Flash, 8MX16, 110ns, PBGA64, 13 X 11 MM, 1 MM PITCH, FBGA-64
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Parts packaging code | BGA |
package instruction | 13 X 11 MM, 1 MM PITCH, FBGA-64 |
Contacts | 64 |
Reach Compliance Code | compliant |
ECCN code | 3A991.B.1.A |
Maximum access time | 110 ns |
Spare memory width | 8 |
JESD-30 code | R-PBGA-B64 |
JESD-609 code | e0 |
length | 13 mm |
memory density | 134217728 bit |
Memory IC Type | FLASH |
memory width | 16 |
Humidity sensitivity level | 3 |
Number of functions | 1 |
Number of terminals | 64 |
word count | 8388608 words |
character code | 8000000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 8MX16 |
Package body material | PLASTIC/EPOXY |
encapsulated code | LBGA |
Package shape | RECTANGULAR |
Package form | GRID ARRAY, LOW PROFILE |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | 240 |
Programming voltage | 3 V |
Certification status | Not Qualified |
Maximum seat height | 1.4 mm |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 2.7 V |
Nominal supply voltage (Vsup) | 3 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | TIN LEAD |
Terminal form | BALL |
Terminal pitch | 1 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | 30 |
type | NOR TYPE |
width | 11 mm |
Base Number Matches | 1 |