUTPUT
50
Ω
* CAPACITIVE LOAD CONSISTS
OF ALL COMPONENTS OF THE
TEST ENVIRONMENT
High-Z Characteristics
3.3V
OUTPUT
5 pF
R2
351Ω
(c)
R 317Ω
1.5V
Rise Time: 1 V/ns
(a)
(b)
Fall Time: 1 V/ns
30 pF*
Z = 50
Ω
3.0V
GND
ALL INPUT PULSES
90%
10%
90%
10%
Notes
7. Tested initially and after any design or process changes that may affect these parameters.
8. AC characteristics (except high Z) are tested using the load conditions shown in
AC Test Loads and Waveforms
(a). High Z characteristics are tested for all speeds
using the test load shown in (c).
Document Number: 38-05473 Rev. *I
Page 5 of 17
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