NXP Semiconductors
Data Sheet: Technical Data
K24P144M120SF5
Rev. 7, 11/2016
Kinetis K24F Sub-Family Data
Sheet
120 MHz ARM® Cortex®-M4-based Microcontroller with FPU
The K24 product family members are optimized for cost-sensitive
applications requiring low-power, USB connectivity, and up to
256 KB of embedded SRAM. These devices share the
comprehensive enablement and scalability of the Kinetis family.
This product offers:
• Run power consumption down to 250 μA/MHz. Static
power consumption down to 5.8 μA with full state retention
and 5 μs wakeup. Lowest Static mode down to 339 nA
• USB LS/FS OTG 2.0 with embedded 3.3 V, 120 mA LDO
Vreg, with USB device crystal-less operation
MK24FN1M0VLQ12
MK24FN1M0VLL12
MK24FN1M0VDC12
121 XFBGA
8 x 8 x 0.5 mm Pitch
0.65 mm
144 LQFP
20 x 20 x 1.6 mm Pitch
0.5 mm
100 QFP
14 x 14 x 1.7 mm Pitch 0.5 mm
Performance
• Up to 120 MHz ARM® Cortex®-M4 core with DSP
instructions and floating point unit
Memories and memory interfaces
• Up to 1 MB program flash memory and 256 KB RAM
• FlexBus external bus interface
System peripherals
• Multiple low-power modes, low-leakage wake-up unit
• Memory protection unit with multi-master protection
• 16-channel DMA controller
• External watchdog monitor and software watchdog
Security and integrity modules
• Hardware CRC module
• Hardware random-number generator
• Hardware encryption supporting DES, 3DES, AES,
MD5, SHA-1, and SHA-256 algorithms
• 128-bit unique identification (ID) number per chip
Analog modules
• Two 16-bit SAR ADCs
• Two 12-bit DACs
• Three analog comparators (CMP)
• Voltage reference
Communication interfaces
• USB full-/low-speed On-the-Go controller
• Controller Area Network (CAN) module
• Three SPI modules
• Three I2C modules. Support for up to 1 Mbit/s
• Six UART modules
• Secure Digital Host Controller (SDHC)
• I2S module
Timers
• Two 8-channel Flex-Timers (PWM/Motor control)
• Two 2-channel FlexTimers (PWM/Quad decoder)
• 32-bit PITs and 16-bit low-power timers
• Real-time clock
• Programmable delay block
Clocks
• 3 to 32 MHz and 32 kHz crystal oscillator
• PLL, FLL, and multiple internal oscillators
• 48 MHz Internal Reference Clock (IRC48M)
Operating Characteristics
• Voltage range: 1.71 to 3.6 V
• Flash write voltage range: 1.71 to 3.6 V
• Temperature range (ambient): –40 to 105°C
NXP reserves the right to change the production detail specifications as may be
required to permit improvements in the design of its products.
Ordering Information
1
Part Number
Flash (KB)
MK24FN1M0VLL12
MK24FN1M0VDC12
MK24FN1M0VLQ12
1 MB
1 MB
1 MB
Memory
SRAM (KB)
256
256
256
66
83
100
Maximum number of I\O's
1. To confirm current availability of ordererable part numbers, go to
http://www.nxp.com
and perform a part number search.
Related Resources
Type
Selector
Guide
Product Brief
Reference
Manual
Data Sheet
Package
drawing
Description
The NXP Solution Advisor is a web-based tool that features interactive
application wizards and a dynamic product selector.
The Product Brief contains concise overview/summary information to
enable quick evaluation of a device for design suitability.
The Reference Manual contains a comprehensive description of the
structure and function (operation) of a device.
The Data Sheet includes electrical characteristics and signal
connections.
Package dimensions are provided in package drawings.
Resource
Solution Advisor
K60PB
1
K24P144M120SF5RM
1
K24P144M120SF5
1
• 100-pin LQFP:
98ASS23308
1
• XFBGA 121-pin:
98ASA00595D
1
• LQFP 144-pin:
98ASS23177W
1
1. To find the associated resource, go to
http://www.nxp.com
and perform a search using this term.
2
NXP Semiconductors
Kinetis K24F Sub-Family Data Sheet, Rev. 7, 11/2016
Kinetis K24 Family
ARM
®
Cortex™-M4
Core
System
Internal
and external
watchdogs
Debug
interfaces
Interrupt
controller
DSP
DMA
Memories and Memory Interfaces
Program
flash
Clocks
Phase-
locked loop
Frequency-
locked loop
Low/high
frequency
oscillators
RAM
Serial
programming
interface
FlexBus
Floating
point
Low-leakage
wakeup
Memory
Protection
Internal
reference
clocks
and Integrity
CRC
Random
number
generator
Hardware
encryption
Security
Analog
16-bit ADC
x2
Timers
Timers
x2 (8ch)
x2 (2ch)
Programmable
Communication Interfaces
I
C
x3
UART
x6
SPI
x3
SDHC
x1
CAN
x1
2
Human-Machine
Interface (HMI)
GPIO
I
S
x1
USB OTG
LS/FS
2
Analog
comparator
x3
6-bit DAC
x3
12-bit DAC
x2
delay block
Periodic
interrupt
timers
Low power
timer
USB LS/FS
transceiver
USB charger
detect
USB voltage
regulator
Voltage
reference
Independent
real-time
clock
Figure 1. K24 block diagram
Kinetis K24F Sub-Family Data Sheet, Rev. 7, 11/2016
3
NXP Semiconductors
Table of Contents
1 Ratings.................................................................................... 5
1.1 Thermal handling ratings................................................. 5
1.2 Moisture handling ratings................................................ 5
1.3 ESD handling ratings....................................................... 5
1.4 Voltage and current operating ratings............................. 5
2 General................................................................................... 6
2.1 AC electrical characteristics.............................................6
2.2 Nonswitching electrical specifications..............................6
2.2.1
Voltage and current operating requirements.....6
2.2.2
LVD and POR operating requirements............. 8
2.2.3
Voltage and current operating behaviors.......... 8
2.2.4
Power mode transition operating behaviors......10
2.2.5
Power consumption operating behaviors.......... 11
2.2.6
EMC radiated emissions operating behaviors...16
2.2.7
Designing with radiated emissions in mind....... 17
2.2.8
Capacitance attributes...................................... 17
2.3 Switching specifications...................................................17
2.3.1
Device clock specifications............................... 17
2.3.2
General switching specifications....................... 18
2.4 Thermal specifications..................................................... 19
2.4.1
Thermal operating requirements....................... 19
2.4.2
Thermal attributes............................................. 20
3 Peripheral operating requirements and behaviors.................. 21
3.1 Core modules.................................................................. 21
3.1.1
Debug trace timing specifications..................... 21
3.1.2
JTAG electricals................................................ 22
3.2 System modules.............................................................. 25
3.3 Clock modules................................................................. 25
3.3.1
MCG specifications........................................... 25
3.3.2
IRC48M specifications...................................... 27
3.3.3
Oscillator electrical specifications..................... 28
3.3.4
32 kHz oscillator electrical characteristics.........30
3.4 Memories and memory interfaces................................... 31
3.4.1
3.4.2
3.4.3
Flash (FTFE) electrical specifications............... 31
EzPort switching specifications......................... 33
Flexbus switching specifications....................... 34
3.6.2
3.6.3
3.6.4
CMP and 6-bit DAC electrical specifications.....42
12-bit DAC electrical characteristics................. 44
Voltage reference electrical specifications........ 47
3.7 Timers..............................................................................48
3.8 Communication interfaces............................................... 48
3.8.1
USB electrical specifications............................. 49
3.8.2
3.8.3
3.8.4
3.8.5
3.8.6
USB DCD electrical specifications.................... 49
USB VREG electrical specifications..................49
CAN switching specifications............................ 50
DSPI switching specifications (limited voltage
range)................................................................50
DSPI switching specifications (full voltage
range)................................................................52
3.8.7
Inter-Integrated Circuit Interface (I2C) timing....54
3.8.8
UART switching specifications.......................... 55
3.8.9
SDHC specifications......................................... 56
3.8.10 I2S switching specifications.............................. 56
4 Dimensions............................................................................. 62
4.1 Obtaining package dimensions....................................... 62
5 Pinout...................................................................................... 63
5.1 K24 Signal Multiplexing and Pin Assignments.................63
5.2 Unused analog interfaces................................................ 69
5.3 K24 Pinouts..................................................................... 70
6 Ordering parts......................................................................... 73
6.1 Determining valid orderable parts....................................73
7 Part identification.....................................................................74
7.1 Description.......................................................................74
7.2 Format............................................................................. 74
7.3 Fields............................................................................... 74
7.4 Example...........................................................................75
8 Terminology and guidelines.................................................... 75
8.1 Definitions........................................................................ 75
8.2 Examples......................................................................... 76
8.3 Typical-value conditions.................................................. 76
8.4 Relationship between ratings and operating
requirements....................................................................77
8.5 Guidelines for ratings and operating requirements..........77
9 Revision History...................................................................... 78
3.5 Security and integrity modules........................................ 37
3.6 Analog............................................................................. 37
3.6.1
ADC electrical specifications.............................38
4
NXP Semiconductors
Kinetis K24F Sub-Family Data Sheet, Rev. 7, 11/2016
Ratings
1 Ratings
1.1 Thermal handling ratings
Symbol
T
STG
T
SDR
Description
Storage temperature
Solder temperature, lead-free
Solder temperature, leaded
Min.
–55
—
—
Max.
150
260
245
Unit
°C
°C
Notes
1
2
1. Determined according to JEDEC Standard JESD22-A103,
High Temperature Storage Life.
2. Determined according to IPC/JEDEC Standard J-STD-020,
Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices.
1.2 Moisture handling ratings
Symbol
MSL
Description
Moisture sensitivity level
Min.
—
Max.
3
Unit
—
Notes
1
1. Determined according to IPC/JEDEC Standard J-STD-020,
Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices.
1.3 ESD handling ratings
Symbol
V
HBM
V
CDM
I
LAT
Description
Electrostatic discharge voltage, human body model
Electrostatic discharge voltage, charged-device
model
Latch-up current at ambient temperature of 105°C
Min.
-2000
-500
-100
Max.
+2000
+500
+100
Unit
V
V
mA
Notes
1
2
3
1. Determined according to JEDEC Standard JESD22-A114,
Electrostatic Discharge (ESD) Sensitivity Testing Human
Body Model (HBM).
2. Determined according to JEDEC Standard JESD22-C101,
Field-Induced Charged-Device Model Test Method for
Electrostatic-Discharge-Withstand Thresholds of Microelectronic Components.
3. Determined according to JEDEC Standard JESD78,
IC Latch-Up Test.
1.4 Voltage and current operating ratings
Kinetis K24F Sub-Family Data Sheet, Rev. 7, 11/2016
5
NXP Semiconductors
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