WS32K32N-35H1C datasheet, PDF - EEWORLD Datasheet

WS32K32N-35H1C: DescriptionSRAM Module, 32KX32, 35ns, Hybrid, CPGA66,; Categorystorage storage; File Size267KB，7 Pages; ManufacturerMicrosemi; Websitehttps://www.microsemi.com

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WS32K32N-35H1C Overview

SRAM Module, 32KX32, 35ns, Hybrid, CPGA66,

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Objectid	1992262134
package instruction	PGA, PGA66,11X11
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	35 ns
I/O type	COMMON
JESD-30 code	S-XPGA-P66
JESD-609 code	e0
memory density	1048576 bit
Memory IC Type	SRAM MODULE
memory width	32
Number of terminals	66
word count	32768 words
character code	32000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature	-55 °C
organize	32KX32
Output characteristics	3-STATE
Package body material	CERAMIC
encapsulated code	PGA
Encapsulate equivalent code	PGA66,11X11
Package shape	SQUARE
Package form	GRID ARRAY
Parallel/Serial	PARALLEL
power supply	5 V
Certification status	Not Qualified
Maximum standby current	0.004 A
Minimum standby current	2 V
Maximum slew rate	0.45 mA
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	HYBRID
Temperature level	OTHER
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	PIN/PEG
Terminal pitch	2.54 mm
Terminal location	PERPENDICULAR

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