AS9C25128M2036L-133FI datasheet, PDF

AS9C25128M2036L-133FI: DescriptionDual-Port SRAM, 128KX36, 12ns, CMOS, PBGA208, FBGA-208; Categorystorage storage; File Size1MB，30 Pages; ManufacturerALSC [Alliance Semiconductor Corporation]

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AS9C25128M2036L-133FI Overview

Dual-Port SRAM, 128KX36, 12ns, CMOS, PBGA208, FBGA-208

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	ALSC [Alliance Semiconductor Corporation]
Parts packaging code	BGA
package instruction	LFBGA,
Contacts	208
Reach Compliance Code	compliant
ECCN code	3A991.B.2.A
Maximum access time	12 ns
Other features	FLOW-THROUGH OR PIPELINED ARCHITECTURE
JESD-30 code	S-PBGA-B208
JESD-609 code	e0
length	15 mm
memory density	4718592 bit
Memory IC Type	DUAL-PORT SRAM
memory width	36
Number of functions	1
Number of terminals	208
word count	131072 words
character code	128000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	128KX36
Package body material	PLASTIC/EPOXY
encapsulated code	LFBGA
Package shape	SQUARE
Package form	GRID ARRAY, LOW PROFILE, FINE PITCH
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum seat height	1.4 mm
Maximum supply voltage (Vsup)	2.6 V
Minimum supply voltage (Vsup)	2.4 V
Nominal supply voltage (Vsup)	2.5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	TIN LEAD
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	15 mm
Base Number Matches	1

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