FIFO, 8KX9, 50ns, Asynchronous, CMOS, CDIP28
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Objectid | 1156949884 |
package instruction | DIP, DIP28,.6 |
Reach Compliance Code | not_compliant |
ECCN code | EAR99 |
Maximum access time | 50 ns |
Maximum clock frequency (fCLK) | 15 MHz |
JESD-30 code | R-XDIP-T28 |
JESD-609 code | e0 |
memory density | 73728 bit |
Memory IC Type | OTHER FIFO |
memory width | 9 |
Number of terminals | 28 |
word count | 8192 words |
character code | 8000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
organize | 8KX9 |
Package body material | CERAMIC |
encapsulated code | DIP |
Encapsulate equivalent code | DIP28,.6 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
power supply | 5 V |
Certification status | Not Qualified |
Filter level | MIL-STD-883 Class B (Modified) |
Maximum standby current | 0.048 A |
Maximum slew rate | 0.35 mA |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | MILITARY |
Terminal surface | TIN LEAD |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |