Chip Resistor Arrays/Networks
FEATURES
• MINIATURE SIZE AND LOW PROFILE
•
ANTI-SULFUR & AEC-Q200 QUALIFIED
RoHS
• HIGH DENSITY PACKAGING OFFERS SIGNIFICANT SPACE SAVINGS
Compliant
• LOWER PRODUCTION COSTS WITH LESS PLACEMENT
includes all homogeneous materials
(4 RESISTORS IN ONE PACKAGE)
*See Part Number System for Details
• REFLOW SOLDERING APPLICABLE
NRSNS Series
SPECIFICATIONS
Type
Termination Type
Size W x L (mm)
No. of Resistors & Circuit
Power Rating per Resistor @ +70°C
Resistance Tolerance
Resistance Range
Temperature Coefficient
Maximum Working Voltage*
Maximum Overload Voltage
Operating Temperature Range
NRSNSA4I4
Convex
1.0 x 2.0
4R Isolated
1/16 (.0625W)
F (±1%)
10Ω ~ 1MΩ
±300ppm
25V
50V
J (±5%)
F (±1%)
10Ω ~ 1MΩ
±200ppm
50V
100V
NRSNSA6I4
Convex
1.6 x 3.2
4R Isolated
1/10 (.10W)
J (±5%)
-55°C ~ +125°C (derated as shown)
* Maximum allowable continuous voltage for all resistors is the
lower of the two values: “MAXIMUM WORKING VOLTAGE” as
specified, or
Power rating (WATTS) x Resistance (OHMS)
Power Derating Curve:
For operation above 70
o
C, power
rating must be derated according to the following chart:
100
ZERO OHM JUMPER SPECIFICATIONS
Part Number
Termination Type
Size W x L (mm)
No. of Resistors & Circuit
Power Rating @ +70°C
Max. Resistance
Rated Current
Peak Current
Operating Temperature
NRSNSA4I4ZOTRQYF NRSNSA6I4ZOTRQYF
Convex
Convex
1.0 x 2.0
1.6 x 3.2
4R Isolated
4R Isolated
1/16W
1/10W
50mΩ
50mΩ
1A
1A
1.5A
3.0A
-55°C ~ +125°C (derated as shown)
80
60
40
20
0
-55
0
70
100
125°C
1
NIC COMPONENTS CORP.
www.niccomp.com
www.lowESR.com
www.RFpassives.com
www.SMTmagnetics.com
SPECIFICATIONS ARE SUBJECT TO CHANGE
Chip Resistor Arrays/Networks
PART DIMENSIONS (mm)
Type
W
L
P
T
A
B
C
G
NRSNSA4I4 1.00 ± 0.10 2.00 ± 0.10 0.50 ± 0.05 0.45 ± 0.10 0.40 ± 0.10 0.20 ± 0.10 0.30 ± 0.05 0.25 ± 0.10
NRSNSA6I4 1.60 ± 0.10 3.20 ± 0.10 0.80 ± 0.10 0.50 ± 0.10 0.60 ± 0.10 0.30 ± 0.10 0.40 ± 0.10 0.30 ± 0.20
NRSNSA4I4, NRSNSA6I4
Marking: 1% & 5%
E-24 values only
P
B
Terminations
A
G
NRSNS Series
CIRCUIT SCHEMATICS
682
L
Top Side
W
T
C
Bottom Side
NRSNSA4I4
NRSNSA6I4
Circuit Type “I” (Isolated)
PART NUMBER SYSTEM (5% TOLERANCE E-24 VALUES)
NRSNS A 4I4 J 103 TR Q Y F
RoHS compliant
Q = AEC Q-200 qualified
Tape & Reel Packaging
Resistance Code: First 2 figures are significant,
3rd digit is the multiplier, “R”
indicates a decimal point.
Tolerance Code: J=5%
Configuration Designator
(See circuit schematics and component
diagrams for explanation)
Termination Type (A = Convex)
Series
"Y" denotes suitable for automotive equipment, sourced to special
production and inspection at IATF-16949 certified production site
PART NUMBER SYSTEM (1% TOLERANCE E-24 & E-96 VALUES)
NRSNS A 4I4 F 1002 TR Q Y F
RoHS compliant
Q = AEC Q-200 qualified
Tape & Reel Packaging
Resistance Code: First 2 figures are significant,
3rd digit is the multiplier, “R”
indicates a decimal point.
Tolerance Code: F=1%
Configuration Designator
(See circuit schematics and component
diagrams for explanation)
Termination Type (A = Convex)
Series
"Y" denotes suitable for automotive equipment, sourced to special
production and inspection at IATF-16949 certified production site
2
NIC COMPONENTS CORP.
www.niccomp.com
www.lowESR.com
www.RFpassives.com
www.SMTmagnetics.com
SPECIFICATIONS ARE SUBJECT TO CHANGE
Chip Resistor Arrays/Networks
ENVIRONMENTAL SPECIFICATIONS
Specification
Item
1% & 5%
Tolerance
As specified
∆R
±0.5%+0.05Ω
NRSNS Series
Zero Ohm
Jumper
N/A
<50mΩ
Test Method
DC Resistance & TCR
JIS C5201-1 (1998) Clause 4.8
Resistance to Soldering Heat
MIL-STD-202, Method 201
Solderability
J-STD-202
Temperature Cycling
JESD22, Method JA-104
Resistance at reference temperature (+20°C +5°C -1°C)
to test temperature
Unmounted chips completely immersed in SAC solder bath
at 270°C ± 5°C for 10 sec. ±1 sec.
a) Bake sample @ +155°C for 4 hours, dip in solder bath
at 235°C for 5 sec.
b) Steam sample 1 hour, dip in solder bath
at 260°C for 7 sec.
1,000 cycles, -55°C ~ +155°C, dwell time 5 ~ 10 minutes
>95% coverage
No visable damage
∆R
±0.5%+0.05Ω
<50mΩ
Load Life
MIL-STD-202, Method 108
∆R
±1%+0.05Ω
No visible damage
<50mΩ
1,000 hrs ±48 hrs, +125°C ± 2°C, 35% of operating power
Humidity Load Life
MIL-STD-202, Method 103
Moisture Resistance
MIL-STD-202, Method 106
High Temperature Exposure
MIL-STD-202, Method 108
Thermal Shock
MIL-STD-202, Method 107
Board Flex
AEC-Q200-005
Vibration
MIL-STD-202, Method 204
ESD
AEC-Q200-002
Terminal Strength
AEC-Q200-006
∆R
±1%+0.05Ω
No visible damage
∆R
±1%+0.10Ω
No visible damage
∆R
±1%+0.05Ω
No visible damage
∆R
±0.5%+0.05Ω
No visible damage
∆R
±1.0%+0.05Ω
No visible damage
∆R
±1.0%+0.05Ω
No visible damage
∆R
±1.0%+0.05Ω
No visible damage
<50mΩ
<50mΩ
<50mΩ
<50mΩ
<50mΩ
<50mΩ
<50mΩ
1,000 hrs ± 48 hrs, +85°C, 85%RH, 10% of operating power
10 cycles, 24 hours/cycle, +65°C ± 2°C, 80 ~ 100%RH
1,000 hrs ±48 hrs, +125°C ± 3°C, without load
300 cycles, -55°C ~ +125°C, dwell time 15 minutes,
maximum transfer time 20 seconds
Resistors mounted on a 90mm glass epoxy resin PCB(FR4),
bending once 2mm for 10 seconds
5g's for 20 minutes, 12 cycles each in 3 orientations
Test contact 1KV
Force of 1Kg applied for 60 seconds ± 1 second
No remarkable damage or removal of
the termination
Note: Anti-Sulfur test conditions - H2S 3ppm, +40°C, 90% RH, 1000 hours (±1% specification variation)
3
NIC COMPONENTS CORP.
www.niccomp.com
www.lowESR.com
www.RFpassives.com
www.SMTmagnetics.com
SPECIFICATIONS ARE SUBJECT TO CHANGE
Chip Resistor Arrays/Networks
LAND PATTERN DIMENSIONS (mm)
Type
NRSNSA4I4
NRSNSA6I4
A
1.80 +0.15/-0.05
2.85 +0.10/-0.05
B
0.30 ± 0.05
0.45 ± 0.05
Reflow Soldering
D
0.50 ± 0.10
0.80 ± 0.10
A
P
NRSNS Series
P
0.50
0.80
F
2.00 +0.40/-0.20
3.10±0.30
D
F
B
NRSNSA4I4 & NRSNSA6I4
TAPE DIMENSIONS (mm)
Type
NRSNSA4I4
NRSNSA6I4
Material
Paper
A
1.20 ± 0.2
2.00 ± 0.2
B
2.20 ± 0.2
3.60 ± 0.2
E
1.75 ± 0.10
F
3.5 ± 0.20
P
2.0 ± 0.05
4.0 ± 0.1
W
8.0 ± 0.3
T
0.6 max.
1.0 max.
φ1.5+0.1/-0.0
4.0 ±0.1
E
F
B
W
T
A
P
4
NIC COMPONENTS CORP.
www.niccomp.com
www.lowESR.com
www.RFpassives.com
www.SMTmagnetics.com
SPECIFICATIONS ARE SUBJECT TO CHANGE
Chip Resistor Arrays/Networks
REEL DIMENSIONS (mm)
Type
NRSNSA4I4
NRSNSA6I4
A
φ178
±2.0
B
φ60
±1.0
C
φ13.0
±0.2
D
φ21.0
±1.0
W
9.0
±0.5
Qty/Reel
10,000
5,000
NRSNS Series
C
B
D
W
A
5
NIC COMPONENTS CORP.
www.niccomp.com
www.lowESR.com
www.RFpassives.com
www.SMTmagnetics.com
SPECIFICATIONS ARE SUBJECT TO CHANGE
Microcontroller MCU
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