Field Programmable Gate Array, 93675 CLBs, 500MHz, 89178-Cell, CMOS, PBGA572, 25 X 25 MM, LEAD FREE, MS-034, FBGA-572
Parameter Name | Attribute value |
Is it Rohs certified? | conform to |
package instruction | 25 X 25 MM, LEAD FREE, MS-034, FBGA-572 |
Reach Compliance Code | compliant |
ECCN code | 3A991 |
maximum clock frequency | 500 MHz |
JESD-30 code | S-PBGA-B572 |
JESD-609 code | e1 |
length | 25 mm |
Humidity sensitivity level | 3 |
Configurable number of logic blocks | 93675 |
Number of entries | 260 |
Number of logical units | 89178 |
Output times | 260 |
Number of terminals | 572 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | |
organize | 93675 CLBS |
Package body material | PLASTIC/EPOXY |
encapsulated code | HBGA |
Encapsulate equivalent code | BGA572,24X24,40 |
Package shape | SQUARE |
Package form | GRID ARRAY, HEAT SINK/SLUG |
Peak Reflow Temperature (Celsius) | 260 |
power supply | 0.9,1.2/3.3,1.5,2.5 V |
Programmable logic type | FIELD PROGRAMMABLE GATE ARRAY |
Certification status | Not Qualified |
Maximum seat height | 2.2 mm |
Maximum supply voltage | 0.93 V |
Minimum supply voltage | 0.87 V |
Nominal supply voltage | 0.9 V |
surface mount | YES |
technology | CMOS |
Temperature level | OTHER |
Terminal surface | Tin/Silver/Copper (Sn/Ag/Cu) |
Terminal form | BALL |
Terminal pitch | 1 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | 40 |
width | 25 mm |
Base Number Matches | 1 |